FPGA & CPLD
Products (6,800+)
LCMXO3LF-1300E-5UWG36ITR1K - 1280 LUT MachXO3LF FPGA, 36-WLCSP | Lattice
The Lattice Semiconductor LCMXO3LF-1300E-5UWG36ITR1K is a MachXO3LF family field-programmable gate array (FPGA) integrating 1280 LUTs (logic elements), 160 LABs/CLBs, 65536 bits of embedded block RAM, and 28 user I/O in a 36-ball WLCSP (Wafer-Level Chip-Scale Package) measuring only 2.54 x 2.59 mm. The device operates from a single 1.14 V to 1.26 V core supply and supports the -40 °C to +100 °C industrial temperature range, making it suitable for space-constrained, low-power applications. The "LF" suffix denotes the low-power, low-static variant of the MachXO3 family with on-chip flash configuration memory, eliminating the need for an external boot PROM. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device containing an array of programmable logic blocks, interconnect, and I/O cells that can be customized after manufacturing to implement arbitrary digital functions, glue logic, or compute pipelines. FPGAs sit above ASICs and microcontrollers in flexibility and below general-purpose CPUs in per-unit cost. The MachXO3 family is Lattice's ultra-low-power platform targeting IO expansion, bridge, and control plane functions in consumer, communications, and industrial designs, while the MachXO3LF adds hardened Embedded Block RAM (EBR) and on-chip flash for instant-on, single-chip operation. Key features of the LCMXO3LF-1300E-5UWG36ITR1K include 1280 4-input LUTs, 65 kb of distributed EBR, built-in user flash and configuration flash (instant-on at <1 ms typical), hardened I/O including hot-socket, pull-up/pull-down, Schmitt trigger, and LVCMOS 1.2/1.5/1.8/2.5/3.3 V support. The WLCSP package eliminates the lead frame and bond wires, minimizing inductance and package height for wearable, smartphone, and small-form-factor designs. The architecture combines LUT-based logic fabric with embedded EBR blocks, dedicated PLL, and hard I/O buffers. Configuration is stored in on-chip flash and can be reloaded via JTAG or SPI in seconds, enabling field upgrades and design iteration without re-bricking devices. The "5" speed grade and "E" enhanced-process indicator place this part in the mainstream performance bin for the family. Typical applications include I2C/SPI GPIO expansion for microcontrollers in IoT edge nodes, low-power sensor aggregation in wearables, LED control and backplane management in display modules, and glue-logic bridging in industrial HMI panels. The combination of single-chip instant-on and ultra-low static current also suits battery-backed always-on subsystems. When designing with this part, plan WLCSP ballout carefully: trace escape must route from the underside BGA pad array using microvia or fan-out PCB technology, and the small package footprint (2.54 x 2.59 mm) requires precise solder paste stencil aperture control. Power sequencing of the 1.2 V core rail must respect the MachXO3 inrush profile or use the internal power-on-reset circuit. This page synthesizes distributor pricing for the LCMXO3LF-1300E-5UWG36ITR1K, drop-in alternative MPNs that share the 36-WLCSP footprint, application circuits, and practical PCB layout notes that complement the Lattice MachXO3 family datasheet.
LCMXO3LF-2100C-5BG324C - 2112 LUT MachXO3LF FPGA | Lattice
The Lattice Semiconductor LCMXO3LF-2100C-5BG324C is a low-power, non-volatile MachXO3LF series Field Programmable Gate Array (FPGA) featuring 2112 Look-Up Tables (LUTs), 279 user I/O, and 75,776 bits of embedded block RAM, housed in a 324-ball CABGA (BG324) package. It operates from a 2.5V/3.3V core supply and supports a commercial temperature range, with a -5 (slower) speed grade optimized for low static power dissipation. An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that allows designers to implement custom digital circuits using arrays of configurable logic blocks (LUTs), programmable interconnect, and dedicated I/O. FPGAs sit above CPLDs and generic logic ICs in the programmable logic taxonomy, and below ASICs in performance/integration density. The MachXO3 family is positioned as a "simplified control PLD" that bridges the gap between traditional CPLDs and larger FPGAs, targeting glue-logic, bus-bridging, and platform-management applications. Key features include 2112 LUTs (4-input look-up tables), 75,776 bits of distributed block RAM, embedded user flash memory, support for multiple I/O standards (LVCMOS 1.2/3.6V, LVTTL, LVDS), per-pin pull-up/pull-down control, and dedicated PLL blocks for clock management. The non-volatile Flash configuration cell eliminates the need for external boot memory, enabling instant-on behavior. The LCMXO3LF architecture uses Lattice's proprietary low-power 40-nm process and embedded memory blocks, achieving sub-100 uA standby current while supporting up to 2112 LUTs. The device integrates hardened I/O buffers, 5K LUTs-equivalent distributed memory, and a 64-bit unique device identifier, simplifying secure provisioning. The 324-ball CABGA package provides 279 usable I/O, making the part well-suited for high-pin-count bridging tasks. Typical applications include consumer electronics display control, IoT sensor aggregation, industrial control panel bridging, automotive infotainment auxiliary controllers (with the -6/industrial variants), and server/embedded add-in software. The device is also well suited to PCIe endpoint bridging, MIPI bridging, and low-speed protocol adaptation. When designing with this part, ensure your pinout planning accounts for the dedicated configuration pins and that you use Lattice Diamond Next or Radiant design software for implementation; the development environment supports latches and is freely available from the manufacturer. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
LCMXO3LF-4300E-5MG121I - 4320 LUT MachXO3LF FPGA | Lattice Semiconductor
The Lattice Semiconductor LCMXO3LF-4300E-5MG121I is a low-density, ultra-low-power Field-Programmable Gate Array (FPGA) from the MachXO3LF series, with 4320 Look-Up Tables (LUTs), 94,208 bits of embedded memory (approximately 11.5 Kbit per LUT-block equivalent), 100 user I/O pins, and integrated 1.2V core supply delivered in a 121-ball Chip-Scale Fine-pitch Ball Grid Array (CSFBGA) surface-mount package. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows designers to configure digital logic blocks, interconnect, and I/O after manufacture. Within the broader taxonomy, this part sits at: MachXO3LF FPGA -> low-density FPGA -> programmable logic device -> logic IC -> semiconductor. The MachXO3LF family specifically targets glue-logic, bridging, control-plane, and instant-on applications where traditional CPLDs or low-end FPGAs are deployed, with ultra-low static and dynamic power suitable for battery-backed and always-on designs. Key features of the LCMXO3LF-4300E-5MG121I include 4,320 LUTs with up to 100 user I/O, embedded block-RAM of approximately 94,208 bits, a hardened I2C/SPI/UART/JTAG configuration interface, built-in user-internal and external oscillators, and on-chip PLLs. The device is built on a 65nm CMOS process technology, operates from a 1.2V core supply, and supports multiple I/O standards across several I/O banks. The "E" speed grade indicates an enhanced performance level and the "I" suffix denotes the industrial temperature range of -40C to +100C. Technically, the MachXO3LF architecture combines LUT-based logic fabric with hardened IP blocks for common functions, allowing very high I/O count for the LUT density. The embedded sleep mode reduces standby current to microamp levels, and instant-on capability allows sub-millisecond wake from configuration memory. The 121-ball CSFBGA (also denoted 121-VFBGA) package offers a compact 8x8 mm ball footprint suitable for space-constrained control-plane PCB designs. Typical applications for this part include I/O expansion and bridging in industrial controllers, glue-logic replacement, platform management for servers and storage, LED control and human-machine interface (HMI) systems, video signal multiplexing in consumer displays, secure boot and control PLD functions in communications infrastructure, and sensor aggregation in IoT edge nodes. When designing with this device, ensure the JTAG programming header (TCK/TMS/TDI/TDO) is accessible for in-system programming and that all VCCIO bank rails are properly decoupled with 100 nF ceramic capacitors adjacent to each power pin. Verify that the chosen configuration mode (typically SPI master from a serial flash) leaves the SPI flash footprint compatible with the Lattice Diamond toolchain. This page synthesizes distributor pricing, same-family drop-in alternatives within the MachXO3LF 121-ball CSFBGA package, and practical design notes that supplement the Lattice datasheet and family reference manual.
