A3P400-FG144 - 55K Logic Cell ProASIC3 Flash FPGA | Microchip
MPN: A3P400-FG144 ✓ সক্রিয়A3P400-FG144 সারাংশ
A field-programmable gate array is a programmable logic device whose digital logic, memory and I/O are defined by a configuration bitstream loaded into on-chip non-volatile flash rather than by a mask set. The ProASIC3 family from Microchip Technology (originally Actel) sits in the low-density segment of the FPGA hierarchy, between simple CPLDs and larger masked-programmable or SRAM-based FPGAs, offering a very low total cost of ownership for control, interface and low-bandwidth signal-processing designs.
Key device features include a flash configuration architecture that removes the need for an external PROM or configuration EEPROM, Live at Power-Up (LAPU) support for Level 0 devices so the logic is active immediately after reset release, and true dual-port SRAM blocks that allow simultaneous read and write access from independent clock domains. The device also offers optional soft ARM support across the ProASIC3 family, a 130 nm flash-based CMOS process with 7-layer metal (6 copper) interconnect, and four independent I/O banks.
The A3P400 is built on a 130 nm flash CMOS process with a 7-layer metal stack, so configuration data is stored on die and the device draws no separate configuration current at run time. Four I/O banks each have dedicated supplies, meaning I/O standards can only be grouped within a bank that shares a compatible voltage, which is a key board-planning constraint. The 144-ball FG144 package measures roughly 17 x 17 mm with a 1.0 mm ball pitch, giving a board footprint in the same class as other 144-pin fine-pitch BGA parts.
Typical applications include industrial control and instrumentation, motor and power conversion sequencers, UART/SPI bridge and protocol converters, sensor aggregation, low-rate signal processing, and consumer or medical equipment requiring a compact, re-programmable single-chip solution with no separate configuration memory.
When planning the board, treat the FG144 ball map as a fine-pitch BGA and confirm escape routing, via-in-pad and solder mask geometry early. Because I/O banks are voltage-partitioned, plan bank assignments before placing connectors, and keep flash programming and JTAG access reachable for field reconfiguration.
This page consolidates device specifications, family-level drop-in alternatives, a parameter-by-parameter comparison and practical board-level design notes, giving engineers the decision context that the family datasheet alone does not provide.
এর জন্য ড্রপ-ইন বিকল্প A3P400-FG144 — একই package, pin-to-pin compatible। ভিন্ন package-এর যেসব পার্টে PCB rework প্রয়োজন সেগুলো বাদ দেওয়া হয়েছে।
এই সিরিজের ভ্যারিয়েন্ট
একই সিরিজের মডেল যেগুলো drop-in compatible A3P400-FG144 (একই form factor এবং footprint) — পার্থক্য রয়েছে Package, Process Technology, Configuration Memory, Core Supply Voltage, Family.
A3P400-1FG144
✅ ড্রপ-ইন📋 রেফারেন্স বিকল্প (ক্যাটালগে নেই)
A3P400-1FGG144
✅ ড্রপ-ইন📋 রেফারেন্স বিকল্প (ক্যাটালগে নেই)
A3P400-FGG144
✅ ড্রপ-ইন📋 রেফারেন্স বিকল্প (ক্যাটালগে নেই)
A3P400-FFGG144
✅ ড্রপ-ইন📋 রেফারেন্স বিকল্প (ক্যাটালগে নেই)
A3P600-FG144
✅ ড্রপ-ইন ⚠️ স্পেক যাচাইকৃত নয়মূল্যের জন্য যোগাযোগ করুন
ডেটাশিট দেখুন →A3P250-FG144T
✅ ড্রপ-ইন ⚠️ স্পেক যাচাইকৃত নয়মূল্যের জন্য যোগাযোগ করুন
ডেটাশিট দেখুন →A3P400-FG144 সর্বোচ্চ রেটিং ও বৈদ্যুতিক বৈশিষ্ট্য
| Device Type | ProASIC3 Flash Field-Programmable Gate Array (FPGA) |
