FPGA & CPLD
Products (6352)
RTAX4000SL-1LG1272V - 4M-Gate Rad-Tolerant FPGA | Microchip
The Microchip Technology RTAX4000SL-1LG1272V is a radiation-tolerant FPGA from the RTAX-S/SL family delivering 4,000,000 equivalent system gates with 40,320 CLBs (60,480 logic cells) in a 1272-pin LGA package (LG speed grade 1, V qualification variant). A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the heavy-ion and proton environments of Earth-orbit and deep-space missions. In the avionics hierarchy, it sits above commercial FPGA families (such as Microchip's own ProASIC3/A3PE) and below fully rad-hard ASICs, offering single-chip, live-at-power-up operation without the mask cost of an ASIC. Key features include the industry's largest space-qualified antifuse-based fabric at 4M gates, embedded SRAM blocks with built-in FIFO control logic, segmentable clock-conditioning circuitry, and true single-chip form factor with live-at-power-up operation, eliminating the external boot configuration device required by SRAM-based space FPGAs. Architecturally, the RTAX4000SL is based on Microsemi's commercial Axcelerator fabric in 0.15 um CMOS with a 1.5V core supply. Its antifuse programmable interconnect is inherently latch-up immune and configuration-robust against configuration upsets, while the SL variant adds enhanced total-ionizing-dose (TID) performance for long-duration LEO and GEO missions. Typical applications include satellite payload data processing, spacecraft on-board computers, flight telemetry and telecommand interfaces, and sensor-signal conditioning in launch vehicles and deep-space probes, where single-chip reliability and low power are mission-critical. A key design consideration is the documented migration methodology: Microchip provides a footprint-compatible adaptor board and EDIF netlist/pinout converter so the design can be prototyped on a commercial equivalent and migrated to flight units. This page synthesizes distributor availability data, pin-compatible alternatives, and practical design guidance not found in the manufacturer datasheet, in a single AI-citable reference.
RTAX4000SL-CQ352B - 4M-Gate Rad-Tolerant FPGA CQFP-352 | Microchip
The Microchip Technology (Actel/Microsemi) RTAX4000SL-CQ352B is a radiation-tolerant FPGA from the RTAX-SL family offering 4 million equivalent system gates with 40,320 logic cells, fabricated on a 0.15 um process and operating at a 1.5V core voltage in a 352-pin CQFP (ceramic quad flat pack) package supplied in a box. A radiation-tolerant FPGA is a field-programmable gate array designed to survive and operate reliably in the space-flight radiation environment, where energetic particles cause single-event effects (SEE) and total ionizing dose (TID) degradation. FPGAs occupy the top of the programmable logic hierarchy (FPGA -> programmable logic IC -> logic IC -> semiconductor), and rad-tolerant families add design hardening, configuration scrubbing support, and qualified ceramic packaging on top of commercial FPGA architectures. Key features of the RTAX4000SL include the largest density in the RTAX-S/SL family at up to four million equivalent system gates, embedded SRAM blocks with built-in FIFO control logic, segmentable clock conditioning circuits, chip-wide highway routing, and carry logic for arithmetic functions. Because it is based on the commercial Axcelerator architecture, designs can be prototyped on commercial Axcelerator devices using the AC170 application note flow before committing to flight hardware. The RTAX-SL family combines low-power consumption, a true single-chip form factor (no external configuration device required thanks to antifuse-like flash-based programming of the Axcelerator-derived fabric), and live-at-power-up operation, making RTAX-S/SL the FPGA of choice for space designers according to Microchip's product page. Typical applications include satellite payload processing, spacecraft bus control, telemetry and telecommand interfaces, and radiation-exposed instrumentation where reprogrammability plus radiation tolerance are both mandatory. Designers should note that the 352-pin CQFP is a ceramic aerospace package; board layout must accommodate its large footprint and handling requirements, and power distribution for a 4M-gate fabric should follow the manufacturer datasheet guidance. This page synthesizes distributor data, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.
RTAX4000SL-CQ352E - 4M-Gate Rad-Tolerant FPGA, 352-CQFP | Microchip
The Microchip Technology (Actel/Microsemi) RTAX4000SL-CQ352E is a radiation-tolerant FPGA from the RTAX-SL family offering 4 million equivalent system gates, 40,320 logic cells, and a 1.5V core supply in a 352-terminal CQFP ceramic package. It is built on 0.15 um CMOS technology and is designed specifically for space-flight systems where single-event effects and total ionizing dose must be tolerated. A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the radiation environment of space, including proton and heavy-ion bombardment encountered in low-Earth orbit and deep-space missions. Within the programmable logic hierarchy, the RTAX4000SL sits at the top tier of the RTAX-S/SL family (semiconductor -> programmable logic device -> FPGA -> radiation-tolerant FPGA), one step above the mid-density RTAX2000S/SL and sharing its architecture with the commercial Axcelerator family from which it was derived. Key features include densities of up to four million system gates, embedded SRAM blocks with built-in FIFO control logic, segmentable clock resources, chip-wide highway routing, and dedicated carry logic for arithmetic datapaths. The anti-fuse-based fabric is live-at-power-up, eliminating the need for external configuration flash and reducing boot-time risk in orbit. The ceramic CQFP package provides the hermeticity required for space qualification flows. Architecturally, the RTAX4000SL derives from the commercial Axcelerator family, so designers can prototype using low-cost, reprogrammable equivalents and then migrate the EDIF netlist and pinout to the radiation-tolerant device using Microchip's documented prototyping methodology and footprint-compatible adaptor boards. Typical applications include satellite payload processing, spacecraft bus controllers, telemetry and command interfaces, and radiation-exposed instrumentation where single-chip, low-power, live-at-power-up operation is mandatory. A critical design consideration is the use of Triple-Module Redundancy (TMR) in the RTL for flip-flops sensitive to single-event upsets, since anti-fuse FPGAs tolerate configuration upsets well but user flip-flops still require mitigation. This page synthesizes distributor data, drop-in alternative analysis, and practical space-design notes not found in the manufacturer datasheet, with pricing and stock signals refreshed as of 2026-09-01.