LCMXO3LF-6900C-5BG256C - 6864-LUT MachXO3LF FPGA | Lattice
The Lattice Semiconductor LCMXO3LF-6900C-5BG256C is a non-volatile, instant-on MachXO3LF field-programmable gate array with 6,864 LUTs, 240 Kbits of embedded RAM, and 206 I/Os in a 256-pin BGA package. It is designed for low-power system expansion, signal bridging, interface control, and general-purpose programmable logic. The verified distributor data identifies a commercial, slow speed grade and supports operation from 2.5 V and 3.3 V supply rails. Its configuration memory allows the FPGA to retain its programmed logic without continuously powering a separate SRAM-based configuration memory. An FPGA is a programmable digital semiconductor whose lookup tables, registers, interconnects, and I/O blocks are configured to implement custom parallel logic. Within the hierarchy of programmable-logic devices, an FPGA sits above simple programmable logic and below application-specific programmable devices. The MachXO3 family emphasizes low-power operation, instant-on configuration, flexible I/O, and a high I/O-to-logic ratio for control, bridging, and interface-management designs. Key verified features of the LCMXO3LF-6900C-5BG256C include 6,864 LUTs, 240 Kbits of embedded RAM, 206 I/O, a commercial temperature grade, and a slow speed grade. Its 256-LFBGA package supports dense board integration while providing a substantial pin count for high-fanout interfaces. The part is identified as a 2.5 V and 3.3 V programmable device, making it relevant to systems that need configurable logic without committing to an ASIC. The MachXO3LF architecture combines programmable logic, embedded block RAM, and flexible I/O resources in a single device. The 240 Kbits of RAM can be used for buffers, state machines, protocol translation, or small data-processing functions when a design does not require a larger external memory. Its 206 I/Os are useful for bridging legacy peripherals, translating interface signaling, or implementing control logic around processors and sensors. Typical applications include industrial interface expansion, camera and display control, communication bridging, embedded control, and low-power consumer electronics. The LCMXO3LF family is also supported by the MachXO3LF Starter Kit, which contains an LCMXO3LF-6900C-5BG256C device and provides a practical evaluation platform with SPI Flash for boot and dual-boot experiments. Designers should verify pin assignments, voltage-bank requirements, configuration pins, supported I/O standards, clocking, and power sequencing against the manufacturer datasheet before layout. BGA assembly also requires controlled PCB escape routing, inspection, and thermal design. The page combines verified distributor information, lifecycle caveats, datasheet links, and application guidance while leaving unspecified electrical values explicitly marked for data completion.
LCMXO3LF-6900E-5MG256I - 6864 LUT MachXO3LF FPGA | Lattice
The Lattice Semiconductor LCMXO3LF-6900E-5MG256I is a member of the ultra-low-density MachXO3LF family of non-volatile Field Programmable Gate Arrays (FPGAs) that delivers 6,864 Look-Up Tables (LUTs), 206 user I/O, and 245,760 bits of embedded memory in a 256-ball 0.5 mm pitch csfBGA package, with a 1.2 V core voltage and -40C to +100C industrial operating range. FPGAs (Field Programmable Gate Arrays) are user-programmable semiconductor devices built from a sea of configurable logic blocks (LUTs), programmable interconnect, and I/O cells, allowing engineers to implement any digital logic function post-fabrication. The MachXO3LF is Lattice's ultra-low-power, instant-on branch of the MachXO3 family, designed as a control PLD for glue logic, bus bridging, system configuration, and I/O expansion in cost- and power-sensitive applications. Compared with SRAM FPGAs, MachXO3LF uses on-chip Flash configuration memory so it boots in microseconds without an external boot PROM. Key features include 6,864 LUTs (MachXO3LF series), embedded 245,760-bit user Flash memory, distributed RAM, embedded block RAM, two PLL pairs, dual configuration I2C/SPI/SJTAG ports, and on-chip 1.2 V core regulator. The 256-ball csfBGA (MG256) package exposes 206 user I/O across multiple I/O banks supporting LVCMOS 1.2 V to 3.3 V and LVDS signaling standards, with per-pin slew-rate, drive strength, and pull configuration. The LCMXO3LF-6900E grade is the mid-density device between the 4,300 LUT and 9,400 LUT siblings. The architecture uses 65 nm Flash+CMOS process technology with embedded Flash configuration cells that eliminate the need for an external boot memory. The on-chip voltage regulator derives all internal rails from a single 1.2 V core or a 2.5 V/3.3 V single-rail supply, and the hardened I/O bank structure supports hot-socketing and 5 V tolerance on selected banks. The MachXO3LF supports Lattice Diamond and Lattice Propel design environments, plus IP libraries for I3C, I2C, SPI, UART, GPIO expansion, and platform management functions. Typical applications include I/O expansion and bridging in industrial controllers, machine vision cameras, and motor drives; control logic in LED/LCD displays and human-machine interface panels; secure boot monitors and platform management in servers and routers; and as a glue-logic replacement for CPLDs and discrete logic. The instant-on Flash configuration is particularly valuable in safety-critical systems where the FPGA must be active within milliseconds of power-up. When designing with this part, plan I/O bank assignments early because the 206 user I/O are split across four banks with independent voltage references, and unused banks can be powered down to reduce quiescent current. Use Lattice Diamond 3.x or later with the MachXO3LF device library for synthesis, place-and-route, and bitstream generation. This page synthesizes verified distributor pricing from DigiKey and Mouser (as of 2026-10-08), MachXO3LF family drop-in alternatives, and practical design notes not collected in a single location in the Lattice MachXO3LF datasheet.
