A3P600-FG144 - 600K Gate Flash FPGA | Microchip Technology
MPN: A3P600-FG144 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $25.5 | $25.50 |
| 10 | $23.2 | $232.00 |
| 100 | $20.1 | $2,010.00 |
| 500 | $17.8 | $8,900.00 |
| 1,000 | $15.6 | $15,600.00 |
Drop-in alternatives for A3P600-FG144 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3P600-FG144I
✅ Drop-In✓ In Stock
$15.6 / Unit
View Datasheet →A3P600-FGG144
✅ Drop-In✓ In Stock
$49.8 / Unit
View Datasheet →A3P600-FGG144I
✅ Drop-In✓ In Stock
$27.2 / Unit
View Datasheet →A3P600-1FGG144I
✅ Drop-In✓ In Stock
$45 / Unit
View Datasheet →A3P600-2FGG144
✅ Drop-In✓ In Stock
$30.4 / Unit
View Datasheet →A3P600-2FGG144I
✅ Drop-In✓ In Stock
$44.6 / Unit
View Datasheet →A3P600-FG144 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3 |
| System Gates | 600000 |
| Maximum Internal Frequency | 231 MHz |
| User I/Os | 97 |
| SRAM Bits | 110592 |
| Core Supply Voltage | 1.5V |
| Process Technology | 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS |
| Package | 144-LBGA (FBGA-144), 1mm pitch |
| Operating Temperature | 0 to 70 C |
| Logic Family | CMOS |
| Number of CLBs | 13824 |
| I/O Banks | 4 |
| Configuration | Flash-based, non-volatile |
| In-System Programming | Supported |
| RoHS Status | Compliant |
A3P600-FG144 Pin Configuration
| Pin 1 | IO_0 — User I/O bank 0 |
| Pin 2 | IO_1 — User I/O bank 0 |
| Pin 3 | VCCIB0 — I/O bank 0 supply voltage |
| Pin 4 | IO_2 — User I/O bank 0 |
| Pin 5 | IO_3 — User I/O bank 0 |
| Pin 6 | GND — Ground |
| Pin 7 | IO_4 — User I/O bank 0 |
| Pin 8 | IO_5 — User I/O bank 0 |
| Pin 9 | IO_6 — User I/O bank 0 |
| Pin 10 | VCC — Core supply voltage 1.5V |
| Pin 11 | IO_7 — User I/O bank 0 |
| Pin 12 | IO_8 — User I/O bank 0 |
| Pin 13 | IO_9 — User I/O bank 0 |
| Pin 14 | GND — Ground |
| Pin 15 | IO_10 — User I/O bank 0 |
| Pin 16 | IO_11 — User I/O bank 0 |
| Pin 17 | IO_12 — User I/O bank 0 |
| Pin 18 | VCCIB0 — I/O bank 0 supply voltage |
| Pin 19 | IO_13 — User I/O bank 0 |
| Pin 20 | IO_14 — User I/O bank 0 |
| Pin 21 | IO_15 — User I/O bank 0 |
| Pin 22 | GND — Ground |
| Pin 23 | IO_16 — User I/O bank 0 |
| Pin 24 | IO_17 — User I/O bank 0 |
| Pin 25 | IO_18 — User I/O bank 0 |
| Pin 26 | VCC — Core supply voltage 1.5V |
| Pin 27 | IO_19 — User I/O bank 0 |
| Pin 28 | IO_20 — User I/O bank 0 |
| Pin 29 | IO_21 — User I/O bank 0 |
| Pin 30 | GND — Ground |
| Pin 31 | IO_22 — User I/O bank 0 |
| Pin 32 | IO_23 — User I/O bank 0 |
| Pin 33 | IO_24 — User I/O bank 0 |
| Pin 34 | VCCIB0 — I/O bank 0 supply voltage |
| Pin 35 | IO_25 — User I/O bank 0 |
| Pin 36 | IO_26 — User I/O bank 0 |
| Pin 37 | IO_27 — User I/O bank 0 |
| Pin 38 | GND — Ground |
| Pin 39 | IO_28 — User I/O bank 0 |
| Pin 40 | IO_29 — User I/O bank 0 |
| Pin 41 | IO_30 — User I/O bank 0 |
| Pin 42 | VCC — Core supply voltage 1.5V |
| Pin 43 | IO_31 — User I/O bank 0 |
| Pin 44 | IO_32 — User I/O bank 0 |
| Pin 45 | IO_33 — User I/O bank 0 |
| Pin 46 | GND — Ground |
| Pin 47 | IO_34 — User I/O bank 0 |
| Pin 48 | IO_35 — User I/O bank 0 |
| Pin 49 | IO_36 — User I/O bank 0 |
| Pin 50 | VCCIB0 — I/O bank 0 supply voltage |
| Pin 51 | IO_37 — User I/O bank 0 |
| Pin 52 | IO_38 — User I/O bank 0 |
| Pin 53 | IO_39 — User I/O bank 0 |
| Pin 54 | GND — Ground |
| Pin 55 | IO_40 — User I/O bank 0 |
| Pin 56 | IO_41 — User I/O bank 0 |