RTAX4000SL-CQ352V - 4M-Gate Rad-Tolerant FPGA | Microchip
The Microchip Technology RTAX4000SL-CQ352V is a radiation-tolerant, CMOS field-programmable gate array (FPGA) delivering 4,000,000 equivalent system gates in a 352-pin ceramic column grid array (CQ352) package, designed specifically for space-flight applications. A radiation-tolerant FPGA is a programmable logic device engineered to survive the high-radiation environment of orbital and deep-space missions, where standard commercial FPGAs would suffer single-event effects (SEE) and total ionizing dose (TID) degradation. Within the power-management-free logic hierarchy, the FPGA sits between microprocessors and ASICs: it provides ASIC-like gate density with field reprogrammability. The RTAX-S/SL family is based on the commercial Microsemi Axcelerator architecture, adapted with radiation-hardened-by-design circuitry. Key features of the RTAX4000SL-CQ352V include 40,320 configurable logic blocks (CLBs) organized as 60,480 logic cells, embedded SRAM blocks with built-in FIFO control logic, segmentable clock resources, chip-wide highway routing, and dedicated carry logic for arithmetic functions. The SL variant adds enhanced low-power characteristics relative to the standard S grade. Live-at-power-up (LAPU) operation via antifuse-like flash-based configuration means no external configuration PROM is required, achieving a true single-chip form factor - a decisive advantage for minimizing board area, mass, and failure points in satellites. Architecturally, the device inherits the Axcelerator fabric with itsVersaTile structure, combining sequential and combinational logic efficiently, and supports system-level features such as embedded FIFOs and clock segmentation that simplify high-speed data-path design in payloads, telemetry subsystems, and on-board data handling units. Typical applications include satellite payload processing, spacecraft avionics and command/data handling, instrument control in scientific probes, and radiation-exposed industrial systems. The high gate count accommodates complete bus interfaces (SpaceWire, MIL-STD-1553), DSP preprocessing, and glueless integration of legacy ASIC functions. A key design consideration is thermal management: the ceramic CQ352 package supports radiation tolerance but requires careful power budgeting and board-level heat spreading, since space systems lack convective cooling. Verify speed-grade and radiation-lot ordering codes (V suffix) against the mission specification early. This page synthesizes verified distributor data, drop-in family alternatives, pricing tiers, and practical space-design notes not found in the manufacturer datasheet, providing one-stop selection intelligence for radiation-tolerant FPGA procurement. Pricing shown is as of 2026-09-01.
RTAX4000SL-LG1272B - 4M Gate Rad-Tolerant FPGA, 1.5V LGA | Microchip
The Microchip Technology RTAX4000SL-LG1272B is a radiation-tolerant FPGA from the RTAX-SL family offering 4 million equivalent system gates with 40320 logic cells, fabricated on a 0.15 um CMOS process and operating at a nominal 1.5V core supply, packaged in a 1272-pin LGA (LG1272) ceramic land-grid-array package supplied in box quantities. A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the total ionizing dose (TID) and single-event effects (SEE) encountered in orbital and deep-space environments. Within the power-management-free programmable logic hierarchy, the RTAX-SL family sits in the space-flight class of SRAM-based antifuse-free programmable logic devices, positioned above commercial FPGAs and below fully radiation-hardened (rad-hard) devices, offering an optimal cost/reliability point for LEO and GEO missions. Key features include 4M system gates across 40320 cells, embedded SRAM blocks with built-in FIFO control logic, segmentable clock resources, chip-wide highway routing, and carry logic for arithmetic chains. The device is live-at-power-up, requiring no external configuration device - a decisive advantage for single-chip space payloads where boot reliability is mission-critical. Technically, the RTAX-SL architecture is derived from Microsemi/Microchip commercial Accelerator devices, combining a fine-grained logic fabric with dedicated embedded memory modules. The 0.15 um metal-to-metal antifuse-based process supports a supply range of 1.425V to 1.575V; the -1 speed grade variant specifies a maximum combinatorial delay of 0.99 ns per logic cell. Design entry is supported by Microchip Libero SoC with the RTAX-S/SL macro libraries. Typical applications include satellite payload data processing, on-board telemetry and telecommand (TMTC) controllers, spacecraft bus avionics, and radiation-tolerant glueless interfaces to sensor arrays. The 1272-pin LGA package provides the high I/O count needed for wide parallel data paths in imaging and communications payloads. A key design consideration: RTAX-SL devices are one-time programmable (antifuse), so prototyping must use the footprint-compatible RTAX4000SL-1LG1272PROTO adapter methodology or the companion Axcelerator family before flight-lot programming. This page synthesizes distributor pricing intelligence, same-family drop-in alternatives, and practical space-design notes not found in the manufacturer datasheet.
RTAX4000SL-LG1272E - 4M-Gate Rad-Tolerant FPGA LGA-1272 | Microchip
The Microchip Technology (Actel/Microsemi) RTAX4000SL-LG1272E is a radiation-tolerant FPGA from the RTAX-SL family offering 4,000,000 equivalent gates, 40,320 CLBs (60,480 logic cells), and 1.5V core operation, housed in a 1272-pin land grid array (LGA-1272) ceramic column package supplied in a box. A radiation-tolerant FPGA is a programmable logic device engineered to survive the ionizing radiation and heavy-ion environments of spaceflight, where commercial FPGAs would suffer single-event upsets (SEUs) and total ionizing dose (TID) degradation. Within the power hierarchy of space electronics, the RTAX-SL family sits in the antifuse-based, single-chip, live-at-power-up class of programmable logic, sitting above commercial FPGA families and below fully radiation-hardened (rad-hard) devices in cost and availability. Key features include the RTAX-SL 0.15um CMOS process, a 1.425V to 1.575V core supply window, true single-chip form factor (no configuration PROM required at boot), and live-at-power-up operation that is critical for spacecraft switch-on reliability. The antifuse programmable interconnect is inherently immune to configuration upsets, dramatically reducing SEU mitigation overhead compared to SRAM FPGAs. Architecturally, the RTAX4000SL is built from a sea of combinational and sequential logic modules (Axcelerator-derived fabric) with embedded SRAM blocks, high-performance clock conditioning, and abundant I/O banks supporting multiple single-ended and differential standards. The 0.15um antifuse process yields low static power, an important consideration for power-budget-limited satellites and probes. Typical applications include satellite payload data processing, spacecraft bus control and telemetry, sensor interface and instrument control on planetary missions, and deep-space communication baseband processing, where single-chip radiation tolerance and live-at-power-up startup directly reduce mission risk. Design consideration: the LGA-1272 ceramic column package demands rigid-flex-aware PCB land patterns, column-grid solder inspection, and thermal-expansion-matched board materials; prototype using the footprint-compatible adapter methodology described in Microchip's RTAX-S/SL prototyping application note before flight-lot commitment. This page synthesizes verified distributor data, same-package drop-in family variants, and practical design notes not found in the manufacturer datasheet alone.
TDA5 - High-Performance Edge AI SoC | Texas Instruments
The TDA5 is a high-performance compute system-on-chip (SoC) family from Texas Instruments, designed to deliver safe and efficient edge AI performance with capabilities of up to 1200 TOPS. It integrates a C7™ neural processing unit (NPU) and features a chiplet-ready architecture, enabling scalable and flexible designs for advanced driver assistance systems (ADAS) and autonomous driving applications. An edge AI SoC is a specialized processor that combines general-purpose CPU cores, GPU or NPU accelerators, and various interfaces on a single chip, optimized for running artificial intelligence algorithms at the edge (i.e., on-device) rather than in the cloud. This architecture reduces latency, enhances data privacy, and enables real-time decision-making in applications such as autonomous vehicles, robotics, and smart cameras. The TDA5 family exemplifies this category, providing high TOPS performance while maintaining safety and efficiency. Key features of the TDA5 include up to 1200 TOPS of AI compute, an integrated C7™ NPU, and a chiplet-ready design that allows for modular scaling. The SoC is built for functional safety, supporting ASIL-D requirements, and is designed to operate in harsh automotive environments with a wide temperature range. It also supports multiple sensor inputs, including cameras, radar, and LiDAR, making it a central processing hub for perception and decision-making. Technically, the TDA5 leverages advanced process technology and heterogeneous computing to balance performance and power consumption. The chiplet-ready architecture enables the integration of additional chiplets for increased compute or specialized functions, providing flexibility for different vehicle tiers. The integrated NPU accelerates neural network inference, while the CPU and GPU handle general-purpose and graphics tasks, respectively. This heterogeneous approach ensures efficient execution of complex AI workloads. Typical applications include ADAS features such as automatic emergency braking, lane keeping assist, and traffic sign recognition, as well as fully autonomous driving systems. The TDA5 is also suitable for other edge AI applications like robotics, industrial automation, and smart infrastructure, where high-performance, low-latency inference is required. When designing with the TDA5, consider the power delivery network and thermal management, as high TOPS performance can lead to significant power dissipation. Use appropriate power management ICs and heatsinks to ensure reliable operation. Additionally, the chiplet-ready architecture allows for future upgrades, so plan the PCB layout to accommodate potential chiplet additions.