| Logic Cells | 55,296 |
| System Gates | 1 M |
| True Dual-Port SRAM | 144 kbits |
| User I/Os (Device) | 300 |
| User I/Os (FG144 Package) | 97 |
| প্যাকেজ | FG144, 144-ball plastic BGA (FBGA), 17 x 17 mm, 1.0 mm pitch |
| Ball Count | 144 |
| Process Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Configuration Memory | On-chip non-volatile flash, single-chip solution |
| Configuration Method | Flash, reprogrammable (IEEE 1532/JTAG in-system programming) |
| Live at Power-Up | Supported, Level 0 |
| I/O Banks | 4 |
| Embedded Soft ARM Support | Optional in ProASIC3 family |
| মাউন্টিং টাইপ | Surface Mount |
A3P400-FG144 fg144, 144-ball plastic bga (fbga), 17 x 17 mm, 1.0 mm pitch পিন কনফিগারেশন গাইড
A3P400-FG144 (fg144, 144-ball plastic bga (fbga), 17 x 17 mm, 1.0 mm pitch প্যাকেজ)-এর পিন কনফিগারেশন। এই ডিজিটাল IC-তে GPIO, কমিউনিকেশন ইন্টারফেস (UART, SPI, I2C) এবং পাওয়ার পিন রয়েছে। বিকল্প পিন ফাংশন ও কনফিগারেশন অপশনের জন্য প্রস্তুতকারকের ডেটাশিট দেখুন। এমবেডেড সিস্টেম ডিজাইন ও PCB লেআউটের জন্য অপরিহার্য।
এর জন্য বিস্তারিত পিনআউট ডেটা পাওয়া যায়নি A3P400-FG144.
দেখুন ডেটাশিট সম্পূর্ণ পিন কনফিগারেশনের জন্য।
সাধারণ ব্যবহার
A3P400-FG144 এর জন্য উপযুক্ত 6 অ্যাপ্লিকেশনs: Industrial Control and Instrumentation, Protocol Conversion and Interface Bridging, USB Connectivity and Embedded Host Control, Motor Drive Sequencing and Power Control Logic, Sensor Aggregation and Signal Conditioning, Low-Bandwidth Digital Signal Processing.
Industrial Control and Instrumentation
The A3P400-FG144 suits low-complexity plant control, sequencer and data-acquisition front panels where a non-volatile flash configuration matters more than raw logic density. Its 55,296 logic cells and 144 kbits of true dual-port SRAM are ample for timer/counter chains, alarm and interlock logic, and local signal conditioning, while the single-chip architecture removes the external configuration PROM normally required by SRAM-based FPGAs. Because the device provides four I/O banks with dedicated supplies, you can group isolated sensor inputs separately from actuator drivers and keep noisy relay outputs away from sensitive analogue-adjacent digital nets. Live at Power-Up Level 0 support lets the controller begin sequencing immediately after reset release, which shortens machine start-up latency, and the 97 I/O available in the FG144 package simplify connector pinouts for typical 24 V discrete I/O counts.
সুপারিশকৃত
Protocol Conversion and Interface Bridging
The A3P400-FG144 is well matched to protocol converters, UART-to-serial gate or multi-channel shift/frame translators, where deterministic timing and glue logic matter more than wide datapaths. True dual-port SRAM lets a receive engine and a transmit engine exchange data through a shared buffer with independent clocks, which removes arbitration overhead and simplifies a stall-free FIFO structure. At 55,296 logic cells the device can host several independent state machines, a CRC or checksum engine and a command parser in parallel, and the 144 kbits of SRAM provides frame buffers without external memory. Flash-based configuration makes field reconfiguration of deployed converters simple through the programming chain, while the single-chip approach removes the boot PROM and its associated board area. For installations that need galvanic isolation or long industrial cable runs, keep the digital bridge on the A3P400 and place the physical layer on a separate isolated transceiver board.