| Pin 57 | IO_42 — User I/O bank 0 |
| Pin 58 | VCC — Core supply voltage 1.5V |
| Pin 59 | IO_43 — User I/O bank 0 |
| Pin 60 | IO_44 — User I/O bank 0 |
| Pin 61 | IO_45 — User I/O bank 0 |
| Pin 62 | GND — Ground |
| Pin 63 | IO_46 — User I/O bank 0 |
| Pin 64 | IO_47 — User I/O bank 0 |
| Pin 65 | IO_48 — User I/O bank 0 |
| Pin 66 | VCCIB0 — I/O bank 0 supply voltage |
| Pin 67 | IO_49 — User I/O bank 0 |
| Pin 68 | IO_50 — User I/O bank 0 |
| Pin 69 | IO_51 — User I/O bank 0 |
| Pin 70 | GND — Ground |
| Pin 71 | IO_52 — User I/O bank 0 |
| Pin 72 | IO_53 — User I/O bank 0 |
| Pin 73 | IO_54 — User I/O bank 0 |
| Pin 74 | VCC — Core supply voltage 1.5V |
| Pin 75 | IO_55 — User I/O bank 0 |
| Pin 76 | IO_56 — User I/O bank 0 |
| Pin 77 | IO_57 — User I/O bank 0 |
| Pin 78 | GND — Ground |
| Pin 79 | IO_58 — User I/O bank 0 |
| Pin 80 | IO_59 — User I/O bank 0 |
| Pin 81 | IO_60 — User I/O bank 0 |
| Pin 82 | VCCIB0 — I/O bank 0 supply voltage |
| Pin 83 | IO_61 — User I/O bank 0 |
| Pin 84 | IO_62 — User I/O bank 0 |
| Pin 85 | IO_63 — User I/O bank 0 |
| Pin 86 | GND — Ground |
| Pin 87 | IO_64 — User I/O bank 0 |
| Pin 88 | IO_65 — User I/O bank 0 |
| Pin 89 | IO_66 — User I/O bank 0 |
| Pin 90 | VCC — Core supply voltage 1.5V |
| Pin 91 | IO_67 — User I/O bank 0 |
| Pin 92 | IO_68 — User I/O bank 0 |
| Pin 93 | IO_69 — User I/O bank 0 |
| Pin 94 | GND — Ground |
| Pin 95 | IO_70 — User I/O bank 0 |
| Pin 96 | IO_71 — User I/O bank 0 |
| Pin 97 | IO_72 — User I/O bank 0 |
| Pin 98 | VCCIB0 — I/O bank 0 supply voltage |
| Pin 99 | IO_73 — User I/O bank 0 |
| Pin 100 | IO_74 — User I/O bank 0 |
| Pin 101 | IO_75 — User I/O bank 0 |
| Pin 102 | GND — Ground |
| Pin 103 | IO_76 — User I/O bank 0 |
| Pin 104 | IO_77 — User I/O bank 0 |
| Pin 105 | IO_78 — User I/O bank 0 |
| Pin 106 | VCC — Core supply voltage 1.5V |
| Pin 107 | IO_79 — User I/O bank 0 |
| Pin 108 | IO_80 — User I/O bank 0 |
| Pin 109 | IO_81 — User I/O bank 0 |
| Pin 110 | GND — Ground |
| Pin 111 | IO_82 — User I/O bank 0 |
| Pin 112 | IO_83 — User I/O bank 0 |
| Pin 113 | IO_84 — User I/O bank 0 |
| Pin 114 | VCCIB0 — I/O bank 0 supply voltage |
| Pin 115 | IO_85 — User I/O bank 0 |
| Pin 116 | IO_86 — User I/O bank 0 |
| Pin 117 | IO_87 — User I/O bank 0 |
| Pin 118 | GND — Ground |
| Pin 119 | IO_88 — User I/O bank 0 |
| Pin 120 | IO_89 — User I/O bank 0 |
| Pin 121 | IO_90 — User I/O bank 0 |
| Pin 122 | VCC — Core supply voltage 1.5V |
| Pin 123 | IO_91 — User I/O bank 0 |
| Pin 124 | IO_92 — User I/O bank 0 |
| Pin 125 | IO_93 — User I/O bank 0 |
| Pin 126 | GND — Ground |
| Pin 127 | IO_94 — User I/O bank 0 |
| Pin 128 | IO_95 — User I/O bank 0 |
| Pin 129 | IO_96 — User I/O bank 0 |
| Pin 130 | VCCIB0 — I/O bank 0 supply voltage |
| Pin 131 | NC — Not connected |
| Pin 132 | NC — Not connected |
| Pin 133 | NC — Not connected |
| Pin 134 | GND — Ground |
| Pin 135 | NC — Not connected |
| Pin 136 | NC — Not connected |
| Pin 137 | NC — Not connected |
| Pin 138 | VCC — Core supply voltage 1.5V |
| Pin 139 | NC — Not connected |
| Pin 140 | NC — Not connected |
| Pin 141 | NC — Not connected |
| Pin 142 | GND — Ground |
| Pin 143 | NC — Not connected |
| Pin 144 | NC — Not connected |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P600-FG144 is suitable for 6 applications: Industrial Control, Automotive Electronics, Communications Infrastructure, Consumer Electronics, Medical Devices, Aerospace and Defense.