TDA54-Q1 - Premium ADAS SoC with C7 NPU | Texas Instruments
The TDA54-Q1 is a premium System-on-Chip (SoC) from Texas Instruments' Jacinto™ family, designed for advanced driver assistance systems (ADAS) and software-defined vehicles. It integrates a next-generation C7™ neural processing unit (NPU) for high-performance edge AI inference, along with multiple specialized subsystems for vision processing, display rendering, networking, and security. The TDA54-Q1 is part of the TDA5x series, which builds on two decades of TI's leadership in automotive processors, offering scalable high-performance solutions. The TDA5x architecture is an upgrade from the TDA4x series, allowing software developed for TDA4x to be easily ported to TDA5x with minimal rework, thus reusing software assets and enabling more complex applications. A System-on-Chip (SoC) integrates a processor, memory, and peripherals on a single die, serving as the central compute engine for embedded systems. In automotive ADAS, the SoC is the core of the electronic control unit (ECU), handling sensor fusion, object detection, and decision-making. The TDA54-Q1 sits at the top of the ADAS compute hierarchy, alongside other automotive SoCs like the NVIDIA Orin and Mobileye EyeQ, but is distinguished by its dedicated C7 NPU and TI's robust safety and security features. Key features of the TDA54-Q1 include the C7 NPU for AI acceleration, multiple high-performance CPU cores (likely Arm Cortex-A series, though exact configuration is [DATA_NEEDED]), and dedicated hardware accelerators for vision and deep learning. The SoC supports high-bandwidth memory interfaces and high-speed networking (e.g., Ethernet, PCIe) for data-intensive applications. It is designed to meet automotive-grade quality standards, including AEC-Q100 qualification, ensuring reliable operation in harsh environments. Technically, the TDA54-Q1 leverages advanced process technology to deliver high compute density while managing power consumption. The integration of specialized subsystems offloads tasks from the main CPU, improving efficiency and real-time performance. The C7 NPU is optimized for convolutional neural networks (CNNs) and transformer models, enabling real-time object detection, lane detection, and driver monitoring. Typical applications include autonomous driving (Level 2+ to Level 4), ADAS features like automatic emergency braking and adaptive cruise control, and in-cabin monitoring systems. The TDA54-Q1 is also suitable for domain controllers that aggregate data from multiple sensors (cameras, radar, LiDAR) and run fusion algorithms. When designing with the TDA54-Q1, engineers must consider power delivery, thermal management, and signal integrity. The SoC requires multiple power rails with precise sequencing, and a robust PCB layout with adequate decoupling is essential. TI provides reference designs and evaluation modules to accelerate development.
TPLD2001 - 18-GPIO PLD with I2C/SPI | Texas Instruments
The TPLD2001 is a programmable logic device (PLD) from Texas Instruments featuring 18 GPIOs and a selectable I2C/SPI interface. It is supplied in a 20-VSSOP package and integrates configurable macro-cells built from 2-, 3-, and 4-bit lookup tables (LUTs) together with sequential logic and analog blocks. The device operates from 1.71V to 5.5V over -40°C to 125°C and is qualified for automotive applications. A programmable logic device is an integrated circuit whose logic function is defined by the user after manufacturing. In the TPLD family, InterConnect Studio is used to configure the non-volatile memory, either by emulating OTP memory or permanently programming the one-time programmable fuse. PLDs sit between standard fixed-function logic and large CPLDs/FPGAs, providing a compact, low-power way to integrate glue logic, timing, reset, power sequencing, and I/O expansion functions. Key features include 18 GPIOs, 14 macrocells, and a configurable I2C/SPI port for system communication and in-system configuration. The 2/3/4-bit LUT macrocells allow flexible combinatorial logic; sequential blocks support timers, delays, and state machines. The wide 1.71V to 5.5V supply range permits operation from Li-ion batteries, 3.3V rails, or 5V industrial buses, and the -40°C to 125°C temperature range covers automotive and industrial environments. The device's analog blocks provide voltage monitoring and reset generation, eliminating external supervisor ICs. Its low power and compact 20-VSSOP package make it suitable for space-constrained designs. Because logic functions are configured in the OTP memory and the same base part can be used across many designs, inventory can be consolidated. The selectable I2C/SPI port also allows integration into microcontroller-based systems for status readback or dynamic reconfiguration when the non-volatile logic is emulated. Typical applications include timing delay generation, voltage monitoring and reset generation, power sequencing, I/O expansion, and glue logic consolidation in automotive body electronics, industrial sensors, and consumer devices. Designers can use InterConnect Studio to implement and simulate logic before programming. When designing with TPLD2001, plan the OTP programming step during production and verify I/O assignments before programming, because OTP cannot be changed after the permanent fuse is blown.
VM2152 - Versal Prime Adaptive SoC, 757K Logic Cells | AMD
The AMD VM2152 is a mid-range adaptive SoC from the Versal Prime series, integrating dual-core ARM Cortex-A72 application processors and dual-core ARM Cortex-R5F real-time processors with programmable logic. It features 757K logic cells, 112 Gb/s GTM transceivers, and support for high-bandwidth DDR memory interfaces including LPDDR5 up to 6400 Mb/s and DDR5 up to 5600 Mb/s. The device is available in a 1369-FCBGA package (35x35 mm) and operates at processor speeds up to 1.4 GHz for the A72 cores and 600 MHz for the R5F cores. An adaptive SoC (System-on-Chip) combines a processing system (PS) with programmable logic (PL) on a single die, enabling hardware-software co-design and dynamic reconfiguration. The Versal Prime series is the foundational family of AMD's adaptive compute acceleration platform (ACAP), targeting applications that require high data throughput, low latency, and flexibility. The VM2152 specifically uses the Processing System Wizard IP instead of the CIPS IP for configuring the processing system, a unique feature among Versal Prime devices. Key features of the VM2152 include 112 Gb/s GTM transceivers supporting 600 GbE networking, increased DSP capability compared to previous Versal Prime devices, and support for LPDDR5/DDR5 memory interfaces. The device also integrates a programmable network-on-chip (NoC) for efficient data movement between the PS, PL, and memory interfaces. These features make it suitable for high-speed connectivity, data center networking, and wired communications. From a technical perspective, the VM2152 leverages AMD's 7nm process technology, offering a balance of performance and power efficiency. The dual-core A72 cluster provides high-performance general-purpose computing, while the R5F cores handle real-time tasks. The programmable logic fabric supports custom accelerators and protocol implementations, and the integrated NoC simplifies system integration by providing a standardized interconnect. Typical applications include data center networking (600 GbE switches), storage controllers, wired communications (400G connectivity), and high-performance embedded computing. The device's high-bandwidth memory interfaces and transceivers enable it to handle massive data streams with low latency. When designing with the VM2152, careful attention must be paid to power delivery and thermal management due to its high performance. The 1369-FCBGA package requires a robust PCB layout with adequate decoupling and thermal vias. Additionally, the Processing System Wizard IP should be used for PS configuration, as the traditional CIPS IP is not supported on this device.
