LCMXO3L-1300E-5UWG36CTR - MachXO3 1280 LUTs FPGA 36-WLCSP
MPN: LCMXO3L-1300E-5UWG36CTR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.5 | $6.50 |
| 10 | $5.85 | $58.50 |
| 100 | $5.2 | $520.00 |
| 500 | $4.65 | $2,325.00 |
| 1,000 | $4.1 | $4,100.00 |
| 3,000 | $3.55 | $10,650.00 |
LCMXO3L-1300E-5UWG36CTR Overview
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose digital logic function is defined after manufacturing by the user via a configuration bitstream. FPGAs sit hierarchically between ASICs (Application Specific Integrated Circuits, which are fixed at fabrication) and CPLDs (Complex Programmable Logic Devices, typically non-volatile and lower density). The MachXO3 family is positioned as a control-PLD: bridging logic, bus bridging, power-sequencing, and I/O expansion in systems that also contain a host ASIC, ASSP, or processor. MachXO3L is the low-static-power variant, designed for always-on or battery-backed applications.
Key features of this specific LCMXO3L-1300E part include 1280 LUTs, integrated 65 kbit user flash memory for user-defined parameters, on-chip User Flash Memory (UFM), a hardened I2C, SPI, and timer/counter IP core library, and programmable I/O supporting LVCMOS 1.2 V through 3.3 V standards. The 'E' speed grade provides extended commercial temperature operation, while the 1.2 V core voltage enables ultra-low static current consumption.
Technically, the MachXO3L architecture uses four look-up tables per slice (LUT4) with dedicated carry logic, distributed RAM, and shift-register capability. The 36-ball WLCSP footprint suits space-critical designs such as wearable sensors, mobile accessories, and miniature IoT endpoints where PCB real estate is severely constrained. The device supports Lattice Diamond or Radiant design software for HDL synthesis, place-and-route, and bitstream generation.
Typical applications include I/O expansion and bus bridging in industrial control boards, glue logic and power sequencing in consumer electronics, LED control and backlight management, portable medical sensor hubs, and low-power IoT edge nodes. It is particularly suited to battery-powered or energy-harvesting systems where the low-static-power 'L' sub-family variant minimises quiescent drain.
When designing with this WLCSP variant, pay attention to PCB routing: the 0.4 mm ball pitch requires laser-drilled microvia stack-ups and ENIG or ENEPIG surface finishes for reliable assembly. Use Lattice's reference design PCB footprints in Diamond or Radiant to guarantee ball-to-pad alignment and to minimise tombstoning during reflow. Also account for the device's 1.2 V core supply, which is generated internally by an internal voltage regulator when VCC is applied at the standard 1.2 V rail.
This page synthesizes distributor pricing, drop-in Lattice same-package alternatives, and practical design notes not found in the bare datasheet, giving engineers a single decision-ready reference for selecting the LCMXO3L-1300E-5UWG36CTR against competing control-PLD options.
Drop-in alternatives for LCMXO3L-1300E-5UWG36CTR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with LCMXO3L-1300E-5UWG36CTR (same form factor and footprint) — differing in Package, Mounting Type, Process Technology, Configuration Memory, Core Supply Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
LCMXO3L-2100E-5UWG36CTR
✅ Drop-In📋 Reference alternative (not in catalog)
LCMXO3L-640E-5UWG36CTR
✅ Drop-In📋 Reference alternative (not in catalog)
LCMXO3LF-1300E-5UWG36CTR
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$2.84 / Unit
View Datasheet →LCMXO3L-1300E-5UWG36CTR1K
✅ Drop-In📋 Reference alternative (not in catalog)
LCMXO3L-1300E-5UWG36CTR Maximum Ratings & Electrical Characteristics
| FPGA Family | MachXO3L |
| Number of Logic Elements / LUTs | 1280 LUTs |
| Number of Logic Cells | 1300 cells |
| Process Technology | 65 nm CMOS |
| Core Voltage | 1.2 V |
| Embedded Block RAM (EBR) | 64 kbit (65 kbit per manufacturer source) |
| Distributed RAM | Yes |
| User Flash Memory (UFM) | Yes |
| Number of User I/O | 28 |
| Package | 36-WLCSP (UWG), 0.4 mm ball pitch |
| Speed Grade | E (extended) |
| Mounting Type | Surface Mount (WLCSP) |
| Configuration Memory | Non-volatile, on-chip flash |
| RoHS Status | Compliant |
| Programming Tools | Lattice Diamond, Lattice Radiant |
LCMXO3L-1300E-5UWG36CTR 36-wlcsp (uwg), 0.4 mm ball pitch Pin Configuration Guide
Pin configuration for LCMXO3L-1300E-5UWG36CTR (36-wlcsp (uwg), 0.4 mm ball pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for LCMXO3L-1300E-5UWG36CTR.
