LCMXO3LF-1300C-5BG256C - 1280 LUTs MachXO3LF FPGA, 256-BGA | Lattice
MPN: LCMXO3LF-1300C-5BG256C ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $13.66 | $13.66 |
| 10 | $12.45 | $124.50 |
| 100 | $11.2 | $1,120.00 |
| 500 | $10.05 | $5,025.00 |
| 1,000 | $9.1 | $9,100.00 |
LCMXO3LF-1300C-5BG256C Overview
Drop-in alternatives for LCMXO3LF-1300C-5BG256C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with LCMXO3LF-1300C-5BG256C (same form factor and footprint) — differing in Package, Speed Grade, Supply Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
LCMXO3LF-1300C-5BG256I
✅ Drop-In📋 Reference alternative (not in catalog)
LCMXO3LF-2100C-5BG256C
✅ Drop-In📋 Reference alternative (not in catalog)
LCMXO3LF-640C-5BG256C
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
LCMXO3LF-6900C-5BG256C
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
Contact for price
View Datasheet →LCMXO3LF-4300C-5BG256C
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
LCMXO3LF-1300C-5BG256C Maximum Ratings & Electrical Characteristics
| Family | MachXO3LF |
| Logic Elements / Cells | 1280 |
| LABs / CLBs | 160 |
| Number of I/O | 206 |
| Number of Logic Gates | 1300 |
| Total RAM Bits | 65536 |
| Supply Voltage | 1.2 V core (2.375 V - 3.465 V Vcco/Vccaux) |
| Operating Temperature | 0 C to +85 C (Commercial) |
| Mounting Type | Surface Mount |
| Package | 256-LFBGA (caBGA, 14 mm x 14 mm, 1.0 mm pitch) |
| Process Technology | 65 nm CMOS, non-volatile |
| Speed Grade | 5 |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| MSL Level | 3 |
| Distribution Type | Tray |
LCMXO3LF-1300C-5BG256C 256-lfbga (cabga, 14 mm x 14 mm, 1.0 mm pitch) Pin Configuration Guide
Pin configuration for LCMXO3LF-1300C-5BG256C (256-lfbga (cabga, 14 mm x 14 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for LCMXO3LF-1300C-5BG256C.
Refer to the datasheet for full pin configuration.
Typical Applications
LCMXO3LF-1300C-5BG256C is suitable for 7 applications: Industrial Motor Control, I/O Expansion and Bus Bridging, Power Sequencing and Supervisory Control, Display Backlight and Timing Control, Sensor Aggregation in IoT Edge Devices, Communications Infrastructure Glue Logic, Automotive Infotainment Auxiliary Control.
Industrial Motor Control
The LCMXO3LF-1300C-5BG256C is well suited for industrial motor control because it provides 206 user I/O, which is sufficient to handle encoder (QEI), Hall-sensor, and PWM feedback signals for multi-axis drives, plus non-volatile configuration that guarantees deterministic instant-on at power-up for safe motor startup. Its 1280 LUTs implement state-space control, field-weakening, and fault-handling logic, while embedded PLLs generate the high-resolution PWM timing required for sinusoidal FOC at switching frequencies of 20-100 kHz. The commercial temperature range (0 C to +85 C) is appropriate for cabinet-mounted drives; engineers can migrate to the LCMXO3LF-1300C-5BG256I for harsher factory-floor environments without changing the PCB layout.
Recommended
I/O Expansion and Bus Bridging
With 206 user I/O on a 14x14 mm BGA, the LCMXO3LF-1300C-5BG256C excels as an I/O-expansion and bus-bridging CPLD-replacement, mapping legacy 5 V parallel buses, UART, SPI, I2C, and even PCIe clock-side signals into modern SoCs that lack sufficient native interfaces. Its MachXO3LF non-volatile cells deliver instant-on within microseconds of power-up, eliminating the long boot times of SRAM-based FPGAs in glue-logic roles. The 1280 LUTs comfortably fit multi-master I2C arbiters, asynchronous FIFOs, and protocol-conversion state machines, while the 65 kbit of distributed RAM accommodates small data buffers between mismatched bus widths.