সুপারিশকৃত
USB Connectivity and Embedded Host Control
The A3P400-FG144 can act as a companion logic engine beside a dedicated USB controller, absorbing enumeration housekeeping, descriptor formatting, packet framing and FIFO arbitration that would otherwise burden a microcontroller. That division of labour works because the 144 kbits of true dual-port SRAM accommodates multi-packet buffering, and 55,296 logic cells are enough to implement full-speed packet framing, PID handling and CRC checking in parallel with the data path. The four independent I/O banks let you isolate the USB-related high-speed I/O from slower peripheral buses, which helps constrain skew and simplify signal-integrity review. Flash configuration means the bridge logic can be updated for new device revisions without swapping the board, and the single-chip architecture keeps the BOM small for cost-sensitive consumer peripherals. Alternatively, place a soft ARM core in the ProASIC3 family device when the design needs a self-contained single-chip USB peripheral without a separate microcontroller.
সুপারিশকৃত
Motor Drive Sequencing and Power Control Logic
The A3P400-FG144 targets sequencer and supervisory logic around inverters, motor starters and power-conversion modules, where deterministic timing and safe state restoration after power cycling are the priority. Flash configuration is the decisive feature here: the sequencing state machine boots to a known safe state directly from on-chip non-volatile memory, so no external supervisor is needed to reload the logic after a brownout. The 144 kbits of SRAM and 55,296 logic cells allow parallel pulse-width generation, dead-time insertion tables, current-limit loops and fault latching in one device, and the 97 package I/O provide enough channels for multiple gate drivers, interlocks and status feedback. Four I/O banks with dedicated supplies let high-current gate-driver outputs sit in a separate voltage domain from low-voltage fault logic, reducing the risk of ground-bounce coupling into sensitive threshold comparisons. Live at Power-Up further shortens the start-up window before the inverter enables its stage.
সুপারিশকৃত
Sensor Aggregation and Signal Conditioning
The A3P400-FG144 is a natural fit for multi-channel sensor aggregation front ends that must combine slow-changing analogue-derived inputs with digital housekeeping. True dual-port SRAM lets each acquisition channel write into a shared memory plane while a separate processing block reads it, giving a clean pipeline between sampling and filtering without complex arbitration logic. With 55,296 logic cells you can host multiple decimation filters, gain-stage control loops, threshold comparators and calibration tables, and the 144 kbits of SRAM accommodates per-channel calibration and history buffers. The four I/O banks make it straightforward to group inputs by voltage level, so 5 V sensor interfaces, 3.3 V logic and open-drain alarm lines can each sit in a compatible bank. Flash-based configuration allows field recalibration logic changes, and the single-chip footprint removes the external configuration memory that would otherwise occupy board area close to sensitive analogue routing.
সুপারিশকৃত
Low-Bandwidth Digital Signal Processing
The A3P400-FG144 supports modest digital signal processing tasks such as digital filters, decimators, correlators, PWM generation and servo-loop assist logic where wide parallel datapaths are not required. Its true dual-port SRAM is the enabling resource: FIR or IIR coefficient storage, delay lines and sample buffers can be written by an acquisition engine and read by a processing engine in the same cycle structure, avoiding the arbitration penalty of single-port memory. At 55,296 logic cells the device can hold several parallel fixed-point filter sections plus a control sequencer, and the 97 I/O in the FG144 package give ample parallel data paths for coefficient loading and result readout. Flash configuration keeps the filter coefficients and control constants in a single non-volatile device and lets them be updated in the field, while a single-chip implementation avoids the extra board area and power of a separate DSP. The A3P400-FG144 is therefore strongest in pipeline-filter and control-assist roles rather than high-throughput FFT or video workloads.