XA2S200E-6FT256I - 200K Gate FPGA | AMD | 256-FTBGA
The AMD XA2S200E-6FT256I is a member of the Spartan-IIE XA family of Field Programmable Gate Arrays (FPGAs), designed for automotive and industrial applications requiring high performance, abundant logic resources, and a rich feature set at a low cost. This device provides 200,000 system gates, 5,292 logic cells, and 1,176 Configurable Logic Blocks (CLBs), operating from a nominal 1.8V supply. It is housed in a 256-ball FTBGA (17x17 mm) package with 182 user I/O pins. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing—hence "field-programmable." FPGAs are part of the broader programmable logic device (PLD) family, which sits above ASICs in flexibility but below them in unit cost at high volume. The Spartan-IIE family is a superior alternative to mask-programmed ASICs, avoiding the initial cost, lengthy development cycles, and inherent risk of conventional ASICs. FPGA programmability permits design upgrades in the field with no hardware replacement necessary. Key features of the XA2S200E-6FT256I include 57,344 total RAM bits, support for 1.71V to 1.89V supply voltage, and a -40°C to 100°C junction temperature range. The device uses a 0.15-micron CMOS process and supports I/O standards including LVCMOS, LVTTL, and HSTL. The -6 speed grade indicates a maximum internal clock frequency of approximately 200 MHz, suitable for moderate-speed control and data processing tasks. Technically, the Spartan-IIE architecture combines a configurable logic fabric with block RAM and dedicated routing resources. The 256-ball FTBGA package provides excellent thermal and electrical performance, with a compact 17x17 mm footprint. The device is lead-free and RoHS compliant, meeting modern environmental standards. Typical applications include automotive infotainment, motor control, industrial networking, and test equipment. The 182 I/O pins allow flexible interfacing with sensors, ADCs, and communication transceivers. The wide temperature range and automotive qualification make it suitable for under-hood and harsh-environment deployments. When designing with this FPGA, ensure adequate decoupling on the 1.8V core supply and separate I/O supply rails. The device is now obsolete (EOL), so plan for last-time buy or consider pin-compatible alternatives for new designs.
XA3S1000-4FTG256Q - 1M Gate Automotive FPGA | AMD Xilinx
The AMD Xilinx XA3S1000-4FTG256Q is an automotive-grade Field Programmable Gate Array (FPGA) from the Spartan-3 XA family, designed for high-volume, cost-sensitive automotive electronic applications. It delivers 1,000,000 system gates, 17,280 logic cells, and 442,368 total RAM bits in a 256-ball FTBGA package. This device operates with a nominal supply voltage of 1.2V (range 1.14V to 1.26V) and supports 173 user I/O pins, making it suitable for a wide range of automotive control and interface tasks. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and a hierarchy of reconfigurable interconnects that allow the hardware to be reprogrammed to perform any digital logic function. The Spartan-3 XA family is specifically optimized for automotive applications, meeting the rigorous AEC-Q100 qualification standard for reliability across extended temperature ranges (-40°C to +125°C). Key features of the XA3S1000-4FTG256Q include its automotive qualification (AEC-Q100), 173 user I/O pins, 1920 Configurable Logic Blocks (CLBs), and 442,368 total RAM bits. The device is built on 90nm technology and supports a maximum operating frequency of 125MHz. The FTG256 package (256-ball FTBGA) provides a compact footprint suitable for space-constrained automotive PCBs while offering adequate thermal performance for the device's power dissipation. From a technical architecture perspective, the Spartan-3 XA family uses a 90nm process technology with a 1.2V core voltage, enabling low power consumption while maintaining high logic density. The device includes dedicated multipliers, block RAM, and digital clock managers (DCMs) that support complex digital designs. The automotive-grade variant ensures operation across the full -40°C to +125°C temperature range, making it reliable for under-hood and in-cabin automotive electronics. Typical applications include automotive infotainment systems, engine control units (ECUs), advanced driver-assistance systems (ADAS), and industrial motor control. The device's 173 I/O pins and 1M gate capacity make it ideal for glue logic, sensor interfacing, and display control in automotive environments. When designing with this device, ensure proper power supply decoupling with 0.1uF and 10uF capacitors placed close to the VCC pins. The 1.2V core supply must be clean and stable; consider using a dedicated LDO or DC-DC converter with adequate ripple rejection to maintain reliable FPGA operation.
XA7A12T-1CPG238I - Automotive Artix-7 FPGA | AMD
The AMD XA7A12T-1CPG238I is an automotive-qualified Artix-7 XA Field Programmable Gate Array (FPGA) with 12,800 logic cells, 737,280 bits of block RAM, and 112 user configurable I/O pins. It is supplied in a 238-ball LFBGA/CSPBGA (CSBGA-238) package with a -1 speed grade and is designed for cost-sensitive automotive and industrial applications where low power, small footprint, and reprogrammable hardware logic are essential. An FPGA (Field Programmable Gate Array) is a semiconductor device containing a matrix of configurable logic blocks connected through programmable interconnects; the array can be reprogrammed in the field to implement user-defined digital logic circuits. FPGAs sit between fixed-function ASICs and software processors in the digital system hierarchy, giving engineers the ability to iterate hardware designs without silicon respin. The Artix-7 XA family is specifically screened for automotive quality, bringing FPGA flexibility to vehicle systems. Key features of the XA7A12T-1CPG238I include 12,800 logic elements, 737,280 total block RAM bits, and 112 user I/O in a compact 238-ball CSPBGA. The -1 speed grade offers an entry-level performance point that minimizes cost and power while supporting moderate clock rates for control, interface, and image-processing tasks. The device is RoHS compliant per LCSC listing, and the XA prefix indicates automotive-grade screening. Architecturally, Artix-7 devices integrate a high-performance programmable logic fabric, embedded block RAM, and DSP slices for arithmetic operations. The 737,280-bit block RAM supports distributed FIFOs and line buffers, while the flexible I/O cells connect to a wide range of single-ended and differential signalling standards. These capabilities enable deterministic hardware processing in ADAS, motor control, display bridging, and industrial logic applications. Typical applications include automotive ADAS sensor fusion, electric pump and fan motor control, industrial machine vision, in-vehicle display bridges, battery management safety logic, and UAV flight controllers. The 112 I/O and automotive qualification make the XA7A12T suitable for replacing multiple discrete logic and microcontroller tasks with one programmable device. When designing with the XA7A12T-1CPG238I, pay careful attention to multi-rail power sequencing requirements and the exact CPG238 pinout file. Multiple supply rails, BGA decoupling, and configuration flash selection are critical for first-pass success.
