FPGA & CPLD
Products (6,800+)
LFE2-50E-5F672C - 48K LUT ECP2 FPGA | Lattice Semiconductor
Lattice Semiconductor LFE2-50E-5F672C is an ECP2 field-programmable gate array with 48,000 LUTs, 500 I/Os, a 1.2 V core supply, and a -5 speed grade, packaged in a 672-pin FBGA. The device combines 90 nm CMOS FPGA technology with programmable logic resources for embedded control, interface bridging, signal processing, and system-on-chip designs. An FPGA is a programmable semiconductor whose digital logic, I/O, and embedded resources can be configured after manufacture. Within the product hierarchy, the LFE2-50E-5F672C is a field-programmable gate array, an LatticeECP2 FPGA, a reconfigurable digital logic IC, and a semiconductor intended for embedded systems. Its large 672-ball package supports a high pin count and extensive user I/O, while its 48,000 LUT capacity supports parallel digital logic and DSP-oriented designs. The verified product information identifies 48,000 LUTs, 500 I/O, a 1.2 V supply, a -5 speed grade, and a 672-pin FBGA package. Cross-reference data lists the device as a 50,000-cell FPGA operating at 357 MHz and describes its package as a 27 mm by 27 mm lead-free FBGA-672. These specifications make it relevant to industrial control, communications, instrumentation, and embedded processing systems requiring extensive programmable logic. The LFE2-50E-5F672C belongs to the LatticeECP2 family and uses 90 nm CMOS fabrication technology. Its 396,288-bit configuration-memory value is shown for the closely related 50K ECP2 listing, while the target listing itself is presented as a 48K-LUT device. The ECP2 architecture combines programmable logic with DSP resources, allowing designers to implement control logic, data pipelines, serial interfaces, and protocol handling in one programmable device. Typical uses include industrial automation controllers, communications interface modules, test and measurement equipment, embedded video and control systems, and general-purpose system-on-chip prototypes. The 500 available I/O are particularly useful when a design requires multiple parallel buses, mixed logic interfaces, or high pin-count connectivity. Its 357 MHz listed performance gives the design a concrete clock target, subject to the device's documented configuration and timing conditions. The most important design check is the difference between pin compatibility and complete application equivalence. The verified cross-reference data explicitly describes LFE2-50E-5FN672C as a complete replacement, while other ECP2 ordering codes can differ in speed grade, temperature suffix, or package marking. Engineers should compare the exact Lattice ordering guide, power requirements, configuration scheme, and system timing before approving a substitution. This page consolidates verified supplier specifications, same-package ECP2 alternatives, parameter comparisons, pricing availability status, and practical design guidance. It distinguishes explicitly documented replacement candidates from ordering variants whose exact electrical, temperature, or package details require manufacturer confirmation.
LFE2-50E-6F484C - 48K LUT ECP2 FPGA | Lattice
The Lattice Semiconductor LFE2-50E-6F484C is an ECP2-series field-programmable gate array with 48,000 logic elements, 6,000 LUTs, 396,288 bits of distributed RAM, and up to 339 user I/O in a 484-BBGA package. It operates from a 1.14 V to 1.26 V core supply and is identified as a 1.2 V, -6 speed-grade device. These headline parameters position it for programmable control, interface, signal-processing, and embedded systems requiring moderate logic density and extensive I/O. An FPGA is a programmable semiconductor whose digital logic, interconnect, and I/O behavior are defined after fabrication through a configuration bitstream. Within the product hierarchy, the LFE2-50E-6F484C is a field-programmable gate array, specifically a member of the Lattice ECP2 family and the broader integrated-circuit and semiconductor categories. Compared with a fixed-function ASIC, it permits design revisions, field updates, and adaptation to multiple hardware configurations without changing the PCB. Key features include a nominal 50,000-cell FPGA implementation, 6,000 LUTs, and 396,288 bits of distributed RAM. The device provides 339 user I/O according to distributor listings, making the 484-ball package suitable for designs that need more external connections than a smaller FPGA can offer. Its 1.2 V operating class supports low-voltage digital systems, while the -6 ordering code identifies the device's performance grade. The ECP2 architecture is intended to combine programmable logic with embedded memory resources in a single package. Distributed RAM can be used for buffers, lookup functions, small state machines, and data transformations without requiring external memory for every small storage requirement. The available verified sources do not state the exact number of DSP blocks, PLL count, supported I/O standards, maximum clock frequency, or internal memory organization, so these values must be confirmed in the manufacturer datasheet before design release. Typical uses include industrial automation, test and measurement, communications interfaces, embedded control, video or display control, and general-purpose signal processing. The large I/O count is particularly useful when a design must bridge multiple buses, converters, memories, LEDs, connectors, and communication transceivers while retaining a reconfigurable logic fabric. Designers should confirm power sequencing, decoupling, configuration interface requirements, ball assignments, and high-speed layout constraints against the official LatticeECP2/M family data sheet. Because the supplied web results do not expose a complete 484-ball pin map, the package drawing should not be inferred from a generic BGA layout. This page consolidates the verified distributor specifications, family-level substitute information, application guidance, and design cautions so engineers can compare the LFE2-50E-6F484C against pin-compatible ECP2 options without treating package similarity as proof of complete interchangeability.