LFCPNX-100-9LFG672C - 100K LC CertusPro-NX FPGA, 672-BGA | Lattice
The Lattice Semiconductor LFCPNX-100-9LFG672C is a CertusPro-NX family Field Programmable Gate Array (FPGA) built on a 28 nm FD-SOI process, integrating 100,000 logic cells, 3,833,856 bits of embedded memory, and 96000 LUTs in a 672-ball LFG (FCBGA) package. It delivers high-density general-purpose logic fabric with low static and dynamic power consumption characteristic of Lattice's Nexus platform, along with integrated 10G SerDes support for high-bandwidth serial interfaces. An FPGA (Field Programmable Gate Array) is a programmable logic device that allows hardware designers to implement custom digital circuits after PCB fabrication. The CertusPro-NX family sits within the broader taxonomy of programmable logic devices: FPGA -> programmable logic -> logic IC -> integrated circuit. FPGAs differ from CPLDs and ASICs in that they offer far higher logic density, embedded memory blocks, DSP slices, and high-speed transceivers, while remaining reconfigurable in the field. The CertusPro-NX targets advanced general-purpose applications where balance between logic density, I/O bandwidth, and power efficiency is essential. Key features include up to 100K logic cells (LCs), high-speed 10G SerDes transceivers, a generous amount of embedded SRAM distributed across multiple block sizes, and a wide selection of general-purpose I/O. The device supports Lattice's Radiant and Diamond design toolchains and is AEC-Q100 qualified, making it suitable for automotive, industrial, and edge-compute deployments. The 672-ball LFG package exposes 313 user I/O pins, supporting flexible PCB integration. Architecturally, the CertusPro-NX leverages a 28 nm Fully Depleted Silicon-on-Insulator (FD-SOI) process that provides excellent soft-error rate performance, low leakage, and high static power efficiency. Embedded memory is partitioned into large RAM blocks, and the SerDes blocks support multiple protocol standards (PCIe, 10G Ethernet, CPRI) via firmware-loaded PCS layers. The Nexus platform also integrates hardened peripherals including configuration engines, PLLs, and security features. Typical applications include industrial edge AI inference, machine vision, video bridging, automotive sensor fusion, and 5G wireless infrastructure. With its combination of high logic density and low power, the LFCPNX-100 is well suited for battery-powered or thermally constrained deployments where larger 7 nm or 12 nm FPGAs would be impractical. When designing with this device, ensure the PCB provides adequate decoupling (typically 0402/0603 ceramics placed close to each power pin), and allocate sufficient board real estate for the 672-ball BGA escape routing. Developers should use the Lattice Radiant tool suite for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing across five vendors, drops-in alternatives within the LFCPNX family, and practical design notes not consolidated in the manufacturer datasheet.
LFCPNX-100-9LFG672I - 100K LC CertusPro-NX FPGA, 672-BGA | Lattice
The Lattice Semiconductor LFCPNX-100-9LFG672I is a CertusPro-NX general-purpose field-programmable gate array (FPGA) delivering 96,000 logic cells with 3,833,856 bits of embedded memory in a 672-ball caBGA package (LFG672). Built on Lattice's 28 nm FD-SOI Nexus platform, it targets low-power edge applications that need small form factors, high reliability, and high-speed serial connectivity. An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit that lets engineers implement custom digital logic, memory blocks, DSP blocks, and high-speed transceivers after PCB fabrication. FPGAs sit at the heart of embedded systems in a hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. CertusPro-NX is Lattice's advanced general-purpose FPGA family, positioned between low-density ECP5 and high-density Avant devices, optimized for bridging, sensor aggregation, and edge AI inference. Key features include 96K logic cells, 7.4 Mb embedded SRAM, 156 18x18 multipliers, dedicated DDR3/LPDDR4 memory controller hard IP, up to 10 Gbps SERDES lanes for PCIe Gen 3 and 10 GbE, and a wide variety of programmable I/O supporting LVCMOS, LVDS, and MIPI standards. The LFG672 caBGA package with 27x27 mm body footprint is part of the surface-mount BGA family and integrates a high-I/O-count silicon variant of the CertusPro-NX family. From an architectural perspective, CertusPro-NX uses Lattice's Nexus small-form-factor platform combined with hardened system IP such as SERDES and DDR PHY. The 28 nm FD-SOI process delivers improved soft-error rate (SER) and lower soft-error sensitivity compared to bulk CMOS, making the family suitable for industrial and aerospace applications where radiation-induced upsets are a concern. Typical applications include industrial sensor aggregation and machine vision, edge AI inference for low-power vision, motor control and robotics, PCIe bridging for host expansion, and 5G small-cell fronthaul. The 100K LC variant sits in the mid-density sweet spot between the LFCPNX-50 (smaller logic capacity) and LFCPNX-200 (highest density) devices, all sharing the same LFG672 package for migration headroom. When designing with this device, use Lattice Radiant software for synthesis, place-and-route, and bitstream generation. Provide stable power rails for VCC_CORE (0.85 V typical) and VCC_IO bank supplies; bulk decoupling close to each rail pin and a clean SERDES reference clock are critical for 10 Gbps link reliability. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers select and qualify the LFCPNX-100-9LFG672I faster.
LFD2NX-40-8BG256I - Certus-NX 39K LC 192 I/O FPGA | Lattice
The Lattice Semiconductor LFD2NX-40-8BG256I is a Certus-NX low-power general-purpose FPGA IC with 39,000 logic cells, 1,548,288 system gates, and 192 user I/O, housed in a 256-ball LFBGA (CABGA-256) surface-mount package. It is built on the Lattice Nexus platform using a 28nm FD-SOI process and operates from a 1V supply, with an industrial temperature grade. A Field Programmable Gate Array (FPGA) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be rewired after manufacturing to implement arbitrary digital circuits. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) alongside CPLDs, and they are widely used for glue logic, interface conversion, signal conditioning, and parallel processing tasks. Certus-NX occupies the low-power, small-form-factor node of modern FPGA offerings, optimized for energy-efficient designs that still require moderate logic density. Key features of the LFD2NX-40-8BG256I include high-speed transceivers, selectable Low Power vs High Performance modes enabled by programmable back-bias on the FD-SOI process, and AES-256 bitstream encryption with ECDSA authentication for design security. The 256-ball LFBGA package at 0.8mm ball pitch supports compact board integration while exposing 192 user I/O, sufficient for bridging multiple high-speed serial interfaces, sensor aggregation, or industrial control planes. The Nexus platform architecture combines LUT-based logic fabric with hardened I/O and SERDES blocks. FD-SOI (Fully Depleted Silicon-On-Insulator) process technology enables dynamic back-bias control, letting the user trade off static leakage against switching performance on demand. Hardened SERDES, PLLs, and memory controllers reduce soft-logic overhead and improve timing closure versus older 40nm nodes. Typical applications include 5G fronthaul, industrial sensor aggregation, machine vision camera interfaces, and edge-AI inference pre-processing. Choose this part when you need Certus-NX's power efficiency in a dense 256-ball BGA for compact embedded or industrial modules. A primary design consideration: verify signal integrity on the high-speed serial lanes and follow Lattice's recommended decoupling network. The LFBGA package requires careful stack-up planning to meet impedance targets. This page synthesizes distributor pricing, package-compatible drop-in alternatives from the Lattice Certus-NX family, and practical design notes not found on a single manufacturer page.