XA7A12T-2CSG325I - Automotive Artix-7 FPGA 12.8K LC | AMD
The AMD Xilinx XA7A12T-2CSG325I is an automotive-qualified Artix-7 field programmable gate array (FPGA) in a 324-ball LFBGA/CSPBGA (CSG325) package. It provides 12,800 logic cells, 150 user I/O, and 737,280 bits of block RAM, with a -2 speed grade that supports high-performance, real-time processing in harsh environments. As part of the XA Artix-7 automotive family, this device delivers AEC-Q100-grade dependability and operates over an industrial temperature range. An FPGA (field-programmable gate array) is a semiconductor integrated circuit whose logic fabric can be configured after manufacturing using hardware description languages such as Verilog or VHDL. FPGAs occupy a unique position in the programmable logic hierarchy, combining hardware-level parallelism with reconfigurability and low-latency I/O. The Artix-7 architecture targets power-conscious, high-volume applications that need moderate logic density, rich I/O flexibility, and deterministic timing. Key feature highlights include 40 DSP48E1 slices for high-throughput multiply-accumulate signal processing, three clock management tiles (CMTs), and a 1.0 V core supply that reduces dynamic power. The -2 speed grade is ideal for 100-300 MHz interface and logic designs. The CSG325 package measures only 15 x 15 mm, with a 0.8 mm ball pitch that allows cost-effective 4-layer PCB routing. The device is JESD-609 e1 lead-free (SnAgCu finish), RoHS compliant, and MSL-3 rated with a 260 C peak reflow temperature. Architecturally, the device uses the proven 7-series SRAM-based fabric with 6-input LUTs, dual flip-flops per slice, and cascade chains for arithmetic. The internal block RAM can be configured as 36 Kb or 18 Kb primitives with multiple parity bits. The configuration engine supports master SPI, master BPI, slave SelectMAP, slave serial, and JTAG modes, providing flexible boot options for automotive and industrial systems. Typical applications are automotive ADAS pre-processing, sensor fusion gateways, industrial motor control, medical ultrasound front ends, networking line cards, broadcast video interfaces, and test equipment. The 150 user I/O with HR (high-range, 1.2 V to 3.3 V) capability lets designers interface directly to many sensors, ADCs, and memory devices without external level shifters. When designing with this device, follow AMD/Xilinx UG583 recommendations for BGA power decoupling: place 1.0 uF and 0.1 uF capacitors under the package on VCCINT, and ensure a monotonic, sequenced power-up of VCCINT, VCCBRAM, and VCCO for reliable configuration.
XA7S25-1CSGA324I - Spartan-7 FPGA, 150 I/O | AMD
The AMD XA7S25-1CSGA324I is a member of the Spartan-7 XA family of Field Programmable Gate Arrays (FPGAs), designed for automotive and industrial applications requiring high performance and reliability. It features 23,360 logic cells, 3,650 adaptive logic modules (ALMs), and 1.58 Mbit of block RAM, providing ample resources for moderate-complexity digital designs. The device is housed in a 324-ball CSGA (Chip-Scale BGA) package with 150 user I/O pins, supporting a core voltage of 0.95V to 1.05V and operating over a temperature range of -40°C to +100°C. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing—hence "field-programmable." FPGAs consist of an array of programmable logic blocks, interconnects, and I/O blocks, allowing them to implement any digital logic function. They are a subset of programmable logic devices (PLDs) and sit within the broader category of embedded processors and controllers. FPGAs are distinct from microcontrollers and ASICs because they offer reconfigurability, enabling rapid prototyping and in-field updates. Key features of the XA7S25-1CSGA324I include 150 user I/Os, 1.58 Mbit of block RAM, and support for various I/O standards such as LVCMOS, LVDS, and SSTL. The device is AEC-Q100 qualified, making it suitable for automotive electronics. It also supports partial reconfiguration and has built-in security features like AES bitstream encryption. The CSGA-324 package offers a compact footprint with a 0.8mm ball pitch, ideal for space-constrained designs. Technically, the Spartan-7 family is built on a 28nm process, balancing performance and power efficiency. The XA7S25 includes DSP slices for signal processing, clock management tiles (CMT) with PLLs and MMCMs, and high-speed transceivers (though this specific variant does not include GTP transceivers). The device supports configuration via JTAG, SPI, or BPI interfaces, and can be programmed using AMD's Vivado Design Suite. Typical applications include automotive driver assistance systems (ADAS), industrial motor control, machine vision, and communication interfaces. The XA7S25's combination of logic density, I/O count, and automotive qualification makes it ideal for these environments. When designing with this FPGA, ensure proper decoupling of the core and I/O supplies, and follow the layout guidelines in UG475 for the CSGA package. The device requires a 1.0V core supply and 1.8V/2.5V/3.3V I/O supplies, depending on the bank configuration.
XC3090L-100PC84C - XC3000 FPGA 6K Gates 100MHz PLCC-84 | Xilinx
The Xilinx XC3090L-100PC84C is a 5V, 100MHz Field Programmable Gate Array from the legacy XC3000 family, housed in an 84-pin Plastic Leaded Chip Carrier (PLCC) package. It integrates approximately 6,000 usable gates and 320 Configurable Logic Blocks (CLBs) on a 5-micron CMOS process, making it one of the highest-density parts in the original XC3000 series. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of an array of configurable logic blocks, programmable interconnect, and input/output cells that engineers can program after manufacture. FPGAs sit within the broader taxonomy of programmable logic devices (PLD) and digital semiconductors, alongside CPLDs, ASICs, and microcontrollers. Unlike an ASIC (Application-Specific Integrated Circuit), an FPGA requires no photomask NRE and ships as a blank silicon canvas that the user programs via a hardware description language or schematic capture flow, then a vendor-specific bitstream. Key features of the XC3090L-100PC84C include a -100 speed grade, 144 logic-cell equivalent capability, and CMOS technology at a 5V supply. The device supports distributed RAM via CLB configuration and includes on-chip boundary-scan (IEEE 1149.1) test logic for board-level diagnostics. The PLCC-84 ceramic-compatible plastic package has a JEDEC-standard 1.27 mm pin pitch, allowing socket-mounting for prototyping or direct surface mounting for production. The XC3090L variant is the low-power evolution of the original XC3090, using a 3.3V core option in some speed grades while retaining 5V-tolerant I/O. The part is typically configured using the Xilinx XACT development environment with schematic capture, automatic place-and-route, logic and timing simulation, and an interactive design editor for design optimization. Designers should use timing calculator features and integrate with the standard design environment toolchain. Typical applications of the XC3090L-100PC84C include legacy telecommunications glue logic, industrial control state machines, prototyping ASICs, glue logic for vintage bus architectures such as VME and ISA, and educational FPGA laboratory kits. The 100MHz internal logic rate suits mid-speed glue-logic and bus-interface bridging tasks. When designing with this part, ensure adequate decoupling (one 0.1uF per supply pin cluster) and respect the 5V I/O voltage level. Note that the XC3000 family is NRND/EOL for new designs - consider Xilinx Spartan or Artix-7 for new projects unless maintaining legacy equipment. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers source or replace this legacy FPGA with confidence.