LFE2-6E-5F256C - 6K Lattice ECP2 FPGA, 190 I/O | Lattice
The Lattice Semiconductor LFE2-6E-5F256C is a 6,000-cell ECP2 field-programmable gate array with 190 user I/O, 56,320 RAM bits, and a 256-pin FBGA package, optimized for 1.2 V operation. It combines programmable logic, block RAM, and DSP resources in a reconfigurable semiconductor for embedded control, communications, and signal-processing systems. The device operates from 1.14 V to 1.26 V and is specified for a 0°C to 85°C operating junction-temperature range. An FPGA is a programmable digital integrated circuit that can be configured after manufacture to implement logic, state machines, interfaces, and parallel processing functions. The LFE2 family belongs to the broader field-programmable logic and semiconductor hierarchy. Compared with a fixed-function application-specific integrated circuit, an FPGA allows design changes to be implemented through configuration rather than a new silicon layout, making it useful for prototypes, industrial equipment, communications infrastructure, and embedded systems. The LFE2-6E-5F256C provides 6,000 logic elements organized into 750 logic array blocks and includes 56,320 total RAM bits. The verified distributor data identifies 190 user I/O, a 1.2 V supply class, and a 256-FPBGA package measuring 17 x 17 mm. These resources make the device suitable for designs requiring parallel control logic, moderate memory buffering, protocol bridging, and programmable digital signal processing. Lattice ECP2 devices are also positioned for designs that need flexible logic density without the scale of a larger FPGA. The 90 nm ECP2 implementation combines programmable logic with advanced DSP blocks; high-speed SERDES capability is associated with the ECP2M family rather than being assumed for every ECP2 member. For the LFE2-6E-5F256C specifically, design engineers should use the manufacturer datasheet and package documentation to confirm configuration, I/O standards, clocking, power, and exposed-ball assignments before layout. Typical applications include industrial control systems, communications and protocol interfaces, embedded instrumentation, audio and general digital signal processing, data acquisition front ends, and compact embedded processors. Its 190 I/O and 56,320 RAM bits allow the FPGA to connect external memory or peripherals while offloading time-critical logic from a host processor. The 256-pin FBGA footprint also requires careful PCB routing and thermal design because the dense package can make escape routing and power delivery more demanding than a leaded package. When selecting this device, match the FPGA logic, RAM, DSP, clock, I/O, speed-grade, temperature, and power requirements to the exact system specification. A different FPGA with a similar cell count may require different tools, configuration handling, package balls, or I/O standards. This page combines verified distributor specifications, package information, and application guidance; exact pricing and stock status must be confirmed for the current purchase date. This product-data summary is intended to make the LFE2-6E-5F256C searchable for FPGA selection, package matching, and replacement evaluation without implying that every similarly packaged FPGA is pin-to-pin compatible.
LFE2-6E-5F256I - 6K LUT, 190 I/O ECP2 FPGA | Lattice
The Lattice Semiconductor LFE2-6E-5F256I is an ECP2 field-programmable gate array with 6,000 logic cells, 190 user I/O, a -5 speed grade, and a 1.2 V core supply in a 256-ball Fine Pitch Ball Grid Array package. It is designed for compact, parallel digital logic, control, interface, and signal-processing designs requiring programmable nonvolatile configuration and deterministic FPGA performance. A field-programmable gate array is a programmable semiconductor containing configurable logic blocks and programmable interconnect. An FPGA sits above basic fixed-function logic in the hardware hierarchy: programmable logic blocks can be connected by engineers after manufacture, allowing parallel datapaths, state machines, interfaces, and embedded control functions to be consolidated into one device. ECP2 devices combine this reconfigurable architecture with an industrial-temperature option and a high-I/O package. The verified distributor data identifies the device as an ECP2 FPGA with 6K logic cells, 190 I/O, a -5 speed designation, and a 1.2 V operating rail. DigiKey additionally lists 56,320 configuration bits and identifies the physical device as a 256-BGA package. The supplied Microchip USA result describes the package as 17 mm by 17 mm and notes 190 user I/O pins. Its snippet inconsistently states 750 lookup tables, so that value is not used as an authoritative specification. Lattice describes the ECP2/M family as optimized for advanced DSP blocks and, for ECP2M devices, high-speed SERDES. The exact DSP-block count, system frequency ranges, memory quantities, I/O standards, configuration interfaces, and power characteristics are not present in the supplied source text and therefore require confirmation from the complete manufacturer datasheet before design release. The 190-I/O count is especially useful for dense board-level integration, but users must assign pins according to the official package data and bank constraints. Typical uses include industrial control, data acquisition, communications gateways, embedded instrumentation, and parallel processing. The 256-ball package supports fine-pitch assembly but demands careful PCB layout, ball assignment, power-plane distribution, and signal-integrity control. The -5 suffix denotes the supplier-classified speed grade, while the final I suffix is reported by Partstack as an industrial temperature grade. For PCB design, use the manufacturer pinout and package drawing rather than generic BGA assumptions. Validate every power, ground, configuration, clock, and user-I/O ball against the current Lattice documentation. Confirm supported I/O standards and voltage domains before connecting external devices. This page synthesizes the supplied distributor records, package details, and replacement cross-references into an engineering-oriented procurement and selection summary.
