AMD

XCKU3P-1FFVD900I - Kintex UltraScale+ FPGA | AMD

Name: XCKU3P-1FFVD900I - Kintex UltraScale+ FPGA | AMD
Brand: AMD
SKU: XCKU3P-1FFVD900I

MPN： XCKU3P-1FFVD900I ✓ 啟用中

0.85 V Vdss 900-BBGA FCBGA Package -1 Speed 31,641,600 bits Memory

索取報價

MOQ： 1 |

查看資料表 (PDF) 查看替代品

數量

XCKU3P-1FFVD900I 概覽

The AMD XCKU3P-1FFVD900I is a Kintex UltraScale+ field-programmable gate array with 355,950 logic cells, 20,340 configurable logic blocks, 304 input/outputs, and a nominal 0.85 V supply in a 900-BBGA FCBGA package. The -1 designation identifies the device speed grade, while the D900 package and industrial suffix distinguish its mechanical, thermal, and qualification configuration.

A field-programmable gate array is a programmable digital integrated circuit whose configurable logic blocks, interconnects, memory resources, and input/output resources can be tailored after manufacture. The FPGA belongs to the Kintex UltraScale+ product family and sits within the broader semiconductor and programmable-logic hierarchy. This makes it suitable when a design needs substantial parallel processing capacity, flexible interfaces, and a hardware platform that can be revised through downloadable configuration data rather than redesigned as a fixed-function ASIC.

The listed device provides 355,950 logic cells organized into 20,340 configurable logic blocks, with 304 input/outputs available for board-level connections. Its 31,641,600 memory bits support data storage and buffering within the programmable fabric. The 0.85 V nominal core voltage reflects the high-performance architecture of the Kintex UltraScale+ family, while the 900-BBGA FCBGA package provides a large pin and interconnect platform suitable for complex systems.

The XCKU3P device family is intended for applications requiring high logic density and flexible hardware behavior. Relevant uses include data processing, control systems, communications infrastructure, industrial automation, test and measurement equipment, and embedded signal-processing platforms. Its large programmable fabric allows parallel data paths and multiple control functions to be consolidated without developing a custom silicon device.

The principal design consideration is package-level complexity. A 900-BBGA FCBGA requires careful PCB layout, dense escape routing, controlled power delivery, and assembly processes capable of handling fine-pitch balls. Board designers should use the AMD package pinout files and the relevant device documentation to assign every ball, power plane, configuration signal, and high-speed connection correctly.

This page combines the device identification, package information, programmable resource counts, sourcing details, family alternatives, and practical design guidance in one engineering-focused reference. It helps designers distinguish speed-grade, package, and suffix differences before committing to a board layout or production configuration.

直接替換替代品，適用於 XCKU3P-1FFVD900I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。

此系列的變體

與下列產品可直接替換的同系列型號： XCKU3P-1FFVD900I （相同外形與佔位） — 差異在於 Package, Device Type, Block RAM, Speed Grade.

XCKU3P-2FFVD900E

AMD

Package: 900-FCBGA, 31 mm x 31 mm

Device Type: Kintex UltraScale+ Field-Programmable Gate Array

Block RAM: 31,641,600 RAM bits

比較對象 XCKU3P-1FFVD900I →

XCKU3P-2FFVD900I

AMD

Package: 900-FCBGA

Device Type: Kintex UltraScale+ field-programmable gate array

Block RAM: 12,960 Kb

比較對象 XCKU3P-1FFVD900I →

XCKU3P-2FFVD900I

✅ 直接替換 ⚠️ 規格未經驗證

AMD

📦 900-BBGA FCBGA

Kintex UltraScale+ field-programmable gate array · 355,950 cells · 12,960 Kb · 1,368 slices · 304 I/O · -2 · Industrial · -40°C to 100°C

聯絡詢價

查看資料表 →

XCKU3P-1FFVD900E

✅ 直接替換 ⚠️ 規格未經驗證

📦 900-BBGA FCBGA

Same D900 package, -1 speed grade, 0.85 V nominal core voltage, and 355,950 logic cells; only the final E versus I ordering suffix differs