LFE2-12E-5F256C - 12K LUT FPGA, 193 I/O | Lattice Semiconductor
Lattice Semiconductor Corporation LFE2-12E-5F256C is an ECP2 field-programmable gate array with 12,000 logic cells, 193 I/O, a 1.2 V core supply, and a 256-ball PBGA package measuring 17 mm by 17 mm. The device is associated with a maximum operating frequency of 311 MHz and includes one DSP multiplier block according to the manufacturer-distributor listing. Its -5 speed designation identifies the performance grade used in the LFE2-12E device family. An FPGA is a programmable semiconductor whose logic, routing, and I/O resources can be configured after manufacture. Within the broader semiconductor hierarchy, the LFE2-12E-5F256C is an embedded programmable logic device, followed by the FPGA and CPLD product classes. The ECP2 family combines programmable logic, dedicated DSP capability, embedded memory, and general-purpose I/O in a single surface-mount device, making it useful where a fixed application-specific IC would be costly or inflexible. The principal features are a 12K logic-cell capacity, 193 available I/O, a 1.2 V core voltage, and one DSP block. The 256-BGA package supports dense board layouts but requires careful BGA assembly and inspection because its balls are hidden beneath the device. The 17 mm by 17 mm outline and 311 MHz operating-frequency figure make the part appropriate for embedded control, communication, signal processing, and general programmable-logic designs where the required architecture is not economically suited to a custom ASIC. The ECP2 architecture is designed for general-purpose embedded logic rather than the very large parallel-processing resources associated with high-end FPGA families. This distinction matters when evaluating timing closure, utilization, and tool support. A design must account for the available 193 I/O, embedded memory, clocking resources, and DSP capacity before confirming that the LFE2-12E-5F256C can meet its throughput and latency requirements. Typical design roles include interface bridging, industrial control, embedded protocol handling, test and measurement logic, and compact DSP-assisted signal processing. The single DSP resource is meaningful for multiply-accumulate operations, but designers should verify whether one block is sufficient for the target filter, waveform, or transform. The device can also serve as a companion programmable controller beside fixed-function analog, interface, or power-management components. PCB implementation should account for the 256-BGA assembly process, power and ground distribution, decoupling, and thermal performance. Because the verified data identifies this exact package but does not provide its complete ball map, designers must use the official Lattice package drawing to assign power, ground, configuration, clock, and user I/O balls before schematic capture or layout release. Programming, system configuration, and signal-integrity requirements should likewise be verified against the manufacturer documentation. This product record consolidates verified distributor specifications, package information, comparison data, and practical replacement guidance that are not presented in a single manufacturer table. It also distinguishes same-footprint alternatives from functional alternatives so engineers can assess speed-grade, temperature-grade, and availability changes without assuming automatic interchangeability.
LFE2-12E-5F256I - 12K LUT ECP2 FPGA | Lattice Semiconductor
Lattice Semiconductor LFE2-12E-5F256I is an ECP2 series field-programmable gate array with 12,000 logic elements, 193 user I/O, 226,304 RAM bits and a 256-FPBGA package. The device is identified as a 1.2 V, -5 speed-grade industrial FPGA in distributor listings. It belongs to the ECP2 family of programmable logic devices, providing a compact implementation platform for digital control, interface, signal-processing and embedded system designs. The available technical data identifies the device as a surface-mount FPGA with 256 terminals and an industrial temperature grade. An FPGA is a reconfigurable digital semiconductor whose logic, interconnect and programmable I/O resources are configured after manufacture. The ECP2 family sits within the broader hierarchy of programmable logic devices, alongside CPLDs, and is used where fixed-function logic is insufficient but a large gate count, embedded memory and numerous user I/O are advantageous. LFE2-12E-5F256I combines 12,000 logic elements with 1,500 LABs or CLBs according to the supplied product data, making it suitable for moderately complex control and datapath functions. Key characteristics include 12,000 logic elements, 193 user I/O and 226,304 total RAM bits. The ECP2 architecture is supported by the Lattice ECP2/M family data sheet, and the package is identified as a 256-pin FPBGA measuring 17 mm by 17 mm in the supplied manufacturer-related listing. The -5 designation denotes the speed grade used by the listed ordering information, while the final I indicates the industrial temperature grade. Typical FPGA applications include industrial control logic, communication interface bridges, sensor acquisition, data acquisition, embedded protocol handling and low-power digital controllers. The 193 available user I/O allow a design to connect external converters, transceivers, memory devices, clocks and control signals without requiring a separate programmable-logic package. The 226,304 RAM bits can support buffering, packet storage, lookup structures and other data-retention tasks where external memory would add cost and board area. For new layouts, engineers should confirm the exact pin assignments, bank voltages, configuration interface and decoupling requirements in the LatticeECP2/M family data sheet. The 256-FPBGA package also requires careful PCB design, including via-in-pad or via-in-land practices where supported, adequate power-plane connectivity and thermal analysis for sustained operating conditions. This page consolidates distributor availability, verified ECP2 specifications, practical application guidance and same-brand drop-in candidates for design review.
LFE2-12E-5F484C - 12K LUT FPGA, 297 I/O | Lattice Semiconductor
The Lattice Semiconductor LFE2-12E-5F484C is a LatticeECP2 field-programmable gate array with 12K LUTs, 12,000 logic cells, 297 user I/O, and DSP capability, supplied in a 484-pin FBGA package. It is built on 90 nm process technology, operates from a 1.2 V core supply, and carries the -5 speed designation. A field-programmable gate array is a programmable logic device that combines programmable logic blocks, embedded memory, DSP resources, and general-purpose I/O in one device. In the product hierarchy, an FPGA is a programmable logic semiconductor used to implement parallel processing, control logic, interface bridging, and hardware acceleration. The ECP2 family sits between small CPLDs and larger FPGAs, offering substantially more logic and I/O capacity for communications, industrial control, networking, and embedded signal-processing systems. Principal features of the LFE2-12E-5F484C include 12K LUTs, 12,000 logic cells, 297 user I/O, and dedicated DSP capability. The 484-pin FBGA package supports dense board routing and high external interface counts, while the -5 speed grade identifies the device's performance class. The 1.2 V core supply is suited to systems that distribute low-voltage digital rails close to the FPGA. The source data also identifies tray packaging for this ordering code. Within the ECP2/M family, the same 484-ball footprint is used across speed, temperature, and grade suffixes. Ordering-code changes can therefore affect device qualification and timing characteristics rather than only commercial availability. Engineers should compare the exact suffix, supported I/O standards, configuration method, embedded memory, and timing constraints before substituting a related device. Typical uses for this FPGA include industrial control and automation, networking and communications equipment, embedded video or data acquisition, protocol conversion, and DSP-assisted signal processing. The 297 available I/O make it suitable for designs carrying multiple buses, high-speed transceivers, memory interfaces, and control signals. When designing a PCB around the LFE2-12E-5F484C, follow the Lattice ECP2/M Family Data Sheet for the exact 484-ball pattern, power rails, decoupling requirements, configuration pins, and BGA layout. Because the verified source excerpts do not provide a complete ball-map or verified unit prices, detailed land patterns, I/O standards, and pricing must be confirmed against the manufacturer documentation and authorized distributor quotations.
LFE2-12E-5F484I - 12K LUT ECP2 FPGA | Lattice
The Lattice Semiconductor LFE2-12E-5F484I is an ECP2 field-programmable gate array with 12K LUTs, 297 I/O, DSP support, and a -5 speed grade in a 484-BBGA package. The device is identified as an industrial-temperature FPGA and is based on the Lattice ECP2 family of programmable logic devices. Its principal characteristics from the verified distributor listings are 12K LUTs, 297 I/O, 1.2 V operation, a -5 speed designation, and a 484-BBGA package with 484 terminals. An FPGA is a semiconductor device whose digital logic, interconnect, and embedded DSP resources are configured after manufacture. In the product hierarchy, this part is a field-programmable gate array, which is a programmable logic device within the broader FPGA and CPLD category. It is useful when a design requires parallel logic, programmable data paths, embedded arithmetic, or a high pin count that must be implemented on a compact board area. The 12K LUT figure describes the approximate logic capacity available for digital designs. The listed DSP capability provides dedicated arithmetic resources for suitable filtering, signal-processing, and control functions. The 297 I/O count supports interfaces with external memory, converters, transceivers, and other digital or mixed-signal system components. The -5 speed designation identifies the performance grade, while the industrial temperature marking indicates the intended environmental qualification class. The LFE2-12E-5F484I is packaged in a 484-BBGA, square BGA format with ball terminals. This package is substantially more pin-dense than a leaded package and is intended for compact, high-performance boards. Exact power, voltage tolerances, clock, memory-interface, configuration, and package-dimension details should be confirmed in the Lattice ECP2/M family datasheet before layout or regulatory sign-off. Typical applications include industrial control and factory automation equipment, networking and communications interfaces, embedded video or imaging control, test and measurement systems, and embedded signal-processing products. The industrial grade and high I/O count make the device more appropriate for controlled industrial equipment than for compact consumer products with very low pin-count requirements. Designers should account for the BGA escape-routing rules, power and ground-plane integrity, decoupling placement, configuration-boot requirements, and the high-pin-count manufacturing process. Because the verified listing identifies the package as 484-BBGA, a PCB footprint and assembly process must be checked against the authoritative package drawing. This page combines the verified distributor specifications with engineering guidance and clearly distinguishes documented information from parameters that require the manufacturer datasheet for confirmation. The information on this page is intended to support early design selection and sourcing. It does not replace the manufacturer datasheet, package drawing, or device-errata documents. For production use, verify revision, lifecycle status, temperature ratings, electrical limits, and programming-tool support against the current Lattice documentation.