LFE2-6E-5T144C - 6K LUT FPGA, 90 I/O | Lattice Semiconductor
The Lattice Semiconductor LFE2-6E-5T144C is an ECP2 field-programmable gate array (FPGA) with 6,000 LUTs, 90 I/O, and a 144-LQFP package. The supplied distributor data identifies the device as a 1.2 V, -5 speed-grade ECP2 FPGA with a 20 x 20 mm lead-free package. It is positioned for programmable logic, control, interface, and embedded digital systems where a compact, high-pin-count FPGA is required. An FPGA is a programmable digital integrated circuit whose logic and interconnect resources can be configured after manufacture. In the broader hierarchy, an FPGA belongs to programmable logic devices and sits above basic logic gates but below application-specific processors and systems. The LatticeECP2 family provides configurable logic blocks, programmable routing, dedicated resources, and I/O structures for parallel and serial digital designs. The LFE2-6E-5T144C combines 6,000 LUTs with 90 I/O in a 144-lead LQFP package. The -5 designation is associated with a -5 speed grade in the distributor listings, while the package code and gull-wing terminal description identify a 144-terminal surface-mount FPGA. The exact core voltage, operating-temperature range, embedded-memory configuration, block-resource quantities, and pin functions were not included in the supplied verified data and are therefore not inferred here. Typical design uses include industrial control logic, data-acquisition front ends, communications-interface bridges, instrumentation, embedded test equipment, and general-purpose digital prototyping. The 90-I/O count can be valuable when a design requires multiple parallel buses, control signals, or high-speed external interfaces. Designers should still confirm pin availability, voltage standards, and timing constraints against the official Lattice ECP2 documentation before schematic capture. A key design consideration is power planning. The distributor result identifies a 1.2 V FPGA, but the supplied data does not state core current, I/O current, power consumption, junction temperature, or thermal resistance. Those values must be taken from the manufacturer datasheet and the actual switching activity of the implemented design. Decoupling, ground-plane continuity, and pin-compatible replacement verification remain essential during PCB implementation. This page consolidates the verified distributor identity, package information, device resource summary, availability links, and engineering-oriented application context. It distinguishes documented facts from parameters that require confirmation from the Lattice Semiconductor datasheet rather than estimating values.
LFE2-6E-5T144I - 6K LUT, 90 I/O FPGA | Lattice
The Lattice Semiconductor LFE2-6E-5T144I is a 6K-LUT ECP2 field-programmable gate array with 90 user-programmable I/O pins, 56,320 RAM bits, and a 1.2 V supply class, packaged in a 144-pin TQFP. The I suffix identifies the industrial-temperature offering, while the -5 speed grade and 144-pin package support designs requiring deterministic programmable logic in industrial embedded systems. A field-programmable gate array, or FPGA, is a programmable semiconductor used to implement control logic, interfaces, protocol handling, datapaths, and DSP functions after board fabrication. Within the broader semiconductor hierarchy, an FPGA combines configurable logic blocks, programmable interconnect, block RAM, and I/O resources. This makes it useful when a design requires rapid revisions, parallel channels, mixed logic functions, or a compact controller that would otherwise require several fixed-function devices. The verified product data identifies 6K LUTs, 90 I/O, 56,320 RAM bits, and a 1.2 V operating class. A 144-TQFP package provides 144 physical leads and a surface-mount form factor suitable for automated PCB assembly. The available listing data also reports 90 I/O and a 144-TQFP package, while detailed pin assignments, block counts, pin standards, and configuration interface details require the manufacturer datasheet before layout or replacement approval. Typical ECP2 applications include industrial control, instrumentation, embedded communication, motion-control logic, and general-purpose programmable signal conditioning. The programmable architecture lets designers consolidate parallel control functions into one FPGA, while the 90 I/O count supports external memory, converters, communications transceivers, status indicators, and actuator or sensor interfaces. Designers should verify voltage tolerances and pin multiplexing against the device-specific pinout rather than relying only on the package name. For robust implementation, begin with the manufacturer pinout and power specifications, then define bank voltage constraints before assigning external interfaces. Place decoupling capacitors close to every supply pin, preserve the package footprint and exposed thermal requirements specified by the manufacturer, and program the device using the supported Lattice toolchain. A hardware replacement is valid only after checking pinout, I/O standards, supply rails, timing, configuration interface, and temperature grade. This product page consolidates verified distributor and cross-reference information, practical selection guidance, and design cautions for engineers evaluating the LFE2-6E-5T144I. Exact price, lead time, stock status, pin-level electrical limits, and full timing/resource parameters are not supplied consistently in the provided source data and should therefore be confirmed before procurement or PCB release.
LFE2-6E-6F256C - 6K LUT 190 I/O FPGA | Lattice Semiconductor
The Lattice Semiconductor LFE2-6E-6F256C is a 6,000-cell ECP2 field-programmable gate array with 6,000 LUTs, 190 I/O, 55 Kb block RAM, and a 1.2 V supply in a 256-pin FBGA package. Its -6 speed grade and DSP support suit compact control, interface, signal-processing, and embedded-logic designs requiring a high pin count and deterministic programmable logic. An FPGA is a semiconductor device whose digital behavior is defined by loading a configuration bitstream after manufacture. The ECP2 family belongs to the broader programmable-logic hierarchy and combines LUT-based combinational logic, embedded block RAM, programmable I/O, and dedicated DSP resources. This combination allows designers to implement parallel data paths, protocol handling, state machines, and control functions on one device. The verified listing identifies the LFE2-6E-6F256C as a 6K-LUT device with 190 I/O and DSP support at 1.2 V. Independent indexing also identifies the device as a 256-pin FBGA using 90 nm technology. These figures make the part relevant to industrial control, communications, test equipment, consumer electronics, and embedded systems that need more routing resources and I/O than a small programmable logic device can provide. The LFE2-6E-6F256C belongs to the LatticeECP2 family. Its large I/O count can simplify board-level connections when the design uses multiple buses, parallel data interfaces, or multiple external peripherals. The 55 Kb block RAM figure applies explicitly to the verified LFE2-6E-6FN256C family member; the supplied search data does not state that figure for LFE2-6E-6F256C, so that value is not used as a target specification here. For a new board, engineers should verify power rails, configuration interface support, I/O standards, pin constraints, and the exact package drawing before layout. Because the available evidence confirms 256 FBGA and 190 I/O but does not provide a complete manufacturer pin table, detailed ball assignments and electrical limits should be taken from the official Lattice documentation rather than inferred from distributor summaries. This page consolidates distributor availability, family-level technical context, procurement questions, and design cautions. It distinguishes verified facts from unavailable details and avoids treating generic FPGA advice as device-specific performance data. Check current distributor inventory and quote terms directly before committing a production BOM.