📋 參考替代品（不在目錄中）

XCKU3P-2FFVD900E

✅ 直接替換 ⚠️ 規格未經驗證

AMD

📦 900-BBGA FCBGA

Kintex UltraScale+ Field-Programmable Gate Array · 355,950 logic elements · 20,340 LABs/CLBs · 31,641,600 RAM bits · 304 user I/O · 900-FCBGA, 31 mm x 31 mm · 900 balls · 0.825 V to 0.876 V

聯絡詢價

查看資料表 →

XCKU3P-1FFVD900I 最大額定值與電氣特性

Device Type	Kintex UltraScale+ FPGA
Logic Cells	355,950 cells
Configurable Logic Blocks	20,340 CLBs
Input/Output Count	304 I/Os
Memory Bits	31,641,600 bits
Nominal Core Voltage	0.85 V
Speed Grade	-1
封裝	900-BBGA FCBGA
FPGA Architecture	Kintex UltraScale+
安裝類型	Surface Mount

XCKU3P-1FFVD900I 900-bbga fcbga 腳位配置指南

XCKU3P-1FFVD900I（900-bbga fcbga 封裝）的腳位配置。此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。

無詳細腳位定義資料： XCKU3P-1FFVD900I.

請參閱資料表以查看完整腳位配置。

典型應用

XCKU3P-1FFVD900I 適用於 6 應用s: Communications and Network Equipment, Industrial Automation and Control, Test and Measurement Systems, High-Performance Embedded Processing, Signal Processing and Data Acquisition, Aerospace and Defense Prototyping.

🌐

Communications and Network Equipment

The XCKU3P-1FFVD900I fits communications equipment requiring substantial parallel processing and programmable board-level interfaces. Its 355,950 logic cells and 20,340 configurable logic blocks can implement protocol engines, packet-processing pipelines, test sequences, and control logic in one FPGA. The 304 available I/Os provide connection capacity for external transceivers, memories, and status interfaces. The 900-BBGA FCBGA package supports dense routing, but engineers must treat high-speed links as a board-integrity problem, using the AMD D900 pinout files and device guidance for controlled impedance, power delivery, and clock distribution.

推薦

XCKU3P-2FFVD900I · AMD XCKU3P-1FFVD900E (Same-package suffix alternative for qualification review)

🏭

Industrial Automation and Control

The XCKU3P-1FFVD900I is appropriate for industrial automation systems that combine multiple control paths with flexible logic. Engineers can use the 355,950 available logic cells for sequencing, motion coordination, safety-adjacent monitoring, and machine communication, while the 31,641,600 memory bits support buffering and stateful data processing. Its 304 I/Os enable integration of sensors, actuators, field buses, and diagnostics. The industrial ordering suffix aligns with an industrial product context, although the finished system must still satisfy its specified temperature, environmental, lifecycle, and functional-safety requirements.

推薦

XCKU3P-2FFVD900E · AMD XCKU3P-1FFVD900E (Same-resource option for comparing the final ordering suffix)

🔧

Test and Measurement Systems

The XCKU3P-1FFVD900I can serve as the programmable core of a high-channel-count test and measurement platform. Its large logic population allows parallel acquisition logic, pattern generation, timing control, and digital analysis to share one device instead of relying on separate fixed-function components. The 304 I/Os provide attachment points for test channels, trigger systems, reference interfaces, and capture logic. The 0.85 V nominal core voltage and -1 speed grade require careful timing-budget analysis, while the 900-BBGA package demands a low-defect assembly process and comprehensive board-level validation.

推薦

XCKU3P-2FFVD900I · AMD XCKU3P-1FFVD900E (Same-package suffix alternative for lifecycle planning)

🖥️

High-Performance Embedded Processing

The XCKU3P-1FFVD900I suits embedded systems that need more parallelism and configurability than a fixed microcontroller provides. Designers can implement dedicated accelerators, custom peripherals, real-time data paths, and supervisory logic within the 20,340 configurable logic blocks. The 31,641,600 memory bits provide internal storage for buffering and working data, while the 304 I/Os connect external sensors, converters, and memories. Because this is a large programmable device, software and hardware integration should include a defined configuration boot process, JTAG access strategy, watchdog behavior, and recovery path before field deployment.