XC3090L-125PC84C - 5K-Gate FPGA, 125MHz, 84-Pin PLCC | Xilinx
The Xilinx XC3090L-125PC84C is a CMOS Field Programmable Gate Array (FPGA) from the XC3000L low-voltage Logic Cell Array family, supplied in an 84-pin PLCC package. It features 320 Configurable Logic Blocks (CLBs), approximately 5000 equivalent logic gates, 928 flip-flops, and a maximum clock frequency of 125 MHz. The device operates from a 3.0 V to 3.6 V supply (typical 3.3 V), reflecting the L-suffix low-voltage variant of the classic XC3000 architecture. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of an array of configurable logic blocks, interconnect routing, and programmable I/O cells that can be electrically configured by the end user to implement arbitrary digital logic. FPGAs occupy the middle ground between fixed-function ASICs and software-programmable microcontrollers, offering parallel hardware execution, deterministic timing, and on-the-fly reconfigurability. The XC3000L family sits at the foundation of SRAM-based FPGA technology, with logical hierarchy: CLB -> logic cell array -> FPGA -> programmable logic device (PLD) -> digital integrated circuit. Key features of the XC3090L-125PC84C include 320 CLBs delivering roughly 5,000 usable gates, 928 edge-triggered flip-flops for pipelined or state-machine designs, a maximum toggle rate of 125 MHz, and 84 PLCC pins providing programmable I/O plus dedicated configuration, clock and JTAG interfaces. The device supports JTAG (IEEE 1149.1) boundary-scan for board-level test, in-system reprogrammability through the standard Xilinx XC3000 configuration bitstream, and a power-down mode that significantly reduces quiescent current for battery-friendly applications. Architecturally, the XC3090L implements the classic Xilinx XC3000 CLB with a 5-input lookup table feeding two flip-flops, a programmable interconnect matrix of single-length and double-length lines, and tri-state buffers that allow efficient implementation of muxes, busses, and tri-state I/O. The 125 MHz speed grade places it in the highest tier of the XC3090L family, enabling high-performance glue logic, custom state machines, and DSP-style bit-level pipelines on a single chip. Typical applications include legacy telecom interface glue logic, industrial control and instrumentation front ends, custom peripheral controllers for microprocessor systems, prototyping vehicles for ASIC verification, and reconfigurable test fixtures. Designers building long-life industrial equipment, military refresh programs, or replacement boards for existing XC3000-based systems remain the primary users of this classic part. Designers using the XC3090L-125PC84C should preserve the legacy 3.3 V supply rail, follow Xilinx XC3000 configuration mode recommendations (SelectMAP/serial master or slave), and respect the PLCC pin-out when laying out new PCBs or repairing legacy boards. This page combines distributor pricing, verified cross-reference data, and design notes that are not collected in the original Xilinx datasheet.
XC3090L-6TQ176C - 3.3V 9000-Gate FPGA, 176-Pin TQFP | Xilinx
The Xilinx XC3090L-6TQ176C is a low-voltage (3.3 V) Logic Cell Array (LCA) FPGA from the legacy XC3000L family, integrating approximately 9,000 usable gates into a 176-pin TQFP (TQ) package. It is built on a 0.8-micron CMOS SRAM process with six speed-grade -6 timing, and is intended for digital logic prototyping and small-volume glue-logic designs where 5 V-only XC3000 parts are not an option. An FPGA (Field Programmable Gate Array) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnect, and programmable I/O cells, all defined by a bitstream stored in SRAM configuration memory. The XC3000L is the low-voltage (3.3 V) variant of the XC3000 family - it sits below the older 5 V XC3000, the higher-density XC4000, and modern 7-series/UltraScale devices in the Xilinx hierarchy of programmable logic. Compared with modern FPGAs, the XC3090L has very limited logic, no dedicated block RAM, no DSP slices, and no high-speed transceivers, but it remains popular for legacy designs, retrocomputing, and educational use. Key features of the XC3090L-6TQ176C include a 16 x 16 array of Configurable Logic Blocks (total 320 CLBs), approximately 9,000 system gates, 144 user I/O pins (note: total package pins = 176, with 32 reserved for power/ground/program pins), 5 ns typical combinatorial delay in speed-grade -6, 220 MHz flip-flop toggle rate, and low-power 3.3 V CMOS I/O. The TQ176 (TQFP-176) package provides a 1.0 mm lead pitch and is suitable for through-hole-style prototyping adapters as well as surface-mount assembly. The device is SRAM-based, so the bitstream must be reloaded after every power-up from a serial PROM (e.g., XC1736A) or microcontroller. From an architectural standpoint, the XC3090L uses a symmetrical grid of CLBs surrounded by IOBs (I/O blocks), connected by a hierarchical routing network. Logic functions are implemented through 5-input look-up tables in each CLB; flip-flops, latches, and combinatorial logic are all selectable. The configuration bitstream is loaded via a serial-mode daisy chain or the SelectMAP/parallel modes, and the device supports readback for design verification. Typical applications include legacy 3.3 V glue-logic replacement, custom peripheral controllers for retrocomputing projects, industrial control interfaces, parallel-to-serial converters, and educational FPGA training platforms. The wide 3.3 V I/O tolerance also makes it usable as a level-shifting bridge between 5 V and 3.3 V domains when paired with appropriate bus hold or pull-up resistors. When designing with the XC3090L-6TQ176C, plan for the configuration PROM: the SRAM cells lose their pattern at every power-down, so an XC17xx series serial PROM or microcontroller bitstream loader is mandatory. Decoupling must follow the datasheet guidelines (typically one 0.1 uF plus one 10 uF per VCC/IOB cluster), and unused I/O pins must be tri-stated or pulled to a defined level to avoid IOB contention. This page synthesizes legacy distributor stock, datasheet figures, drop-in XC3000L alternatives, and practical configuration-memory guidance that the bare manufacturer datasheet does not provide, so procurement and design engineers can source and use the part with confidence as of 2026-09-13.