Refer to the datasheet for full pin configuration.
Typical Applications
LCMXO3L-1300E-5UWG36CTR is suitable for 6 applications: I/O Expansion and Bus Bridging, Power Sequencing and Control Logic, LED Control and Backlight Management, Industrial Control and Sensor Hub, Portable Medical and Wearable Devices, IoT Edge Node and Smart Sensor.
I/O Expansion and Bus Bridging
The LCMXO3L-1300E-5UWG36CTR excels at I/O expansion and bus bridging in embedded systems where the host ASIC or microcontroller lacks sufficient GPIOs, I2C ports, SPI channels, or UARTs. With 28 user I/Os, integrated I2C and SPI hard IP, and programmable LVCMOS support from 1.2 V to 3.3 V, the device can bridge between 1.8 V sensor buses and 3.3 V host processors without external level shifters. The 1280 LUTs are sufficient for protocol-conversion state machines and timing-critical glue logic. Place the WLCSP on the same PCB as the host, route differential pairs with 90 ohm impedance, and reuse the host's existing 3.3 V rail - the MachXO3L's 1.2 V core is generated internally.
Recommended
Power Sequencing and Control Logic
The LCMXO3L-1300E-5UWG36CTR is widely used for multi-rail power sequencing in systems with multiple voltage domains requiring controlled startup and shutdown ordering. The device's non-volatile configuration memory, programmable I/O thresholds, and integrated timer/counter IP allow precise rail timing without external sequencer ICs. With 1.2 V core operation and ultra-low static current, the part adds negligible quiescent drain to always-on power designs. Place the device near the power-good outputs of each regulator; route gate signals with short, direct traces to minimise switching transients; and leverage the MachXO3L's on-chip flash to store user-defined power-profile parameters across reboots.
Recommended
LED Control and Backlight Management
The LCMXO3L-1300E-5UWG36CTR handles LED matrix driving, PWM dimming, and colour-mixing control in display backlight, signage, and architectural lighting applications. The 1280 LUTs support multiple PWM channels with phase-shifted outputs to reduce flicker and audible noise, while the programmable I/O banks directly drive LED driver enable inputs. The WLCSP package suits ultra-thin displays and miniature lighting controllers. Implement per-channel PWM frequency synthesis using the MachXO3L's on-chip timer/counter IP, route the PWM outputs through current-limiting driver ICs, and use the WLCSP's compact footprint to place the part directly under the LED array.
Recommended
Industrial Control and Sensor Hub
The LCMXO3L-1300E-5UWG36CTR integrates multiple sensor interfaces, debounces mechanical switch inputs, and provides deterministic control loops in industrial automation, factory sensor hubs, and process-control edge nodes. The non-volatile flash configuration ensures deterministic startup after power loss, and the 28 I/Os support multiple digital sensor interfaces concurrently. Industrial-grade variants are available for harsh environments. Place the device near sensor connectors; route digital signals away from switching power sections; use the MachXO3L's internal flash to store calibration constants and serial numbers for field-traceable sensor modules.
Recommended
Portable Medical and Wearable Devices
The LCMXO3L-1300E-5UWG36CTR's ultra-low static power and compact WLCSP package make it ideal for portable medical sensors, wearable health devices, and battery-backed patient-monitoring accessories. The MachXO3L's low quiescent drain preserves battery life during standby, and the small footprint suits wristbands, patches, and disposable sensor designs. The integrated user flash memory stores patient-specific calibration data securely. Use coin-cell or energy-harvesting power; route low-frequency analog signals away from switching nodes; and leverage the MachXO3L's internal timer for sleep/wake duty cycling.
Recommended
IoT Edge Node and Smart Sensor
The LCMXO3L-1300E-5UWG36CTR functions as a low-power protocol co-processor in IoT edge nodes, smart sensors, and battery-operated wireless endpoints. The integrated I2C/SPI/UART hard IP bridges the wireless module to multiple sensors, while the MachXO3L's low static current enables multi-year battery life in energy-harvesting or coin-cell designs. The non-volatile flash allows field reconfiguration over-the-air via the host MCU. Place the device between the wireless module and the sensor cluster; route RF signals with 50 ohm controlled impedance; and use the MachXO3L's internal flash to cache the latest sensor readings during power interruptions.