LFE2-12E-5Q208C - 12K LUT ECP2 FPGA 1.2V | Lattice
The Lattice Semiconductor LFE2-12E-5Q208C is an ECP2 field-programmable gate array with 12,000 logic elements, 12K LUTs, 131 user I/O, and 226,304 bits of embedded block RAM in a 208-pin PQFP package. It operates from a 1.2 V core supply, with a documented supply range of 1.14 V to 1.26 V, and is built on 90 nm CMOS technology. An FPGA is a reprogrammable digital integrated circuit containing configurable logic blocks, programmable interconnect, and embedded memory. Within the semiconductor hierarchy, an FPGA is a programmable logic device, placing it between fixed-function logic ICs and application-specific ICs. The ECP2 family provides a practical balance of logic capacity, I/O availability, embedded RAM, and low power consumption for compact control, interface, and signal-processing systems. The principal device characteristics include 12,000 logic cells distributed across 1,500 logic array blocks, 226,304 bits of total RAM, and 131 user I/O pins. The -5 speed designation identifies the device speed grade, while the Q208C suffix identifies the 208-pin lead-free plastic PQFP configuration. A 311 MHz maximum timing figure is listed in the supplied comparison data. The package is a surface-mount 208-BFQFP measuring approximately 28 mm by 28 mm. The ECP2 architecture supports parallel digital logic, state-machine control, data acquisition, interface bridging, and fixed-point signal processing without requiring a separate external microcontroller. Embedded block RAM can hold data buffers, lookup tables, packet fields, or control state, while the large I/O count permits direct connection to parallel buses, counters, displays, and external converters. Programming is handled through the family's supported configuration workflow and appropriate Lattice design tools. Typical uses include industrial control logic, instrumentation, communication interfaces, embedded display controllers, data-acquisition front ends, and compact sensor-processing platforms. Its 131 available I/O make it suitable for designs that need more parallel external connectivity than smaller ECP2 packages can provide. The 226,304-bit RAM budget also permits buffering multiple data words without relying on scarce external memory. The main design constraint is board area: a 28 mm by 28 mm PQFP is physically larger than modern QFN packages and requires careful routing across two sides of the PCB. Designers should verify speed-grade timing, configuration-scheme requirements, supported I/O standards, and bank-compatible supply rails against the manufacturer datasheet before layout release. This page consolidates distributor availability, exact device identifiers, package information, application guidance, and drop-in alternatives that are not presented together on a single distributor listing. It also distinguishes confirmed web-sourced alternatives from same-family options identified from the ECP2 naming structure, so engineers can assess each substitution before committing a design to production.
LFE2-12E-6F256C - 12K LUT ECP2 FPGA, 193 I/O, 256-BGA | Lattice
The Lattice Semiconductor LFE2-12E-6F256C is an ECP2 field-programmable gate array with 12,000 LUTs, 193 I/O, 226,304 internal configuration bits, a 1.2 V operating supply indication, and a -6 speed grade. The device is supplied in a 256-BGA package according to the verified distributor listing. The LFE2-12E family provides programmable logic resources for embedded control, communications, signal processing, and industrial equipment. The -6 designation identifies the device speed grade, while the F256C package code identifies the 256-ball package configuration. The verified Mouser listing describes the part as an FPGA with 12K LUTs, 193 I/O, and 1.2 V operation. This device belongs to the broader ECP2 FPGA product family, which sits within programmable logic devices, digital semiconductors, and embedded processing systems. Compared with a fixed-function controller, an FPGA allows logic, interface, and timing behavior to be adapted after manufacture. The 256-BGA package supports dense PCB layouts for space-constrained designs, but the ball-grid package requires careful escape-routing, thermal, and assembly planning. The verified data does not provide a detailed manufacturer pinout, power-consumption table, temperature grade, or lifecycle statement for this exact suffix, so those fields remain unconfirmed rather than being inferred. The part is listed by DigiKey, Mouser, Octopart, and other distributors, with live availability and pricing subject to change. For production sourcing, verify the exact package, speed grade, temperature grade, pinout, and regulatory documentation against the manufacturer datasheet before layout release.
LFE2-12E-6F484C - 12K-Cell ECP2 FPGA | Lattice Semiconductor
The Lattice Semiconductor LFE2-12E-6F484C is an ECP2 field-programmable gate array with 12,000 logic cells, 6,000 adaptive logic modules, 297 I/O, and 221 kbit of embedded memory in a 484-pin FBGA package. It operates from a 1.2 V core supply and uses 90 nm process technology. An FPGA is a programmable logic semiconductor that can be configured after manufacture to implement digital control, interface, signal-processing, and embedded systems functions. In the product hierarchy, the LFE2-12E-6F484C is an FPGA, a member of the ECP2 family, and a surface-mounted integrated circuit combining configurable logic blocks with embedded memory and programmable I/O. The device provides 12,000 logic cells organized as 6,000 adaptive logic modules, along with 221 kbit of embedded memory. Its 297 I/O offer substantial connectivity for parallel data buses, control signals, and external interfaces. The -6 designation identifies the device speed grade, while the 484 suffix identifies the high-ball-count package used to support this relatively large I/O count. The 90 nm ECP2 process combines programmable logic with block RAM and dedicated interface resources. Distributed verification data identifies 12,000 logic elements, 6,000 ALMs, 221 kbit of embedded memory, and 297 I/O for closely related ECP2 members. These resources make the part useful for consolidating multiple fixed-function programmable logic functions onto one device while avoiding the development cycle of a custom ASIC. Typical uses include industrial automation and control, embedded communications, data acquisition, instrument interfaces, video and display control, and general-purpose digital signal handling. Its 297 available I/O are particularly valuable when a design must retain many external buses or board-level control signals while performing parallel logic operations internally. PCB design should treat the 1.2 V core rail as a dedicated, carefully decoupled supply and should follow the manufacturer's package ball map, power-plane, and thermal recommendations. Because the available source data does not provide the complete 484-ball assignment, designers should not infer pin functions from the package name and should instead verify every connection against the official device documentation before layout release.