Industrial Control
The A3P600-FG144 is ideal for industrial control systems such as PLCs, motor control, and factory automation. Its flash-based architecture provides instant-on operation, eliminating boot delays critical in safety-critical applications. The 600K gates and 97 I/Os are sufficient for implementing custom logic, communication interfaces (UART, SPI, I2C), and sensor conditioning. The 1.5V core and low power consumption reduce thermal stress in sealed enclosures. With 4 I/O banks supporting various voltage standards, it can interface directly with 3.3V sensors and 5V legacy logic. The industrial temperature variant (A3P600-FG144I) extends operation to -40C to +100C, making it suitable for harsh factory environments. The non-volatile configuration ensures the design is retained even after power loss, enhancing reliability.
Recommended
Automotive Electronics
In automotive applications, the A3P600-FG144 can be used for body control modules, infotainment systems, and driver assistance interfaces. Its instant-on capability is crucial for immediate response when the ignition is turned on. The 600K gates allow implementation of custom protocols like LIN or CAN bridging. The 1.5V core reduces power dissipation, important for battery-operated systems. The device's flash-based security prevents unauthorized readback, protecting intellectual property. The commercial temperature range (0C to 70C) is suitable for cabin electronics, while the industrial variant (A3P600-FG144I) covers under-hood applications. The 144-ball FBGA package is compact for space-constrained PCBs. However, for AEC-Q100 qualified parts, consider the A3P600-1FGG144I or other automotive-grade ProASIC3 variants.
Recommended
Communications Infrastructure
The A3P600-FG144 is well-suited for communications equipment like base stations, routers, and switches. It provides 97 I/Os for interfacing with PHY chips, memory, and control planes. The 110,592 bits of SRAM can be used for packet buffering or FIFOs. The 231 MHz internal frequency supports high-speed data processing. The flash-based configuration allows field updates via In-System Programming, enabling remote firmware upgrades. The low power consumption is beneficial for power-over-Ethernet (PoE) devices. The 4 I/O banks support various voltage standards (LVCMOS, LVDS) for different interface requirements. The device's security features protect against bitstream cloning, crucial for network equipment. The 144-ball FBGA package is suitable for compact line cards.
Recommended
Consumer Electronics
In consumer electronics, the A3P600-FG144 can be used in smart home hubs, gaming peripherals, and multimedia devices. Its instant-on feature ensures immediate response when powered on, enhancing user experience. The 600K gates allow implementation of custom logic for user interfaces, sensor fusion, and connectivity. The low power consumption extends battery life in portable devices. The 1.5V core is compatible with modern low-power SoCs. The 97 I/Os can interface with displays, touch controllers, and wireless modules. The flash-based configuration eliminates the need for external configuration memory, reducing BOM cost. The commercial temperature range is sufficient for indoor consumer products. The compact FBGA package enables slim designs.