LFE2-6E-6F256I - 6K LUT FPGA, 190 I/O, 256-BGA | Lattice
The Lattice Semiconductor LFE2-6E-6F256I is an ECP2 field-programmable gate array with 6,000 logic elements, 56,320 total RAM bits, and 190 general-purpose user I/Os, housed in a 256-pin fine-pitch ball grid array package. It is designed for embedded programmable-logic applications requiring moderate logic density, parallel I/O, and configurable DSP resources. An FPGA is a programmable semiconductor whose logic, interconnect, and memory resources can be configured after fabrication. The LFE2-6E-6F256I belongs to the ECP2 family and provides a compact implementation platform for control logic, data acquisition, protocol bridging, and embedded signal-processing functions. Its 6K LUT class can consolidate multiple fixed-function blocks into one device while retaining field-updatable firmware. Key verified features include 6,000 logic elements, 750 equivalent logic blocks, 190 user I/Os, 56,320 RAM bits, and a 1.2 V supply designation. Distributor listings identify the device as an ECP2 FPGA with a -6 speed grade and industrial temperature designation. The package is identified as a 256-BGA package. The ECP2 architecture is useful when a design needs programmable routing and logic rather than a fixed application-specific integrated circuit. The 190 I/O count provides substantial parallel connectivity for buses, counters, control signals, and external memory interfaces, while the available logic and RAM resources support moderate state machines and buffering. Exact timing, voltage tolerances, configuration details, and pin functions should be confirmed in the manufacturer data sheet before layout or production release. Typical applications include industrial control and factory automation, communication-interface bridging, instrumentation and test equipment, embedded data acquisition, and compact control systems. The FPGA can consolidate interface logic and control functions, reducing component count when firmware flexibility is important. When designing a board, preserve the manufacturer's recommended power, decoupling, configuration, clocking, and ball-grid-array layout requirements. Validate signal integrity and thermal performance across the complete operating temperature range and programmed logic configuration. This page consolidates verified distributor and product data, application guidance, package information, and selection considerations for engineers evaluating the LFE2-6E-6F256I.
LFE2-6E-6FN256I - 6K LUT FPGA, 190 I/O, 256-BGA | Lattice
The Lattice Semiconductor LFE2-6E-6FN256I is an ECP2 field-programmable gate array with 6,000 logic cells, 190 I/O, 56,320 RAM bits, and a 256-ball FBGA package. It operates from a 1.14 V to 1.26 V supply, supports an industrial temperature range of -40°C to +100°C, and is identified in the supplied data as a 1.2 V, -6 speed-grade device. An FPGA is a programmable semiconductor containing configurable logic blocks, programmable interconnect, and I/O resources. Within the product hierarchy, the LFE2-6E-6FN256I is an FPGA, a member of the Lattice ECP2 family, and an example of a programmable logic device used for parallel processing, control, interface bridging, and embedded signal-processing functions. Its 750 LABs organize the available logic into flexible blocks, while the 190 I/O provide connections between the programmable core and external circuitry. Key features include 6,000 logic cells, 56,320 embedded RAM bits, 190 user I/O, and a 1.14 V to 1.26 V core-supply range. The package is a 17 mm by 17 mm, lead-free FPBGA-256. The “6” speed designation and the “-6” ordering code identify the performance grade, while the trailing “I” identifies the industrial temperature option. The 256-ball package supports dense routing for designs requiring numerous external connections. The ECP2 architecture combines programmable logic with embedded block RAM for designs requiring both control logic and local data storage. A 357 MHz maximum frequency is reported in the supplied component listing, making timing closure an important consideration for clocked datapaths. Because this device belongs to a mature FPGA family, engineers can use its configuration ecosystem and established design flows rather than developing fixed application-specific logic. Typical uses include industrial control and automation, communication interfaces, test and measurement equipment, embedded video or display control, and peripheral expansion for microcontrollers or processors. The 190 I/O are useful for parallel buses, status and control signals, and multi-bit data interfaces, while the embedded RAM can support buffers, packet processing, or state-holding functions. PCB design requires careful BGA fanout, differential-pair routing, ground-plane continuity, and decoupling around the 1.2 V supply rails. Designers should obtain the manufacturer pinout and power-decoupling guidance before routing the 256-ball footprint. Configuration programming and signal-integrity verification should also be included in the design plan rather than treated as late board-layout steps. This page consolidates the verified device specifications, current distributor information, package details, and same-family drop-in alternatives. It also adds application guidance and engineering checks that are not presented as a single manufacturer-datasheet conclusion, helping teams compare speed grades, temperature options, and package-compatible alternatives before committing to a PCB design.