LFE2-20E-5F256C - 21K LUT ECP2 FPGA | Lattice Semiconductor
The Lattice Semiconductor LFE2-20E-5F256C is an ECP2 field-programmable gate array with 21,000 logic cells, 21K LUTs, 193 user I/O, and a 1.2 V supply in a 256-ball fbBGA package measuring 17 mm × 17 mm. It is a commercial-temperature FPGA built with 90 nm CMOS technology and uses the -5 speed designation. An FPGA is a reconfigurable digital-logic semiconductor that belongs to the programmable-logic hierarchy: FPGA → field-programmable logic device → digital semiconductor. Unlike a fixed-function application-specific integrated circuit, an FPGA lets engineers configure parallel logic, state machines, interfaces, and signal-processing functions after manufacture. The ECP2 family therefore supports design adaptation without changing the physical IC, provided the required resources, interfaces, timing, and pin assignment are supported by the selected device. The verified source data identifies 21,000 ECP2 logic cells, 21K LUTs, 193 I/O, and approximately 0.28 Mbit of on-chip RAM. The 256-ball fbBGA package supports compact, high-density PCB layouts, while the 90 nm CMOS process identifies the technology generation used for the device. A 1.2 V core supply is suitable for low-voltage embedded systems, and the -5 ordering code identifies the device’s specified speed grade. The ECP2 architecture is appropriate when a design needs programmable logic resources rather than a fixed controller. Its 193 I/O provide substantial board-level connectivity for clocks, data buses, serial links, control signals, and external memory interfaces. The approximately 0.28 Mbit RAM adds on-chip storage for buffering, state retention, lookup structures, and small packet or frame-processing functions, reducing the need for external memory in suitable designs. Typical uses include embedded control, industrial automation, communications interface bridging, data acquisition, general-purpose digital signal processing, and prototype systems that require reconfigurable hardware. The commercial grade and compact BGA package make the LFE2-20E-5F256C especially relevant to cost-sensitive embedded products that need more I/O and logic than a small microcontroller can provide. Designers should verify the exact pinout, supported I/O standards, bank voltage constraints, clock requirements, and configuration method against the manufacturer documentation before layout release. Because this package contains 256 balls, PCB escape routing, via-in-pad considerations, soldering process, and assembly inspection require careful planning. This page consolidates the verified distributor specifications, package information, a drop-in cross-reference assessment, and practical selection guidance. It also distinguishes documented parameters from details that still require confirmation in the manufacturer pinout and device documentation.
LFE2-20E-5F484C - 21K LUT FPGA, 331 I/O | Lattice
The Lattice Semiconductor LFE2-20E-5F484C is an ECP2 field-programmable gate array with 21K LUTs, 331 I/O, and DSP capability in a 484-BBGA package. It operates from a 1.2 V core supply and is identified as a -5 speed-grade device. The device is intended for programmable digital logic, embedded control, signal processing, and communications designs requiring a large I/O count. An FPGA is a programmable semiconductor whose lookup tables, registers, interconnect, and dedicated blocks can be configured after manufacture. The LFE2-20E-5F484C belongs to the ECP2 FPGA family and provides a hardware platform for parallel logic, state machines, interfaces, control logic, and DSP pipelines. Its 331 I/O make the package especially useful when the design requires substantial external connectivity. The supplied distributor information identifies the device as an ECP2 FPGA with 21K LUTs, 331 I/O, DSP support, 1.2 V operation, and a -5 speed designation. The package is identified as 484-BBGA. Detailed timing, memory, configuration, electrical, and temperature data are not present in the supplied source excerpts, so those values are not asserted here. The design should be checked against the manufacturer datasheet before layout, power budgeting, or production qualification. A -5 FPGA speed designation indicates the manufacturer’s speed-grade family, but the operating-temperature grade and timing margins are not stated in the verified excerpts. The 1.2 V core supply is the confirmed supply value, while external I/O supply requirements, configuration voltage, and power consumption require the full manufacturer documentation. The 484-BBGA package requires a PCB footprint and thermal design appropriate for a large fine-pitch BGA. Typical design uses include industrial automation, communications equipment, video and image processing, embedded control, and general-purpose programmable logic. The large I/O count can support external memory, parallel buses, sensor interfaces, transceiver connections, and control peripherals. DSP capability can reduce external processing hardware when the design uses fixed-point or parallel signal-processing functions implemented within the FPGA. For a new PCB, preserve the exact Lattice package pinout and ball assignment, define clean power and ground planes, and validate high-speed routing with the complete timing and pinout documentation. Do not treat distributor snippets as a substitute for the manufacturer datasheet. This page consolidates the verified distributor identity, package, density, I/O, voltage, and sourcing information while explicitly separating unknown technical details. The practical advantage of this part is its combination of moderate FPGA logic density, extensive I/O, DSP support, and a 1.2 V core architecture. It is more suitable than a small logic device when a design needs substantial parallel connectivity, while the -5 grade should be selected only after confirming timing requirements against the complete Lattice documentation.
LFE2-20E-5F484I - 21K LUT FPGA, 331 I/O | Lattice Semiconductor
The Lattice Semiconductor LFE2-20E-5F484I is a LatticeECP2 field-programmable gate array with 21,000 programmable logic cells, approximately 21,000 LUTs, 331 user I/O, and a 1.2 V core supply in a 484-pin FBGA package. The device uses 90 nm CMOS fabrication and supports advanced DSP blocks, making it suitable for consolidated control, processing, and interface logic. A field-programmable gate array is a programmable digital integrated circuit composed of configurable logic blocks, programmable interconnect, and input/output resources. Within the semiconductor hierarchy, an FPGA is a digital IC, and within programmable logic, the LatticeECP2 family provides a mid-density platform combining logic fabric, block RAM, multipliers, DSP capability, and high-speed I/O. This device occupies the 21K-cell position in the ECP2 family. The verified device characteristics include a 90 nm CMOS process, 1.2 V supply, 21K logic cells, 331 I/O, and a -5 speed designation. Its 484-ball surface-mount FBGA package supports high pin density and is supplied in a manufacturer-standard tray. Mouser classifies the part as an FPGA with 21K LUTs, 331 I/O, and DSP capability. The LFE2-20E-5F484I is positioned for designs where deterministic programmable logic, embedded DSP processing, and a large parallel I/O count are more important than the lowest unit price. Its 484-pin FBGA footprint can support substantial external connectivity, although BGA layout demands careful escape routing, continuous supply planes, and controlled via distribution. Because the complete verified data does not provide pin-level tables, a package drawing should be consulted before layout is released. Typical uses include industrial control and automation, networked data acquisition, video or image-processing front ends, communications infrastructure, and test equipment. The 331 I/O count makes the device appropriate for systems that terminate many parallel buses or high-pin-count expansion interfaces, while the ECP2 DSP resources can accelerate filtering, arithmetic, and signal-processing functions without relying on a separate processor. The primary design consideration is package complexity. A 484-pin FBGA assembly needs thermal-via arrays, short power-plane connections, multiple decoupling positions, and escape routing for configuration, clock, and high-speed interfaces. Signal integrity should be validated against the actual interface rate because the verified web results do not specify a complete I/O performance table. This page combines verified distributor identification, device-family positioning, same-package ECP2 alternatives, and practical BGA design guidance. It also separates confirmed specifications from data that must be checked in the LatticeECP2/M family datasheet before schematic release, PCB layout, or production sourcing.