推薦

XCKU3P-2FFVD900E · AMD XCKU3P-1FFVD900E (Same-package alternative for configuration planning)

📡

Signal Processing and Data Acquisition

The XCKU3P-1FFVD900I is suitable for parallel signal-processing and data-acquisition designs that benefit from programmable filters, correlation functions, digital conversion, and real-time analysis. Its 355,950 logic cells allow multiple processing lanes to be implemented concurrently, while 31,641,600 memory bits can support sample buffering and intermediate data. The 304 I/Os permit connection to analog front ends, high-speed converters, memory devices, and synchronization interfaces. Timing closure, clock jitter, input thresholds, and external memory interfaces must be evaluated together because nominal core voltage alone does not determine signal-chain performance.

推薦

XCKU3P-2FFVD900I · AMD XCKU3P-2FFVD900E · AMD

✈️

Aerospace and Defense Prototyping

The XCKU3P-1FFVD900I can support advanced prototyping in aerospace, defense, and rugged embedded systems where programmable logic density is valuable. The 355,950 logic cells and 20,340 configurable logic blocks allow mission-specific data paths, navigation processing, signal conditioning, and redundant control functions to be consolidated. The 304 I/Os allow extensive sensor, communication, and memory interconnection, but the 900-BBGA package is mechanically and electrically demanding. Designers must confirm program-specific temperature, radiation, shock, screening, and export requirements rather than inferring ruggedness from the ordering suffix alone.

推薦

XCKU3P-1FFVD900E (Same-package suffix option for program-specific qualification review) XCKU3P-2FFVD900E · AMD

推薦產品摘要

XCKU3P-2FFVD900I AMD 用於： Communications and Network Equipment, Test and Measurement Systems, Signal Processing and Data Acquisition XCKU3P-1FFVD900E Same-package suffix alternative for qualification review 用於： Communications and Network Equipment, Industrial Automation and Control, Test and Measurement Systems, High-Performance Embedded Processing, Aerospace and Defense Prototyping XCKU3P-2FFVD900E AMD 用於： Industrial Automation and Control, High-Performance Embedded Processing, Signal Processing and Data Acquisition, Aerospace and Defense Prototyping

What is the AMD XCKU3P-1FFVD900I?

The AMD XCKU3P-1FFVD900I is a Kintex UltraScale+ FPGA with 355,950 logic cells, 20,340 configurable logic blocks, 304 I/Os, and a nominal 0.85 V core supply. According to AMD product information, the device is supplied in a 900-BBGA FCBGA package. Its programmable fabric combines logic, embedded memory, high-speed connectivity, and configurable I/O for communications, industrial, test, and embedded-processing systems.

What are the key specifications of XCKU3P-1FFVD900I that engineers should know?

The key XCKU3P-1FFVD900I specifications are 355,950 logic cells, 20,340 configurable logic blocks, 304 I/Os, 31,641,600 memory bits, a 0.85 V nominal core voltage, and a 900-BBGA FCBGA package. AMD identifies the device as a Kintex UltraScale+ FPGA. The -1 code denotes the speed grade, so designers should use the AMD device documentation when translating that grade into timing, power, and temperature limits.

Where can I download the XCKU3P-1FFVD900I pinout and package documentation?

Use AMD's UltraScale package pinout resource for the authoritative package assignment and ball information. The resource provides package files in TXT and CSV formats and references UG575 for their format. Before PCB layout, download the package files for the D900 configuration and cross-check every assigned ball against the device documentation. The detailed pin names for the XCKU3P-1FFVD900I are not reproduced on this page.

Where can I download the XCKU3P-1FFVD900I datasheet PDF?

The XCKU3P-1FFVD900I datasheet and supporting documents should be obtained from AMD's official product-document resources. The AMD package-pinout page linked on this page provides the D900 package files and references UG575, while the device datasheet should define electrical limits, configuration, clocking, memory, and I/O characteristics. Always match the PDF revision to the exact XCKU3P-1FFVD900I ordering code.

What does the XCKU3P-1FFVD900I part-number suffix mean?

The XCKU3P portion identifies the Kintex UltraScale+ family, -1 identifies the device speed grade, FFVD900 identifies the device and package configuration, and I identifies the industrial ordering option. The part is listed in a 900-BBGA FCBGA package. Because package, speed grade, and suffix can independently affect qualification or performance, do not substitute a different package code without repeating the complete PCB and thermal review.