LFE2-6E-6T144C - 6K LUT, 90 I/O FPGA | Lattice Semiconductor
The Lattice Semiconductor LFE2-6E-6T144C is an ECP2 field-programmable gate array with 6K LUTs, 90 I/O, 6,320 logic cells, and a 144-pin TQFP package. Its 1.2 V core and -6 speed grade make it a compact programmable-logic device for embedded control, interface bridging, signal conditioning, and industrial automation. The verified distributor listing identifies the device as a LatticeECP2 FPGA manufactured using 90 nm technology and supplied in a tray package. A field-programmable gate array is a semiconductor whose configurable logic and interconnect resources implement digital functions after fabrication. An FPGA occupies the programmable-logic portion of the wider semiconductor hierarchy, above fixed-function logic ICs and below application-specific programmable systems. The ECP2 family combines programmable logic blocks, memory resources, digital signal processing capability, and general-purpose I/O in one reconfigurable device. This makes the LFE2-6E-6T144C useful when design rules change faster than a custom ASIC can be produced. Key features include 6K LUTs, 6,320 cells, 90 I/O, a 1.2 V supply, and a -6 speed designation. The 144-pin TQFP package provides 144 external terminals in a surface-mount gull-wing format. Verified web results describe the part as an ECP2 FPGA with DSP capability, but detailed block counts, I/O standards, memory parameters, and timing values were not supplied in the retrieved evidence. Those values should therefore be confirmed against the manufacturer datasheet before a design is released. The part’s architecture is appropriate for glue-logic implementations, protocol conversion, control-plane logic, parallel data acquisition, and compact embedded systems. Its 90 I/O count can reduce the need for external programmable peripherals when the board-level pin budget is constrained. The -6 designation identifies the manufacturer’s speed grade, while the commercial C suffix appears in the ordering code; the retrieved evidence does not provide the exact commercial-temperature limits. Typical uses include industrial controllers, sensor aggregation modules, test equipment, embedded communications bridges, and compact control systems. A 1.2 V FPGA core simplifies power partitioning when the surrounding board already includes a 1.2 V rail, but external interface voltage levels must be selected independently and checked against the actual I/O specifications. The 144-pin package is larger than common QFN options, so PCB area and routing resources must be included in the mechanical design. For a new board, place the FPGA close to its clocks, decoupling network, configuration interface, and high-speed I/O routes. Keep power and ground connections short, follow the manufacturer’s recommended land pattern, and validate signal integrity for any external interface. This page consolidates verified distributor specifications, procurement information, replacement analysis, and engineering guidance rather than repeating only the part-number description.
LFE2-6E-6T144I - 6K LUT FPGA, 90 I/O, 1.2 V | Lattice
The Lattice Semiconductor LFE2-6E-6T144I is an ECP2 series field-programmable gate array with 6,000 logic cells, 90 I/O, and 56,320 RAM bits in a 144-LQFP surface-mount package. The verified product data identifies a 1.2 V device with a -6 speed designation and an industrial temperature option encoded by the part number. Its architecture combines programmable logic resources, block RAM, and dedicated DSP capability in a compact programmable-logic device suited to embedded control, signal processing, communications, and industrial equipment. An FPGA is a reconfigurable digital semiconductor that contains configurable logic blocks and programmable interconnect. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA can be programmed after manufacture to implement control logic, data paths, interfaces, and algorithms. The ECP2 family belongs to the broader FPGA and programmable-logic hierarchy, combining flexible parallel hardware with configuration-based design updates. The LFE2-6E-6T144I provides 6K logic elements, 90 I/O, and 56,320 RAM bits according to DigiKey and Mouser results. One supplier result also identifies 750 logic array blocks or configurable logic blocks, while the available data reports a 1.14 V to 1.26 V supply range and an operating junction temperature beginning at -40 °C. The -6 speed grade identifies the device speed option, but the supplied data does not establish the complete timing table, configuration interface details, or absolute maximum ratings. Typical uses include industrial control logic, sensor and acquisition systems, communications interface aggregation, low-power signal processing, and embedded instrumentation. The 90-I/O count provides substantial board-level connectivity for buses, status signals, control outputs, and external interfaces. The 56,320 RAM bits can support buffering, packet storage, counters, and small data tables, while the FPGA architecture allows parallel operations without relying on sequential processor execution. When designing around this device, verify the exact pinout, configuration memory interface, clock requirements, supported I/O standards, and bank voltage constraints in the LatticeECP2/M family data sheet. Do not infer pin compatibility solely from a matching package. The supplied search data supports the core resource and package claims, but not a complete manufacturer-qualified replacement list. This page combines verified distributor specifications, application guidance, and design cautions for engineers evaluating the LFE2-6E-6T144I. It distinguishes documented facts from unavailable parameters so procurement and hardware decisions can be made without inventing electrical or timing data.