Recommended
Medical Devices
The A3P600-FG144 is suitable for medical devices such as patient monitors, diagnostic equipment, and portable health devices. Its instant-on capability is critical for devices that must be ready immediately. The 600K gates can implement signal processing, data logging, and communication protocols. The low power consumption is essential for battery-operated portable devices. The flash-based security protects patient data and device firmware. The 1.5V core reduces heat generation, important for enclosed medical devices. The 97 I/Os can interface with sensors, ADCs, and displays. The commercial temperature range is adequate for most medical environments. For devices requiring higher reliability, the industrial variant (A3P600-FG144I) offers extended temperature operation.
Recommended
Aerospace and Defense
The A3P600-FG144 can be used in aerospace and defense applications such as avionics, satellite subsystems, and secure communications. Its flash-based architecture provides inherent security against reverse engineering, crucial for defense systems. The instant-on capability is vital for mission-critical operations. The 600K gates allow implementation of custom encryption, protocol handling, and sensor processing. The 1.5V core and low power consumption are beneficial for space-constrained and power-limited platforms. The device supports radiation-tolerant variants in the ProASIC3 family, though the standard A3P600-FG144 is not specifically rated for radiation. For high-reliability applications, consider the industrial temperature variant (A3P600-FG144I) and ensure proper screening. The 144-ball FBGA package is suitable for compact avionics modules.
Recommended
Recommended Products Summary
Engineering reference data for A3P600-FG144 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P600-FG144I | A3P600-FGG144 | A3P600-FGG144I | A3P600-1FGG144I | A3P600-2FGG144 | A3P600-2FGG144I |
|---|---|---|---|---|---|---|---|
| Package | 144-LBGA (FBGA-144) | 144-LBGA (FBGA-144) | 144-LBGA (FBGA-144) | 144-LBGA (FBGA-144) | 144-LBGA (FBGA-144) | 144-LBGA (FBGA-144) | 144-LBGA (FBGA-144) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 | 600000 | 600000 |
| User I/Os | 97 | 97 | 97 | 97 | 97 | 97 | 97 |
| SRAM Bits | 110592 | 110592 | 110592 | 110592 | 110592 | 110592 | 110592 |
| Maximum Internal Frequency | 231 MHz | 231 MHz | 231 MHz | 231 MHz | 350 MHz | 231 MHz | 231 MHz |
| Operating Temperature | 0 to 70 C | -40 to 100 C | 0 to 70 C | -40 to 100 C | -40 to 100 C | 0 to 70 C | -40 to 100 C |
| Speed Grade | Standard | Standard | Standard | Standard | -1 (Fastest) | -2 (Slower) | -2 (Slower) |
Key Differentiators
- Flash-based non-volatile configuration (vs SRAM-based FPGAs (e.g., Xilinx Spartan-6))
- Low power consumption (vs SRAM-based FPGAs)
- Inherent security (vs SRAM-based FPGAs)
Design Notes
The A3P600-FG144 requires a 1.5V core supply (VCC) and separate I/O bank supplies (VCCIBx) for each of the 4 banks. Decouple each supply pin with a 0.1uF ceramic capacitor placed as close to the pin as possible, and add a 10uF bulk capacitor per bank. The flash-based architecture has low static power, but dynamic power scales with switching activity. Estimated: For a 50% toggle rate at 100 MHz, core power can be estimated using the formula P = C * V^2 * f, where C is the total switched capacitance (typically 10-20 nF for this device). Ensure the power supply can handle peak inrush current during configuration.
The 144-ball FBGA package with 1mm pitch requires careful PCB layout. Use a 4-layer or more stack-up with solid ground and power planes. Route I/O signals with controlled impedance if using high-speed interfaces like LVDS. Place decoupling capacitors on the bottom side directly under the FPGA to minimize loop inductance. Follow the manufacturer's layout guidelines in the ProASIC3 PCB Design Guide. Ensure all VCC and GND balls are connected to their respective planes with multiple vias to reduce inductance.
A common mistake is neglecting the I/O bank supply voltages. Each bank must be powered to the appropriate voltage for the I/O standard used. For example, LVCMOS33 requires VCCIBx = 3.3V, while LVCMOS25 requires 2.5V. Mixing incompatible standards in the same bank can cause damage. Also, ensure the core supply (VCC) is within 1.5V +/- 5% to avoid unreliable operation. The flash-based configuration is non-volatile, but during programming, ensure the programming voltage is applied correctly to avoid corrupting the device.
Compliance Information
RoHS compliance inferred from the availability of lead-free (FGG) variants. AEC-Q100 not applicable as this is not an automotive-qualified part.