Is XCKU3P-1FFVD900I suitable for communications equipment?

Yes, the XCKU3P-1FFVD900I is suitable for communications systems that require high parallel logic capacity and flexible programmable interfaces. Its 355,950 logic cells, 20,340 configurable logic blocks, 31,641,600 memory bits, and 304 I/Os provide substantial implementation capacity. The 900-BBGA package also supports dense board-level connectivity, although signal-integrity and power-delivery design require careful engineering.

Is XCKU3P-1FFVD900I suitable for industrial automation?

The XCKU3P-1FFVD900I is suitable for industrial automation because it combines substantial programmable logic with 304 I/Os in a 900-BBGA FCBGA package. Its -1 speed grade and industrial ordering suffix align it with equipment requiring deterministic programmable control. Final qualification still depends on the operating temperature, voltage, environmental requirements, and lifetime expectations of the completed system.

What is the difference between XCKU3P-1FFVD900I and XCKU3P-2FFVD900I?

Both parts use the D900 900-BBGA package and the same XCKU3P Kintex UltraScale+ resource organization, but they occupy different speed grades. The -2 device has a numeric speed-grade designation 100% higher than the -1 designation, which can improve timing performance but may change power behavior. Verify timing closure and thermal margins against the exact AMD device documentation before treating it as a drop-in replacement.

What is the difference between XCKU3P-1FFVD900I and XCKU3P-1FFVD900E?

The XCKU3P-1FFVD900I and XCKU3P-1FFVD900E retain the same -1 speed grade, 0.85 V nominal core voltage, and 900-BBGA package configuration. Their distinguishing feature is the final ordering suffix: I denotes the industrial option, while E denotes the alternative E suffix offered for that same package and speed grade. Confirm the exact temperature limits and qualification requirements before substitution.

Can XCKU3P-2FFVD900I replace XCKU3P-1FFVD900I?

The XCKU3P-2FFVD900I can be considered for a same-package design because it retains the D900 900-BBGA footprint and the same device family, while moving from the -1 to the -2 speed grade. It is not an unconditional substitute: timing, power, thermal behavior, and qualification must be revalidated. Confirm pin assignment against AMD's D900 package file and complete timing closure with the new speed grade.

When should I choose XCKU3P-1FFVD900I over a higher-speed family variant?

Choose the XCKU3P-1FFVD900I when its -1 timing grade satisfies the design while the application does not justify the power and qualification implications of a faster grade. The device provides 355,950 logic cells and 304 I/Os in the same D900 package used by the identified alternatives. Final selection should compare worst-case timing, junction temperature, power distribution, and production qualification rather than speed-grade numbering alone.

What is the best drop-in replacement for XCKU3P-1FFVD900I?

The closest identified drop-in candidates are the XCKU3P-2FFVD900I, XCKU3P-1FFVD900E, and XCKU3P-2FFVD900E because they retain the D900 900-BBGA footprint and Kintex UltraScale+ resource organization. No cross-manufacturer equivalent with a verified 900-ball pin-compatible footprint was identified. Confirm power sequencing, configuration behavior, temperature grade, timing, and lifecycle requirements before approving any substitution.

Is there an AMD or Xilinx cross-brand equivalent for XCKU3P-1FFVD900I?

No verified cross-brand pin-compatible equivalent is identified for the XCKU3P-1FFVD900I. The 900-BBGA D900 footprint, UltraScale+ configuration pins, power architecture, and programming model make a generic FPGA substitution particularly difficult. A candidate should be accepted only after AMD package files, electrical characteristics, configuration compatibility, and timing have all been compared rather than only matching the FPGA family or logic-cell count.

Where can I buy XCKU3P-1FFVD900I and what is its lead time?

Use the Request a Quote form on this page to ask for XCKU3P-1FFVD900I availability, order quantity, lead time, and current commercial terms. The part is actively listed in current component catalogs, but stock and delivery timing can change for a 900-BBGA FPGA. Provide the required production quantity, date code requirements, and shipment destination when requesting the quotation.

How should power and PCB layout be handled for a 900-BBGA FPGA?