Recommended
Recommended Products Summary
Engineering reference data for LCMXO3L-1300E-5UWG36CTR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | LCMXO3L-2100E-5UWG36CTR | LCMXO3L-640E-5UWG36CTR | LCMXO3LF-1300E-5UWG36CTR | LCMXO3L-1300E-5UWG36CTR1K |
|---|---|---|---|---|---|
| Package | 36-WLCSP (UWG) | 36-WLCSP (UWG) - same | 36-WLCSP (UWG) - same | 36-WLCSP (UWG) - same | 36-WLCSP (UWG) - same |
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| FPGA Family | MachXO3L (ultra-low static power) | MachXO3L (ultra-low static power) | MachXO3L (ultra-low static power) | MachXO3LF (high-performance I/O) | MachXO3L (ultra-low static power) |
| Number of LUTs | 1280 LUTs | 2100 LUTs (+64%) | 640 LUTs (-50%) | 1280 LUTs (same) | 1280 LUTs (same) |
| Number of Logic Cells | 1300 cells | 2100 cells | 640 cells | 1300 cells | 1300 cells |
| User I/O Count | 28 | 28 | 28 | 28 | 28 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Embedded Block RAM | 64 kbit | 74 kbit (+16%) | 32 kbit (-50%) | 64 kbit (same) | 64 kbit (same) |
| Static Power Profile | Ultra-low (L variant) | Ultra-low (L variant) | Ultra-low (L variant) | Higher (LF variant) | Ultra-low (L variant) |
| Programming Tools | Lattice Diamond / Radiant | Lattice Diamond / Radiant | Lattice Diamond / Radiant | Lattice Diamond / Radiant | Lattice Diamond / Radiant |
Key Differentiators
- Ultra-low-static-power variant in compact WLCSP (vs LCMXO3LF-1300E-5UWG36CTR)
- Optimal LUT density for typical control-PLD tasks (vs LCMXO3L-640E-5UWG36CTR)
- Scalable density within same package footprint (vs LCMXO3L-2100E-5UWG36CTR)
Design Notes
The 36-WLCSP UWG package uses a 0.4 mm ball pitch requiring laser-drilled microvia stack-ups (typically 1-2-4 or 1-2-5 build-up layers) and ENIG or ENEPIG surface finishes for reliable assembly. Use Lattice's reference PCB footprint from Diamond or Radiant library to guarantee ball-to-pad alignment and minimise tombstoning during reflow. Place NSMD (Non-Solder Mask Defined) pads with 0.2 mm diameter and a 0.4 mm pitch; ensure the solder mask opening is at least 0.1 mm larger than the pad to prevent solder ball wicking.
The WLCSP package has limited thermal dissipation capability due to its small footprint. Ensure adequate PCB copper area beneath and around the package for thermal spreading - a thermal via array in the centre balls (per Lattice reference design) is recommended for applications dissipating more than 0.5 W. For ultra-low-power always-on applications in the L variant, thermal management is rarely a bottleneck, but the design should still include the thermal via array as a best practice.
Programmable I/O banks support LVCMOS 1.2 V through 3.3 V signalling; ensure each bank has its own VCCIO rail decoupled with 0.1 uF and 10 uF ceramic capacitors placed within 2 mm of the supply balls. Match trace lengths for parallel-bus interfaces (e.g. SRAM-like buses) to within 1 mm to avoid setup/hold violations. Use controlled-impedance routing (typically 50 ohm single-ended) for high-speed signals, and avoid routing sensitive analog references under the WLCSP package.
Do not confuse the WLCSP UWG package with the QFN package variants - they have different footprints and pin counts. Always verify the package code matches the schematic symbol before PCB fabrication. The 'CTR' end of the part number indicates Tape & Reel; 1000-piece reels are designated with 'CTR1K'. Configuration bitstream generation requires Lattice Diamond (legacy) or Radiant (current) software - ensure the design flow is correctly set up before schematic capture.
Compliance Information
RoHS compliant per Lattice Semiconductor product page. Not AEC-Q100 qualified - choose LCMXO3L-1300E automotive variants for automotive applications. Reach compliance confirmed via Lattice product documentation.