Recommended
Power Sequencing and Supervisory Control
The LCMXO3LF-1300C-5BG256C's non-volatile instant-on behavior makes it ideal for power-sequencing tasks in multi-rail systems. The 206 I/O allow direct drive of dozens of enable lines and PG (power-good) sense inputs, while programmable pull-ups and wide I/O voltage tolerance (1.2 V to 3.3 V) interface cleanly with PMBus, SVI2, and discrete MOSFET drivers. Internal PLLs provide delay-matched gate timing to enforce strict rail-to-rail sequencing windows of 1-100 ms. Designers can pair the FPGA with supervisor ICs to add under-voltage lockout; the 1280 LUTs also absorb reset-distribution logic for the entire board.
Recommended
Display Backlight and Timing Control
The LCMXO3LF-1300C-5BG256C handles backlight dimming and display timing in TVs, monitors, and industrial HMI displays, generating PWM at 200-1000 Hz with 16-bit resolution for LED strings of arbitrary length while simultaneously driving eDP/LVDS bridge timing. Its 206 I/O provide sufficient headroom for parallel RGB-to-eDP conversion, touch-panel scanning, and ambient-light sensor sampling. The MachXO3LF's low standby current extends battery life in portable displays, and the on-chip PLLs deliver the pixel-clock jitter performance required by eDP 1.4 and MIPI-DSI timing interfaces.
Recommended
Sensor Aggregation in IoT Edge Devices
The LCMXO3LF-1300C-5BG256C aggregates sensor data in IoT edge gateways by interfacing I2C, SPI, GPIO, and analog-front-end signals through its 206 I/O, then forwarding them to an upstream Cortex-M6 host via SPI, UART, or I2S. The non-volatile configuration wakes up the FPGA in microseconds, allowing the host CPU to remain in deep sleep until an event trigger arrives. The 1280 LUTs support up to a dozen concurrent sensor interfaces with simple state machines, while the small caBGA 14x14 mm footprint is friendly to space-constrained wearables. Target board power up to roughly 1 mA in standby enables lower energy-per-bit than CPU-driven polling.
Recommended
Communications Infrastructure Glue Logic
In routers, switches, and small-cell base stations, the LCMXO3LF-1300C-5BG256C performs front-panel LED control, fan-speed PWM generation, and SMBus master arbitration - all tasks that historically required a CPLD. The 206 I/O handle dozens of status LEDs, push-buttons, and alarm inputs, while embedded PLLs drive fan tachometer capture and PWM with sub-microsecond accuracy. The non-volatile instant-on of the MachXO3LF ensures LED patterns and fan controls become live within 1 ms of power-up, matching telecom equipment reliability targets at industrial temperature when paired with the LCMXO3LF-1300C-5BG256I variant.
Recommended
Automotive Infotainment Auxiliary Control
Although the C-rated LCMXO3LF-1300C-5BG256C is commercial-grade, the same silicon in the LCMXO3LF-1300C-5BG256C-AAHW package delivers automotive auxiliary functions in head units and instrument clusters, including backlight PWM, button scanning, and CAN/LIN gateway routing. The 206 I/O handle multiple CAN-FD controllers in parallel with LIN master/slave bridges, while the 65 kbit RAM fits CAN message buffers. Designers typically migrate to the AEC-Q100-qualified LCMXO3LF-1300C-5BG256IAHW for safety-critical applications; the footprint and toolchain are identical.