A 900-BBGA FPGA requires controlled power delivery and dense, deterministic routing around the package. Use the AMD D900 package files to assign power, ground, configuration, clock, and I/O balls, then follow the device power-termination and decoupling guidance in the relevant AMD documentation. Validate escape-routing density, layer count, via current capacity, return paths, and assembly capability with the board fabricator before release.

工程參考資料，適用於 XCKU3P-1FFVD900I — 比較、設計指引及合規資訊。

選型指南

Choose the XCKU3P-1FFVD900I when the Kintex UltraScale+ resource level of 355,950 logic cells, 304 I/Os, and 31,641,600 memory bits satisfies the design while the -1 speed grade is sufficient. The same D900 footprint makes XCKU3P-2FFVD900I relevant when additional timing margin is valuable, but the change can alter power and thermal behavior and therefore requires new timing and board validation. Consider XCKU3P-1FFVD900E or XCKU3P-2FFVD900E when the final suffix aligns more closely with a documented qualification option, while confirming temperature and program requirements. No cross-brand equivalent is established for this 900-BBGA device, so board reuse should generally remain within the XCKU3P D900 family and be validated against AMD's package and device documentation.

與替代品比較

參數	本產品	XCKU3P-2FFVD900I	XCKU3P-1FFVD900E	XCKU3P-2FFVD900E
Brand	AMD	AMD	AMD	AMD
Package	900-BBGA FCBGA	900-BBGA FCBGA - same D900 footprint	900-BBGA FCBGA - same D900 footprint	900-BBGA FCBGA - same D900 footprint
Device Family	Kintex UltraScale+	Kintex UltraScale+	Kintex UltraScale+	Kintex UltraScale+
Speed Grade	-1	-2	-1	-2
Logic Cells	355,950 cells	355,950 cells	355,950 cells	355,950 cells
Configurable Logic Blocks	20,340 CLBs	20,340 CLBs	20,340 CLBs	20,340 CLBs
Input/Output Count	304 I/Os	304 I/Os	304 I/Os	304 I/Os
Nominal Core Voltage	0.85 V	0.85 V	0.85 V	0.85 V
Memory Bits	31,641,600 bits	31,641,600 bits	31,641,600 bits	31,641,600 bits
Final Ordering Suffix	I	I	E	E

主要差異化特點

Lower nominal speed grade within the same D900 package (對比XCKU3P-2FFVD900I)
Industrial ordering suffix for the target configuration (對比XCKU3P-1FFVD900E)
Same-package upgrade path without changing the PCB footprint (對比XCKU3P-2FFVD900E)

設計說明

Use AMD's D900 package files as the authority for all 900-ball assignments, including power, ground, configuration, clock, and user I/O. Confirm that the PCB stack-up can escape the fine-pitch ball array without violating clearance or via-current limits. Treat pad, solder-mask, and assembly definitions as a coordinated set, and validate the design with the selected assembly process before fabrication release.

Plan the 0.85 V core rail as a dedicated, low-impedance power distribution network with placement and decoupling based on the AMD device guidance for the exact package. Account for the -1 speed grade's dynamic power and configure sequencing only as directed by the device documentation. Validate steady-state and transient loading across voltage, temperature, and process corners rather than relying on nominal supply voltage alone.

High-speed interface and memory routing must be designed against the selected board stack-up, including impedance targets, insertion loss, crosstalk, return paths, and reference-plane transitions. The D900 package's high pin density leaves limited routing space, so escape routing should be resolved before placement. Run post-layout extraction and verify that power and ground connections do not interrupt the intended signal return path.

Do not approve a family variant solely because it has the same 900-BBGA outline. Compare the complete ordering code, package ball map, speed grade, configuration behavior, temperature option, electrical limits, and programming support. In particular, changing -1 to -2 can alter timing and power behavior, while changing the final suffix can change the intended qualification envelope even when the footprint remains the same.

合規資訊

RoHS

Unknown

REACH

Unknown

AEC-Q100

Unknown

無鉛

Unknown

無鹵

Unknown

衝突礦產

Unknown

No specific environmental, automotive, lead-free, halogen-free, or conflict-minerals declarations were identified. Confirm compliance and qualification requirements with AMD for the exact ordering code.

資料驗證日期： 2026-11-06 — 資料由 XAIPART 元件工程團隊驗證及整理

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