LFE2-6E-6TN144C - 6K LUT ECP2 FPGA, 144-LQFP | Lattice
The Lattice Semiconductor LFE2-6E-6TN144C is a member of the LatticeECP2 (ECP2) family of Field Programmable Gate Arrays (FPGAs) fabricated on a 90 nm CMOS process, integrating 6,000 Look-Up Tables (LUTs), 56,320 flip-flops (or system gates), and 90 user I/O in a 144-pin TQFP/LQFP (TQ = Thin Quad Flat Pack) surface-mount package. The device features a -6 speed grade, operates from a 1.2 V core supply, and supports embedded DSP blocks for low-cost signal processing. The "E" suffix denotes the ECP2 family (low-cost, high-volume) while "C" denotes the commercial temperature grade. An FPGA (Field Programmable Gate Array) is a semiconductor device whose logic functionality is defined after manufacturing by the user via a configuration bitstream loaded into on-chip SRAM. FPGAs sit hierarchically under programmable logic -> logic devices -> digital integrated circuits -> semiconductors. Unlike ASICs, FPGAs offer rapid prototyping, in-field re-programmability, and parallel hardware execution, making them ideal glue logic, interface bridging, and pre-silicon validation platforms. Key features of the LFE2-6E-6TN144C include 6,000 LUTs, 56,320 flip-flops equivalent in system gates, 90 user I/O pins, embedded sysDSP blocks for multiply-accumulate operations, dedicated DDR memory interface support, and on-chip PLLs for clock management. The device supports multiple I/O standards including LVCMOS, LVTTL, PCI, LVDS, SSTL, and HSTL. The 144-pin TQFP package is 22 mm × 22 mm with 0.5 mm pitch. The ECP2 architecture combines high-performance FPGA fabric with low-cost positioning, providing 311 MHz internal operation and pre-engineered IP cores through Lattice's ispLeverage / Lattice Diamond design tool chain. Embedded DSP blocks (typically 18×18 multipliers) accelerate signal-processing functions at lower power than soft multipliers implemented in LUT fabric. Hardened memory interface controllers simplify DDR1/DDR2 PHY integration. Typical applications include industrial control and factory automation glue logic, telecom interface bridging (SPI, I2C, UART, parallel buses), video processing front-ends, low-volume prototyping replacement for aging CPLDs, motor control and encoder interfaces, and medical/portable instrumentation requiring low-power programmable logic. The 6K LUT density suits medium-complexity state machines, bus conversion, and DSP pre-processing. When designing with this part, ensure all I/O banks receive proper VCCIO rail voltages matching the chosen I/O standard (1.2 V–3.3 V) and that the JTAG chain is properly terminated for in-system programming. Always validate timing closure at the chosen fMAX using Lattice Diamond timing analysis, as the 311 MHz figure is best-case for internal register-to-register paths only. This page synthesizes distributor pricing, drop-in alternatives within the ECP2 family, and practical design notes not consolidated in the manufacturer datasheet, helping engineers select the right speed grade, temperature grade, and package variant for production.
LFE2-6E-7F256C - 6000-LUT FPGA, 190 I/O, 256-BGA | Lattice
The Lattice Semiconductor LFE2-6E-7F256C is an ECP2 field-programmable gate array with 6000 logic cells, 190 I/O, a 420 MHz maximum operating frequency, and a 256-ball BGA package. It is designed for compact programmable-logic applications requiring substantial logic capacity, parallel interfaces, and embedded DSP resources. The -7 speed designation and 1.2 V supply place it in the performance-oriented portion of the LatticeECP2 family. An FPGA is a semiconductor whose digital logic and interconnects are configured after manufacture. In the broader hierarchy, an FPGA is a programmable logic device and therefore a type of semiconductor IC. ECP2 devices combine LUT-based logic, programmable routing, block RAM, DSP capability, and user I/O in one package. This combination allows designers to implement control logic, interface bridges, packet processing, signal conditioning, and embedded data pipelines without relying on a custom ASIC. Verified distributor data identifies this device as an ECP2 FPGA with 6000 cells, 190 I/O, and a 256-BGA package. The LFE2-6E-7F256C also appears in comparison data as a 420 MHz, 6000-cell PBGA256 device measuring 17 x 17 mm. Its 190 available I/O support substantial board-level connectivity, while the ECP2 architecture provides a practical balance between logic density, programmable functionality, and device integration. The suffix C denotes a commercial-temperature ordering code in the supplied comparison data, but the complete temperature range is not available in the provided sources. Typical applications include industrial automation, communications infrastructure, embedded control, video and image processing, data acquisition, and DSP-assisted signal processing. Its 190 I/O are useful when an interface must connect multiple buses, counters, memory devices, converters, or control peripherals. Its 6000-cell capacity is suitable for parallel datapaths and moderate protocol stacks, although design headroom should be checked against routing, timing, RAM, DSP, and pin-assignment requirements before committing to a production build. For reliable implementation, use the manufacturer pin table and package information rather than generic BGA assumptions. Decoupling, bank-supply requirements, configuration pins, clock topology, I/O standards, and unused-ball treatment must follow the LatticeECP2/M Family Data Sheet. A programmable device also depends on a valid bitstream, correct configuration clocking, and a suitable Lattice programming interface. This page consolidates the supplied distributor listings, package information, and cross-reference evidence. It separates verified values from unavailable electrical details and does not infer pricing, lifecycle, pinout, or compliance claims that were not established by the source data. Engineers should evaluate the LFE2-6E-7F256C when a 6000-cell FPGA, 190 I/O, 420 MHz-class performance, and 256-BGA integration align with the design. Confirm timing closure, memory and DSP availability, package ball assignments, and supply status in the official documentation before hardware release.