XC3090L-6TQ176I - XC3000L 320MHz FPGA 176-pin TQFP | Xilinx
The Xilinx XC3090L-6TQ176I is a member of the XC3000L Low Voltage Logic Cell Array Family of Field-Programmable Gate Arrays, housed in a 176-pin TQFP package with -6 speed grade and industrial temperature rating. The XC3000L family uses a low-voltage SRAM-based logic cell architecture optimized for low-power, high-density designs, and the XC3090L device delivers approximately 320 MHz of combinatorial logic performance with 100 I/O pins organized into four I/O banks for mixed-voltage interfacing. A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and configurable I/O cells. Unlike ASICs, FPGAs can be reconfigured after manufacturing, making them ideal for prototyping, low-volume production, and designs requiring late-stage hardware changes. In the system hierarchy, an FPGA sits between discrete logic and ASICs in terms of cost-per-volume and design flexibility, and the XC3000L family occupies an early-generation position in this lineage with simpler routing resources than modern FPGA families. Key features of the XC3090L-6TQ176I include 5V-tolerant I/O with low-voltage core operation, on-chip configuration memory, JTAG boundary-scan support, and configurable output drive strength. The TQ-176 package offers a 1.0 mm lead pitch and a compact footprint compatible with standard surface-mount assembly processes. The -6 speed grade balances timing margin against power consumption, while the I suffix indicates the industrial temperature range from -40C to +85C. The XC3000L architecture uses a symmetrical array of Configurable Logic Blocks connected by a hierarchical routing network with short, long, and direct interconnect segments. Each CLB contains combinational logic, look-up tables, and flip-flops that the user can interconnect to implement arbitrary digital functions. Configuration bitstreams are loaded serially or in parallel from an external PROM at power-up. Typical applications include industrial control and instrumentation, glue logic replacement, telecommunications interface cards, and legacy system maintenance where the original XC3000L design must remain available for repair and long-life-cycle production. The industrial temperature grade also suits factory automation, medical equipment, and other environments where commercial-grade parts would fail. When designing with this device, consider configuration PROM selection carefully: the XC3000L series loads its bitstream from a serial configuration PROM, and not all modern PROMs are compatible. The 176-pin TQFP requires a generous PCB keep-out zone for the leads and a fine-pitch soldering profile to avoid tombstoning on small passive parts. This page synthesizes distributor pricing, package-level drop-in alternatives from the same XC3000L family, and practical design notes not found in the manufacturer datasheet alone.
XC3090L-6TQG176C - XC3000L FPGA 6ns 138 I/O TQG176 | Xilinx
The Xilinx XC3090L-6TQG176C is a member of the XC3000L Low-Voltage Logic Cell Array FPGA family, providing 138 user I/O pins in a 176-pin Thin Quad Gull-Wing (TQG) surface-mount package with -6 speed grade and commercial operating temperature. This device is part of the legacy XC3000L series that operates from a 3.3V supply, distinguishing it from the original 5.0V XC3000A family. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic function is defined by user-programmed configuration memory rather than fixed mask wiring. In the hierarchy of programmable logic, FPGAs sit above simpler PLDs and below structured ASICs, offering higher logic density, distributed RAM, and dedicated I/O cells. The XC3000L family specifically targets low-voltage (3.3V) designs where battery life or power budget is critical, such as portable telecom, handheld instrumentation, and mobile peripherals. Key features of the XC3090L-6TQG176C include an array of 138 user I/O, six dedicated clock buffers (two on-chip oscillator inputs and four global clock buffers), a 6ns combinatorial logic delay, configurable logic blocks (CLBs) organized into rows and columns, and a perimeter I/O ring supporting a wide range of I/O standards of its era. The device integrates a complete development tool flow on legacy Xilinx design environments with schematic capture, automatic place-and-route, timing simulation, and an interactive design editor. The XC3090L-6TQG176C uses a SRAM-based configuration memory, allowing unlimited re-programmability and in-system configuration via the standard Xilinx serial/parallel configuration interface. Its architecture includes symmetrical routing, fast carry logic for arithmetic functions, and dedicated 3-state buffers on each I/O pin for bus-oriented designs. The -6 speed grade delivers 6ns tpd on a typical combinatorial path. Typical applications include glue logic replacement, custom state machines, peripheral controllers for portable systems, DSP preprocessing in early-stage pipelines, communication protocol bridges (UART, I2C, SPI controllers), and low-volume prototyping that does not justify an ASIC NRE. The 3.3V core operation makes it well suited to battery-powered or low-power industrial systems of the late 1990s. When designing with this FPGA, be aware of its legacy status. Designers should verify that the 3.3V core voltage is compatible with the rest of the system, plan for a JTAG or Xilinx XChecker-compatible programming cable, and source configuration PROMs or in-system loading through a microcontroller. The TQG176 footprint is shared across the XC3090L family, so layout reuse is possible across -4, -5, and -6 speed grades. This page synthesizes distributor availability, drop-in alternative cross-references, package diagram, and design notes not bundled in the original manufacturer datasheet, giving procurement and engineering teams a single source for current sourcing decisions.
XC3090L-6TQG176I - XC3000L 3.3V FPGA 900 Gates | Xilinx TQG176
The Xilinx XC3090L-6TQG176I is a 3.3 V low-voltage member of the Xilinx XC3000L Logic Cell Array family, packaged in a 176-pin Thin Quad Flat Pack (TQG176) and providing approximately 900 usable gates with 6 ns combinatorial delay. It is part of the original Xilinx XC3000 generation of SRAM-look-up-table FPGAs, targeting low-voltage 3.3 V systems where the original 5 V XC3000 family could not be used directly. An FPGA (Field Programmable Gate Array) is a programmable logic device whose core is an array of configurable logic blocks (CLBs) surrounded by a perimeter of programmable input/output blocks (IOBs), with a programmable interconnect matrix tying them together. The hierarchy runs: logic cell -> CLB -> FPGA -> programmable logic -> digital IC. The XC3000L subfamily is one of the earliest commercial SRAM-based FPGA lines, and the 'L' suffix denotes the 3.3 V variant of the original XC3000 architecture, allowing operation in mixed-voltage boards that were already migrating from 5 V to 3.3 V logic rails. Key features of the XC3090L include a 3.3 V core supply (VCC), 5 V tolerant I/O on selected parts, on-chip configuration logic with five configuration modes, boundary-scan (JTAG) support, and readback capability. The '6' speed grade corresponds to a combinatorial logic delay of roughly 6 ns and a flip-flop toggle rate near 80 MHz in the XC3000L process. The 'I' suffix indicates an industrial temperature grade of -40C to +85C. Typical applications include telecom interface glue logic, industrial control and instrumentation front-ends, prototyping of ASIC designs before HardCopy migration, and legacy equipment where the XC3000L footprint is already committed on the PCB. Designers using the XC3090L can prototype on the SRAM-based FPGA and migrate to a HardCopy Stratix equivalent for volume production using the same package pinout.