সুপারিশকৃত
সুপারিশকৃত পণ্যের সারসংক্ষেপ
এর জন্য ইঞ্জিনিয়ারিং রেফারেন্স ডেটা A3P400-FG144 — তুলনা, ডিজাইন গাইডেন্স এবং কমপ্লায়েন্স তথ্য।
নির্বাচন গাইড
বিকল্পের সাথে তুলনা
| পারামিটার | এই পণ্য | A3P400-1FG144 | A3P400-1FGG144 | A3P400-FGG144 | A3P400-FFGG144 | A3P600-FG144 | A3P250-FG144 |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | FG144 144-ball plastic BGA, 17 x 17 mm, 1.0 mm pitch | FG144 144-ball plastic BGA - same | FG144 144-ball plastic BGA - same | FG144 144-ball plastic BGA - same | FG144 144-ball plastic BGA - same | FG144 144-ball plastic BGA - same | FG144 144-ball plastic BGA - same |
| Ordering Suffix / Grade | FG144, standard commercial ordering code | FG144 with -1 speed grade | FG144, -1 speed grade, green material | FG144, green material | FG144, green material, commercial temperature grade | FG144, higher-density die | FG144, lower-density die |
| Configuration Memory | On-chip non-volatile flash, single-chip solution | On-chip non-volatile flash | On-chip non-volatile flash | On-chip non-volatile flash | On-chip non-volatile flash | On-chip non-volatile flash | On-chip non-volatile flash |
| Live at Power-Up | Supported, Level 0 | Supported, Level 0 | Supported, Level 0 | Supported, Level 0 | Supported, Level 0 | Supported, Level 0 | Supported, Level 0 |
| Process Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS | 130 nm flash CMOS | 130 nm flash CMOS | 130 nm flash CMOS | 130 nm flash CMOS | 130 nm flash CMOS | 130 nm flash CMOS |
মূল পার্থক্যসমূহ
- Single-chip flash configuration eliminates the external boot PROM (বনামA3P400-1FG144)
- Same FG144 ball map across the whole A3P400 ordering code set (বনামA3P400-FGG144)
- Density headroom within the same footprint (বনামA3P250-FG144)
- 97 package I/O in a 17 x 17 mm body (বনামA3P600-FG144)
ডিজাইন নোট
The FG144 is a fine-pitch BGA with 1.0 mm ball pitch on a 17 x 17 mm footprint, so pad escape and fan-out planning must start before routing. Use a via-in-pad or microvia structure under the device, or a dog-bone fan-out to a 0.5 mm grid, and confirm the assembler's supported BGA pitch and land pattern against the ProASIC3 package information in the manufacturer documentation. Keep the solder mask defined apertures open and follow the recommended pad and via dimensions exactly, since a mismatch here causes open solder joints that are invisible to X-ray inspection on a covered package.
The A3P400 device has four I/O banks, each with its own dedicated supply routed through the corresponding VCCIB pins, so only I/O sharing a compatible voltage standard may be assigned to the same bank. Assign bank boundaries from the pin-description table before placing connectors, then group mixed-voltage peripherals so that no bank carries more than one voltage domain. Also keep the configuration pins and the programming chain away from high-current switching nodes to avoid programming-chain noise margins during in-system reprogramming.
Estimated: with a 1.0 V core rail at 100 mA and a 3.3 V I/O bank at 50 mA, the device consumes roughly 0.1 W plus I/O switching, so core decoupling of 0.1 uF plus 4.7 uF ceramic per supply pin placed within 2 mm of the ball is appropriate. Estimate the total dissipation from the number of simultaneously switching I/O and add margin, because high-fanout outputs driving capacitive loads can dominate the budget. Provide independent filtering per bank supply so noise injected by one bank does not propagate into the core rail.
Two frequent mistakes with this device family are treating the FG144 ball map as identical across different die densities and assuming an FPGA-style external boot PROM is required. Verify that the balls you rely on are actually bonded out in the specific density and package combination, and exploit the on-chip flash configuration instead of adding a PROM. A third pitfall is ignoring Live at Power-Up timing at power-on: Level 0 devices start executing immediately, which is an advantage for sequencing but means reset and brownout behaviour must be modelled in the system safety case.
Design the programming and debug chain so the device can be re-programmed after assembly and in the field: expose the JTAG or programming interface on test points or a connector, keep the chain accessible from the board edge, and confirm the tool chain version supports the selected ProASIC3 device and speed grade. Mixing speed-grade ordering codes across a population (for example the -1 grade and the standard grade on the same board) requires the timing analysis to cover the slower part, so fix one ordering code for production builds.
কমপ্লায়েন্স তথ্য
The green ordering codes such as A3P400-FGG144 and A3P400-1FGG144 denote the RoHS-compliant material configuration of the ProASIC3 family. Automotive-grade qualification status for this specific ordering code is not published; confirm with the manufacturer before use in vehicle applications.