LFE2-20E-6F256I - 21K LUT ECP2 FPGA | Lattice Semiconductor
Lattice Semiconductor LFE2-20E-6F256I is an ECP2 field-programmable gate array with 21,000 logic cells, 193 user I/O, a 1.2 V core supply, and a -6 speed grade in a 256-ball BGA package. The industrial-temperature device combines programmable logic, embedded block RAM, and DSP resources in a single reconfigurable semiconductor, allowing designers to implement parallel control, signal processing, interface bridging, and protocol handling without relying on fixed-function logic. An FPGA is a programmable semiconductor whose digital circuits are defined through a configuration bitstream rather than a fixed mask set. Within the device hierarchy, the LFE2-20E family is an FPGA and CPLD-class programmable logic device, while ECP2 identifies Lattice Semiconductor's low-cost, low-power ECP2 platform. Its combination of 21K LUTs, 193 I/O, 276 Kb of block RAM, and 90 nm process technology makes it useful when design flexibility, parallel processing, or deterministic hardware control is more valuable than a very high clock rate. The verified distributor information identifies 21K LUTs, 193 user I/O, one DSP block, a 1.2 V core voltage, and a -6 performance designation. It also identifies a 256-pin BGA package and industrial-temperature grading. These characteristics position the device for embedded control, industrial automation, communications infrastructure, test equipment, and embedded video systems where multiple parallel channels must operate under one programmable controller. The ECP2 architecture supports a compact implementation of control logic, data acquisition paths, protocol converters, and DSP-style pipelines. Because the device is configured rather than permanently wired, a single hardware platform can be revised during development without changing the PCB. Designers must still account for configuration setup time, I/O-bank voltage constraints, clocking requirements, and the high pin count and BGA routing demands of the 256-ball package. Typical uses include industrial controllers and factory automation, networking and communications equipment, embedded processing systems, instrumentation, and secure or specialized control logic. The 193 I/O count is particularly useful for parallel buses, status and control signals, and high-pin-count programmable peripherals. The 21K LUT capacity also allows logic consolidation when discrete programmable devices would otherwise increase board area and complicate inventory management. The primary PCB consideration is that a 256-ball BGA requires careful escape routing, a suitable multilayer land pattern, assembly process controls, and power and ground distribution suitable for a 1.2 V core. Engineers should validate the exact ball map, supported I/O standards, configuration method, clocking scheme, and decoupling requirements against the manufacturer documentation before committing the PCB layout. This product record combines verified distributor specifications with practical selection, comparison, application, and design guidance. It also distinguishes an explicitly identified ECP2-family option from unsupported substitute claims, helping engineers identify what is verified and what still requires schematic, pinout, timing, and lifecycle review before a production decision.
LFE2-20E-6F484C - 21K LUT ECP2 FPGA | Lattice Semiconductor
Lattice Semiconductor LFE2-20E-6F484C is an ECP2 field-programmable gate array with 21K LUTs, 331 I/O, a 357 MHz stated maximum frequency, and a 1.2 V supply in a 484-FBGA package. The device is associated with a -6 speed grade and is manufactured using 90 nm CMOS technology in a 23 x 23 mm package. An FPGA is a semiconductor whose digital logic and connectivity can be configured after manufacture. The ECP2 family belongs to the FPGA and CPLD hierarchy within integrated circuits and provides programmable hardware for implementing parallel processing, control logic, interfaces, and fixed-function replacements without changing the PCB. Unlike a fixed ASIC, an FPGA permits design revisions through programmable configuration rather than a full silicon respin. The principal features visible in the verified product data are the 21K LUT count, 331 available I/O, 357 MHz stated operating frequency, 1.2 V core voltage, and -6 speed designation. The LFE2-20E-6F484C designation also identifies a 484-ball package and an approximately 21,000-cell ECP2 device. Its high ball and I/O counts make it appropriate for designs requiring extensive parallel connectivity, multi-bank memory interfaces, or multiple peripheral functions. The device is implemented in 90 nm CMOS and operates from a stated 1.2 V core supply. This architecture places the FPGA within the broader semiconductor and programmable-logic hierarchy while supporting integration of substantial logic resources into one component. Designers must still account for configuration storage, clocking, voltage regulation, signal integrity, and power budgeting when laying out a board around the 23 x 23 mm FBGA. Typical application categories include industrial automation, industrial networking, data acquisition, communications infrastructure, embedded control, and test equipment. The combination of 21K LUTs and 331 I/O can suit parallel sensor aggregation, protocol bridging, motion or machine control, and auxiliary processing beside a higher-level processor. Exact implementation limits depend on timing closure, memory resources, I/O standards, configuration method, and power budget. When designing a PCB for this FPGA, use the manufacturer package drawing and pinout for ball assignment and escape routing. The 484-ball land pattern generally requires multilayer PCB construction with careful power-plane distribution, via-in-pad or microvia strategies where appropriate, and controlled-impedance routing for high-speed interfaces. Decoupling should follow the manufacturer power-supply recommendations rather than relying on generic capacitor values. This product record combines verified distributor specifications, family-level replacement information, and practical implementation considerations that are not presented together on a standard distributor listing. It also distinguishes exact source-supported values from parameters that require confirmation from the manufacturer datasheet before schematic release or PCB layout.
LFE2-20E-6F484I - 21K LUT FPGA, 331 I/O | Lattice Semiconductor
Lattice Semiconductor LFE2-20E-6F484I is an ECP2 field-programmable gate array with 21,000 logic cells, 331 I/O, 331 embedded DSP blocks, a 1.2 V supply, and a -6 speed grade in a 484-ball FBGA package. It provides 2,625 logic blocks and 282,624 embedded EBR bits according to the verified distributor listing, making it a programmable logic device for industrial embedded systems requiring substantial parallel processing and I/O capacity. An FPGA is a programmable semiconductor in the broader category of programmable logic devices and digital semiconductors. Unlike a fixed-function application-specific integrated circuit, an FPGA implements digital logic through configurable lookup tables, routing resources, registers, block RAM, and programmable I/O. The ECP2 family combines these resources on a 90 nm process and supports configurable logic, memory, and DSP-based arithmetic within a single device. Key features include 21,000 logic cells, 2,625 logic blocks, 331 I/O, 331 DSP blocks, 282,624 EBR bits, and a 1.2 V operating supply. The -6 suffix identifies the target device speed grade, while the final I indicates the industrial temperature option. Its 484-FBGA package provides a dense interface arrangement for multilayer PCB designs, although exact ball assignments must be checked against the manufacturer package drawing before layout. The ECP2 architecture is appropriate for control logic, data acquisition, industrial automation, communications, embedded signal processing, and equipment control. Its 21K-cell fabric can host parallel state machines, protocol engines, and DSP pipelines, while 331 I/O provide external interfaces and the verified listing identifies one DSP block rather than a larger DSP inventory. The quoted 331 DSP value is retained exactly because the supplied distributor snippet does not distinguish a physical multiplier count from a logical DSP count. A primary design consideration is that a 484-ball FBGA is not a low-pin-count PCB package. Designers must plan power and ground distribution, controlled-impedance routing, via-in-pad or via-adjacent escape structures where required, and careful ball-grid alignment. The industrial-temperature ordering code must also be checked against the exact system requirements because commercial and industrial variants may use different temperature grades. This page consolidates the verified distributor specifications, package and source links, practical FPGA design guidance, and same-package replacement candidates into one engineering reference. It also distinguishes published values from unavailable information so engineers can verify timing, memory organization, pin assignments, pricing, and lifecycle commitments before committing a new PCB revision.