Recommended
Recommended Products Summary
Engineering reference data for LCMXO3LF-1300C-5BG256C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | LCMXO3LF-1300C-5BG256I | LCMXO3LF-2100C-5BG256C | LCMXO3LF-640C-5BG256C | LCMXO3LF-6900C-5BG256C | LCMXO3LF-4300C-5BG256C |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 256-LFBGA (caBGA, 14x14 mm, 1.0 mm pitch) | 256-LFBGA - same | 256-LFBGA - same | 256-LFBGA - same | 256-LFBGA - same | 256-LFBGA - same |
| Logic Elements / LUTs | 1280 | 1280 | 2112 (+65%) | 640 (-50%) | 6900 (+439%) | 4300 (+236%) |
| User I/O | 206 | 206 | 206 | 206 | 206 | 206 |
| Operating Temperature | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Process / Non-Volatile | 65 nm, non-volatile | 65 nm, non-volatile | 65 nm, non-volatile | 65 nm, non-volatile | 65 nm, non-volatile | 65 nm, non-volatile |
| Speed Grade | 5 | 5 | 5 | 5 | 5 | 5 |
Key Differentiators
- Highest LUT-to-footprint ratio in 256-BGA class (vs LCMXO3LF-640C-5BG256C)
- Cost-effective compared to higher-density siblings (vs LCMXO3LF-2100C-5BG256C)
- Non-volatile instant-on vs SRAM-based FPGAs (vs XC7A35T (Xilinx/AMD Spartan-7 alternative))
Design Notes
Estimated: the 256-BGA at 1.0 mm pitch requires 4-layer PCB with 0.5 mm via-in-pad microvia stackups (laser-drilled, plated and filled). Per IPC-7351 (qualified pattern), escape routing uses dog-bone fanout with the BG256 ball grid mapped to a 16x16 matrix; allow a 14 mm x 14 mm body clearance for the SOIC module outline. Place at least 8 decoupling caps (0.1 uF X7R) in a symmetric pattern around the four Vcco/Vcc banks, plus four 4.7 uF bulk caps per Vcco rail.
Estimated: at full I/O toggling (206 I/O at 25 MHz, 3.3 V Vcco), typical core current is approximately 10-15 mA and bank current approximately 50-100 mA. Use a dedicated 1.2 V LDO (such as TPS7A4701) for Vcc and a separate low-noise LDO per Vcco bank to prevent switching-noise coupling into clock nets. Place a 100 nF + 4.7 uF cap pair within 5 mm of each Vcc/Vccaux ball, and a ferrite bead on every Vcco rail.
Do not confuse the LCMXO3LF series with the higher-power LCMXO3 or the older LCMXO2. MachXO3LF is non-volatile and ultra-low-power; LCMXO3 is non-volatile with higher performance but more leakage; LCMXO2 is older and lacks embedded PLLs in the lowest pin-count packages. Mixing toolchains across these families produces bitstream mismatches - verify Lattice Diamond / Radiant project settings match the exact MPN. Also ensure JTAG pinout matches the chosen 14-pin or 256-BGA programming header footprint; the BG256 routes JTAG to specific bank pins that differ from the TQFP packages.
Match-impedance routing on the 206 I/O requires controlled-impedance traces (50 ohm single-ended, 90 ohm differential). For LVDS25 pairs, keep pair length matching within 150 mil and isolate from switching power traces by at least 3W spacing. Place clock-input pins (e.g., dedicated PLL clock inputs) on inner BGA rows to shorten escape stubs; this reduces jitter and improves timing margin at high toggle rates. Follow Lattice's 'MachXO3 sysIO Usage Guide' recommendations for per-bank Vcco and reference-voltage pin assignments.
Estimated: the MachXO3LF I/O buffers at 3.3 V LVCMOS drive 8 mA typical; at 206 simultaneously-switching outputs, expect SSO noise of approximately 100-200 mV at the die-grounded reference unless adequate decoupling is placed. Use Lattice Diamond / Radiant's Pin Planner to balance SSO across all four I/O banks, and avoid grouping high-frequency LVDS pairs adjacent to single-ended 3.3 V outputs. Simulation in HyperLynx or Ansys SIwave is recommended before final layout sign-off.
Compliance Information
RoHS compliant per Lattice product page and distributor listings. Standard C-grade (commercial) is NOT AEC-Q100 qualified; for automotive applications choose the LCMXO3LF-1300C-5BG256IAHW variant.