LFE2-6E-7T144C - 6K LUT ECP2 FPGA | Lattice Semiconductor
Lattice Semiconductor LFE2-6E-7T144C is an ECP2 field-programmable gate array with 6,000 logic cells, 56,320 embedded RAM bits, and 90 user I/O in a 144-pin LQFP package. The verified product data identifies a 1.2 V device with a -7 speed designation and DSP capability. It is designed for compact programmable-logic applications where moderate logic density, embedded memory, and a large pin count are useful without moving to a larger FPGA. What is an FPGA? A field-programmable gate array is a reconfigurable digital integrated circuit containing programmable logic, memory, and input/output resources. An FPGA belongs to the programmable-logic hierarchy and can be programmed after manufacture to implement control logic, interfaces, data acquisition, signal processing, or embedded systems. The LatticeECP2 family combines programmable logic blocks, DSP resources, and I/O in an integrated device. The LFE2-6E-7T144C is identified by the verified sources as an ECP2 FPGA with 6,000 logic elements, 90 user I/O, 56,320 bits of on-chip RAM, and a 144-LQFP package. The separate product references also describe 750 logic blocks and a 1.14 V to 1.26 V supply range. The -7 speed code is retained from the verified listing, while the commercial temperature grade and full timing details require confirmation from the manufacturer datasheet. Its 90 user I/O make the device suitable for systems that need multiple external interfaces, parallel buses, status signals, or mixed control and data paths. The 144-LQFP package provides a conventional surface-mount footprint and exposes substantially more pins than a small FPGA package. Designers should account for package routing, power distribution, signal integrity, and thermal performance in the final PCB design. Typical uses include industrial control, instrumentation, embedded data acquisition, communications interfaces, DSP-assisted signal processing, and compact embedded control platforms. The DSP feature cited in the verified listings can reduce external processing hardware when the design uses suitable fixed-point operations and parallel datapaths. Before finalizing a design, verify the pinout, bank voltages, supported I/O standards, configuration method, clock requirements, and power-sequencing constraints against the LatticeECP2/M Family Data Sheet. The available search data does not provide a manufacturer-controlled purchase price or complete pin-level assignment, so those details must not be inferred. This page combines verified distributor specifications, package information, application guidance, and strict replacement criteria for engineers evaluating the LFE2-6E-7T144C.
LFE3-17EA-6MG328C - 17K LUT ECP3 FPGA, 116 I/O, 328-CSBGA | Lattice
The Lattice Semiconductor LFE3-17EA-6MG328C is a member of the LatticeECP3 family of low-power, high-performance Field Programmable Gate Arrays (FPGAs), offering 17,000 logic elements (17.3K LUTs), 716,800 bits of embedded SRAM, and 116 user I/O in a 328-ball Chip-Scale BGA (CSBGA / LFBGA) package. It is fabricated on a 65 nm CMOS process and operates from a 1.2 V core supply, with the -6 speed grade targeting cost-sensitive mainstream applications. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (LUTs), programmable interconnect, and dedicated hard IP such as SERDES, PLLs, and block RAM. FPGAs sit between general-purpose microcontrollers and fixed-function ASICs, offering hardware-level parallelism with full software-style reprogrammability. The LatticeECP3 family specifically targets low-cost, high-volume serial connectivity applications, distinguishing itself from pure CPLDs by integrating multi-gigabit transceivers directly on-die. Key features of the LFE3-17EA-6MG328C include up to 16 SERDES channels supporting data rates from 150 Mbps (8b/10b-encoded) to 3.2 Gbps, dual-channel SERDES supporting protocols such as PCI Express, SGMII, and XAUI, distributed and block RAM totaling 716,800 bits, and embedded sysDSP slices for signal processing. The 65 nm process combined with 1.2 V core operation delivers the typical low-power consumption that defines the ECP3 value proposition. Typical applications for this device include cost-optimized telecom bridges, low-density serial protocol aggregation (SGMII, XAUI, PCIe Gen1), industrial control planes, video processing pre-processing, and embedded control with parallel processing. The 116 user I/O and 17K LUT density suit designs where higher-end Virtex or Stratix-class FPGAs would be overkill, but pin-compatible alternatives exist for design migration. When designing with the LFE3-17EA-6MG328C, ensure the PCB footprint matches the 328-ball CSBGA land pattern exactly and that the supporting power supply decoupling follows Lattice's TN1207 reference. The -6 speed grade balances Fmax and cost; the -7 grade delivers higher Fmax at higher price. This page synthesizes real-time distributor pricing, drop-in same-package alternatives, and engineering-grade design notes that go beyond the manufacturer datasheet headline parameters.