LFE2-20E-7F484C - 21K LUT ECP2 FPGA, 331 I/O | Lattice
The Lattice Semiconductor LFE2-20E-7F484C is an ECP2 field-programmable gate array (FPGA) providing 21,000 logic cells, 331 user I/O, and dedicated DSP resources in a 484-BBGA package. It is identified as a 1.2 V, -7 speed-grade device by distributor product data, making it suitable for designs requiring a moderately dense programmable logic fabric and substantial parallel I/O. An FPGA is a reprogrammable semiconductor in which the digital logic, interconnect, and programmable I/O blocks are configured after manufacture. Within the semiconductor hierarchy, the ECP2 belongs to the FPGA and CPLD category and to Lattice's ECP2 family. Unlike a fixed-function microcontroller, an FPGA can implement parallel datapaths, control logic, interfaces, and DSP pipelines in one device, allowing hardware behavior to be changed through a configuration bitstream. The verified product information identifies 21K LUTs, 331 I/O, DSP capability, a 1.2 V operating voltage, and a -7 speed designation. The 484-BBGA package also provides a large, mechanically dense footprint suited to boards with space for fine-pitch ball-grid-array routing. Because the supplied distributor data does not enumerate memory resources, embedded multipliers, configuration interfaces, or I/O standards, those details must be confirmed in the Lattice ECP2 family documentation before final schematic and PCB sign-off. Typical uses for a device in this resource class include industrial control and automation, communications infrastructure, embedded video and image processing, instrumentation, and multi-channel DSP-assisted signal processing. The 331-I/O count is especially useful for designs that must connect multiple buses, capture parallel data, or control a substantial number of external signals. The DSP resources allow selected arithmetic and filtering pipelines to be implemented in parallel rather than relying entirely on sequential processor execution. Board-level implementation should follow Lattice's published high-density BGA layout, power, and decoupling guidance. Differential pairs, clock inputs, and high-speed memory interfaces require controlled impedance, continuous return paths, and length matching; the 1.2 V core rail also requires careful sequencing and filtering. Because this MPN is reported as obsolete by one indexed source while distributor listings remain available, procurement planning should confirm lifecycle status, date codes, traceability, and current inventory before a new production release. This page consolidates distributor specifications, package identification, lifecycle signals, and same-family upgrade paths with practical implementation guidance. It also distinguishes confirmed parameters from details that require verification against the manufacturer documentation, helping engineers evaluate fit without treating distributor snippets as a substitute for the complete datasheet.
LFE2-20E-7F672C - 21K LUT FPGA | Lattice Semiconductor
Lattice Semiconductor LFE2-20E-7F672C is a 21,000-logic-cell field-programmable gate array (FPGA) with a maximum frequency of 420 MHz, a 1.2 V operating supply, 402 I/O, 318 Kb of embedded memory, and a 672-ball FBGA package. The device belongs to the LatticeECP2 family and combines programmable logic, DSP resources, and system-level connectivity in a single surface-mount semiconductor package. A field-programmable gate array is a semiconductor whose logic architecture is configured after fabrication. In the device hierarchy, an FPGA is a programmable logic device, while the LatticeECP2 family is positioned as a low-power FPGA family for embedded control, communications, industrial, and consumer applications. Unlike a fixed-function application-specific integrated circuit, the LFE2-20E-7F672C permits design revisions, field updates, and adaptation to multiple control protocols without changing the PCB layout. Key features include 21,000 logic elements or LUTs, 318 Kb of embedded memory, and 402 user I/O. The supplied specifications identify a maximum operating frequency of 420 MHz and a 1.2 V operating supply voltage. Its 672-ball BGA package provides dense routing access for designs requiring numerous external connections. The -7 ordering code denotes the device’s selected speed and temperature ordering option, while exact pin functions, memory organization, DSP count, and I/O standards require confirmation in the manufacturer documentation. The device is manufactured using 90 nm technology according to the verified technical listing. This places it in the ECP2 product class, where configurable logic can implement control, data acquisition, protocol bridging, and embedded signal processing. The 1.2 V supply supports contemporary low-voltage digital systems, but board design must account for separate core and I/O supply requirements where the family documentation specifies them. Configuration, programming, clocking, decoupling, and power sequencing must follow the applicable LatticeECP2 guidance. Typical uses include industrial automation, embedded communications, video or image processing, sensor acquisition, consumer electronics, and compact embedded control systems. The 21K LUT capacity is appropriate for parallel control logic and moderate DSP workloads, while 402 I/O is useful when the design connects multiple buses, displays, converters, or external processors. Exact suitability depends on available routing, clock resources, hard peripherals, memory requirements, and the selected package. When planning the PCB, verify the official 672-ball footprint, ball assignments, exposed-pad requirements, and power planes before layout release. Provide local decoupling according to the family datasheet, design clean clock and configuration paths, and verify signal-integrity behavior for every high-speed interface. Because the supplied web results summarize rather than reproduce the full pinout, the complete package pin list is intentionally not asserted here. This product page consolidates verified distributor specifications, same-family replacement candidates, package details, pricing status, and practical selection guidance. It is intended to accelerate engineering comparison while clearly separating confirmed parameters from information that must be checked in the LatticeECP2 datasheet and package documentation.
LFE2-35E-5F672C - 32K LUT ECP2 FPGA | Lattice Semiconductor
The Lattice Semiconductor LFE2-35E-5F672C is an ECP2 FPGA with 32,000 logic cells, 450 I/O, and a 1.2 V supply in a 672-pin FPBGA package. The device is identified as an LatticeECP2 field-programmable gate array using 90 nm technology, with a 27 x 27 mm package and 311 MHz maximum operating frequency. It is intended for complex logic and memory applications where programmable parallel processing, high I/O density, and embedded block RAM are useful. An FPGA, or field-programmable gate array, is a programmable digital semiconductor that combines configurable logic blocks, programmable interconnect, memory resources, and I/O into one device. The LFE2-35E-5F672C belongs to the ECP2 family, a low-power FPGA platform used for embedded control, communications, signal processing, and general-purpose programmable logic. Its 450 I/O provide substantial connectivity for parallel buses, memory interfaces, and control logic. The verified product information identifies 32,000 cells, 450 I/O, a 1.2 V operating voltage, 90 nm process technology, and a -5 speed grade. The 672-pin FPBGA package is specified as a surface-mount, tray-packaged component. The ECP2 architecture is suited to designs requiring deterministic parallel logic rather than a high-level microcontroller workload, while the large pin count supports high-bandwidth external memory and peripheral connectivity. The LFE2-35E-5F672C is identified as obsolete by GlobalSpec data, so procurement should account for lifecycle risk rather than assuming new production availability. Distributor records and marketplace listings may still show inventory, but availability, pricing, and lead time require confirmation at the time of purchase. A 672-pin BGA package also requires careful PCB layout, controlled reflow, and adequate via-in-pad or fanout routing for reliable assembly. Typical applications include industrial control systems, communications infrastructure, test and measurement equipment, embedded video processing, interface aggregation, and high-density logic prototyping. The device can also be used in FPGA-based embedded systems where programmable logic, block memory, and a large I/O count must coexist on one package. Designers should verify the exact pinout, power rails, configuration method, supported I/O standards, and memory interface requirements against the manufacturer documentation before layout. Since the package exposes 672 balls, power and ground distribution, decoupling, escape routing, and thermal management are especially important. A PCB with adequate layer count, via density, and assembly-process capability should be planned before committing to this footprint. This product page consolidates the verified distributor and manufacturer-oriented specifications, lifecycle status, package information, and same-family replacement candidates into one engineering-focused reference. It also highlights the practical distinction between true package-compatible alternatives and ECP2 devices that require a different footprint.