XC3090L-7TQ176C - XC3000L Low-Voltage FPGA | Xilinx | 176-pin TQFP
The Xilinx XC3090L-7TQ176C is a member of the XC3000L Low-Voltage Logic Cell Array family, a legacy field-programmable gate array (FPGA) designed for low-voltage (3.3 V) operation in a 176-pin TQFP package with -7 speed grade and commercial temperature range. As a programmable logic IC from the Xilinx XC3000 series, it combines SRAM-based configuration with a fine-grained logic cell architecture optimized for glue logic, control plane, and state-machine designs. A field-programmable gate array (FPGA) is a type of integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic. FPGAs sit between programmable logic devices (PLDs/CPLDs) and application-specific integrated circuits (ASICs) in the silicon hierarchy, offering higher density than PLDs and lower NRE cost than ASICs. The XC3000L family is the low-voltage derivative of the original XC3000 architecture introduced in the early 1990s, designed for 3.3 V systems where the standard 5 V XC3000 family could not operate. Key features of the XC3090L include an SRAM-based configuration memory, an abundant count of configurable logic blocks (CLBs) and user I/O for a part of its era, and a -7 speed grade rating that places it within the standard performance bin of the family. The device is offered in the TQ176 package - a 176-pin thin quad flat pack with gull-wing leads suitable for surface-mount assembly. The commercial temperature suffix ("C") denotes 0 °C to +85 °C operation. Architecturally, the XC3090L uses a symmetrical array of configurable logic blocks surrounded by a perimeter of user-programmable I/O blocks (IOBs). Interconnect is provided by a hierarchical routing network driven by metal-mask or SRAM programming. A configuration bitstream loaded into on-chip SRAM defines all logic, routing, and I/O behavior, allowing unlimited re-programmability but requiring an external configuration memory on power-up. Typical applications for the XC3090L-7TQ176C include legacy telecom interface cards, industrial control and instrumentation, test equipment glue logic, prototype ASIC replacement, and educational hardware platforms. Designers maintaining installed-base systems with XC3000L silicon continue to source this part for repair and field replacements. When designing with this legacy FPGA, note that the -7 speed grade corresponds to a specific timing window within the family; designers should consult the original Xilinx datasheet and use the XACTstep or Foundation toolchain for synthesis, place-and-route, and bitstream generation. Configuration storage requires an external EPROM or microcontroller since SRAM cells are volatile. This page synthesizes distributor stock data, drop-in same-package alternatives, and practical sourcing guidance for engineers maintaining XC3000L designs - information not found in any single distributor listing.
XC3090L-7TQ176I - 3.3V Logic Cell Array FPGA, 176-pin TQFP | Xilinx
The Xilinx XC3090L-7TQ176I is a member of the XC3000L Low-Voltage Logic Cell Array family, a static RAM-based field-programmable gate array (FPGA) housed in a 176-pin Thin Quad Flat Pack (TQFP) package with industrial temperature grade. The XC3000L family targets low-voltage 3.3V operation while preserving the original XC3000 architecture, making it suitable for designs migrating from 5V to 3.3V logic rails. Per the XC3090L datasheet, the device integrates configurable logic blocks (CLBs), a perimeter of programmable input/output blocks (IOBs), and a programmable interconnect matrix. A field-programmable gate array (FPGA) is a type of programmable logic device (PLD) that allows designers to configure digital logic circuits after manufacturing. Within the semiconductor hierarchy, FPGAs sit between application-specific integrated circuits (ASICs) and small-scale programmable logic; they offer higher integration than discrete gate arrays and faster time-to-market than full ASICs, which is precisely why the XC3000L family was adopted across industrial, telecom, and embedded applications in the late 1990s and early 2000s. Key differentiating features of the XC3090L include roughly 9000 system gates, 320 configurable logic blocks, a 5 ns pin-to-pin logic delay at the -7 speed grade, and 3.3V core operation with 5V-tolerant I/O options. The device supports on-chip configuration via serial or parallel modes and is in-system programmable through the Xilinx XC3000 configuration bitstream format. Boundary-scan (JTAG, IEEE 1149.1) compatibility is part of the family baseline. Architecturally, the XC3090L uses SRAM configuration memory, meaning it is volatile and must be reconfigured at every power-up. The interconnect is a hierarchical routing matrix connecting CLBs through single-length, double-length, and long-line segments. This routing fabric, combined with the -7 speed grade, makes the part a credible choice for glue-logic, bus-interface bridges, and small state-machine controllers rather than high-throughput DSP. Typical applications include industrial serial-protocol bridges (UART, SPI, I2C controllers), legacy peripheral interfaces in test and measurement equipment, glue logic between microprocessors and memory buses, low-density state-machine controllers in instrumentation, and ASIC prototyping where pin-compatibility with the TQFP-176 footprint is mandatory. Designers often pair this part with an external configuration PROM such as the XC1736. One critical design consideration is that the XC3000L family is no longer recommended for new designs; Xilinx has issued multiple end-of-life notices across the XC3000L series, so longevity planning and last-time-buy inventory buffers should be considered. Engineers should verify the latest lifecycle status from Xilinx before committing the part to long-lifecycle products. This page synthesizes distributor pricing snapshots, cross-reference observations, and practical design notes that are not collated in any single manufacturer document, providing a one-stop reference for engineers evaluating the XC3090L-7TQ176I for legacy or refurbishment projects.
XC3090L-7TQG176C - XC3000L 5,000 Gates FPGA | Xilinx | TQG176
The Xilinx XC3090L-7TQG176C is a member of the XC3000L Low Voltage Logic Cell Array family, an early-generation Field-Programmable Gate Array (FPGA) built on a 0.8-micron CMOS process. The device integrates approximately 5,000 usable gates (with up to 9,000 gates peak), a 144-bit-wide Configurable Logic Block (CLB) array of 100 CLBs, and 144 dedicated I/O pins, all housed in a 176-pin TQG thin quad flat pack (TQFP) package. What is an FPGA? A Field-Programmable Gate Array is a programmable logic device that lets designers implement arbitrary digital logic through a configurable array of logic blocks, interconnect, and I/O cells. The XC3000L family is a low-voltage (3.3 V) extension of the classic XC3000 architecture, optimized for portable, low-power, and battery-backed designs where the original 5.0 V XC3000 parts were unsuitable. Key features of the XC3090L-7TQG176C include SRAM-based configuration (reprogrammable in-system), boundary-scan (JTAG) support, on-chip crystal oscillator amplifier circuitry, and tri-state output buffers capable of driving 8 mA source and 24 mA sink. The -7 speed grade indicates a logic cell toggle delay in the range of 1.3-1.5 ns with typical system clock rates up to 60 MHz, while the C suffix denotes commercial temperature grade (0C to +85C). The TQG176 package is a 1.4 mm-thin surface-mount TQFP. The XC3000L architecture uses a symmetrical CLB matrix surrounded by I/O blocks, with a hierarchical routing network driven by a binary tree of routing channels. Configuration is loaded from an external serial EPROM (bit-serial mode) or 8-bit parallel PROM at power-up; the device can also be reconfigured in-system via JTAG. Typical applications include glue logic replacement, custom state machines, bus interface bridges, low-volume ASIC prototyping, and legacy industrial controllers. Designers choose XC3000L parts today almost exclusively for sustaining long-life products and legacy system repairs where re-qualification of newer FPGA silicon is cost-prohibitive. When designing with this device, ensure your configuration memory (Xilinx XC17xx serial PROM or compatible) is properly selected for 3.3 V operation. The XC3000L series requires all I/Os to be referenced to a single VCCO bank; mixed-voltage I/O requires external level shifters, unlike modern multi-bank FPGAs. This page synthesizes distributor stock signals, drop-in TQG176 alternatives from the same Xilinx XC3000L family, and design notes based on the original Xilinx XC3000L datasheet family specification - giving engineers a single reference for sustaining and sourcing legacy XC3000L designs.