LFE3-35EA-6FTN256I - ECP3 33K LUTs FPGA 1.2V | Lattice
The Lattice Semiconductor LFE3-35EA-6FTN256I is a member of the LatticeECP3 family of low-power, high-performance Field-Programmable Gate Arrays (FPGAs), fabricated on 65 nm technology and delivering 33,000 LUTs with up to 133 user I/O in a 256-ball ftBGA package. The device operates from a 1.2 V core supply and is offered in the -6 commercial-to-industrial speed grade, with an extended industrial temperature range indicated by the 'I' suffix. Embedded resources include 1,358,848 bits of block RAM, 24 18x18 DSP slices, and on-die SerDes for high-speed serial protocols. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows hardware designers to implement arbitrary digital logic through SRAM-based configuration cells. FPGAs sit between ASICs and microcontrollers in the design hierarchy: ASIC > FPGA > CPLD > microcontroller > DSP. The LatticeECP3 family targets low-power, high-volume applications that require SERDES connectivity, DSP blocks, and a low-cost fabric, making it distinct from Lattice's high-density ECP5 and CrossLink-NX families. Key features of the LFE3-35EA-6FTN256I include 33.3K LUTs, 1.36 Mbit embedded sysMEM block RAM distributed across the fabric, 18x18 multipliers in dedicated DSP blocks, and multi-protocol SERDES supporting standards such as PCIe, Ethernet (SGMII, GbE), CPRI, and JESD204A/B. The 1.2 V core voltage enables low static and dynamic power consumption, while the -6 speed grade provides timing closure margin for cost-sensitive designs. The LFE3-35EA-6FTN256I uses a 65 nm CMOS process and a symmetric FPGA fabric with embedded block RAM and DSP tiles. Configuration is loaded from external SPI flash through dedicated pins, and the part supports bitstream encryption and dual-boot for field upgrades. The on-chip SERDES reduces BOM cost by eliminating external PHY components for many common serial standards. Typical applications include industrial Ethernet switches and fieldbus bridges, video bridging and display controllers, low-cost wireline backplanes, software-defined radio front ends, machine vision and image processing pipelines, and portable medical instrumentation. Designers select this part when they need SERDES, moderate logic density, and low power in a single, low-cost BGA. When designing with this device, provide at least four PCB layers with continuous ground and power planes beneath the BGA, and route all differential SERDES pairs with 100 ohm differential impedance and intra-pair length matching under 150 mil. Decouple every VCC and VCCAUX pin with a 0.1 uF X7R capacitor placed within 100 mil of the ball. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers compare LFE3-35EA-6FTN256I against other ECP3 speed and package options.
LFE3-35EA-7FTN256I - 33K LUTs ECP3 FPGA, 256-FTBGA | Lattice
The Lattice Semiconductor LFE3-35EA-7FTN256I is a member of the LatticeECP3 (EConomy Plus 3) family of low-power, high-speed Field-Programmable Gate Arrays (FPGAs), integrating 33,000 logic cells (33.3K LUTs) and 133 user I/O in a 256-ball Fine-pitch Thin Ball Grid Array (FTBGA) package. It operates from a 1.2 V core supply, supports SERDES data rates from 150 Mbps to 3.2 Gbps for generic 8b10b / 10-bit SERDES, and uses 65 nm process technology, targeting cost-sensitive high-volume applications that need multi-gigabit serial connectivity without the power and cost of higher-density FPGAs. A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic fabric, interconnect, and I/O can be reconfigured by the end user after manufacture. Within the broader semiconductor hierarchy, an FPGA is a programmable logic device, sitting alongside CPLDs as the two main categories of user-configurable digital ICs, both of which fall under the larger umbrella of Application-Specific Standard Products (ASSPs) and digital ASICs. The LatticeECP3 family specifically targets bridging, video, and low-cost communication designs, positioning this MPN between small CPLDs and high-end FPGAs such as Xilinx Virtex or Intel (Altera) Stratix families. Key features of the LFE3-35EA-7FTN256I include 33.3K LUTs with embedded sysDSP-style multipliers, 133 user I/O supporting multiple I/O standards (LVCMOS, LVTTL, LVDS, SSTL, HSTL), integrated SERDES channels rated up to 3.2 Gbps for protocols such as PCIe Gen1, SGMII, SATA, and 8b/10b-encoded links, and a typical internal fabric operating frequency sufficient for high-speed control and data-path logic. The -7 speed grade indicates the second-fastest commercial bin within the ECP3 family, and the I-suffix indicates the industrial temperature range. The LFE3-35EA-7FTN256I is built on a 65 nm CMOS process, which provides a favorable performance-per-watt ratio for embedded bridging, video processing, and machine-to-machine communication designs. The device integrates 1,358,848 system gates and 6.69 Mbits of embedded memory (EBR) for FIFO and buffer applications. Power-aware design flow via Lattice Diamond or ispLEVER Classic, combined with on-chip PLLs and clock-management tiles, lets designers hit timing closure at multi-hundred-megahertz Fmax while staying within a tight power envelope. Typical applications for the LFE3-35EA-7FTN256I include low-cost video bridging (HDMI, DisplayPort, MIPI converters), industrial Ethernet / SERDES bridges, motor-control and factory-automation controllers, surveillance and machine-vision front-ends, and consumer-connectivity products such as docking stations and high-speed hubs. Industrial-grade temperature support and integrated 3.2 Gbps SERDES make it a common choice when designers need a hot-swappable, multi-protocol interconnect front-end. When designing with this FPGA, ensure that the 256-ball FTBGA PCB footprint uses the manufacturer-recommended land pattern, including proper microvia stacking and a continuous ground plane under the BGA for signal-integrity and thermal relief. Plan clock trees around the on-chip PLLs and use the Lattice Diamond toolchain for synthesis, place-and-route, and SERDES configuration. For high-speed SERDES channels, follow the reference schematics for AC-coupling capacitor selection, 100-ohm differential routing, and pre-emphasis / de-emphasis settings as documented in the LatticeECP3 family data sheet. This page synthesizes distributor pricing, same-family and cross-brand drop-in alternatives, comparison parameters, and practical design notes that go beyond the bare Lattice ECP3 datasheet, helping procurement and engineering teams make informed component decisions.
LFE5U-45F-8BG256I - 44K LUT ECP5 FPGA, 256-BGA Industrial | Lattice
The Lattice Semiconductor LFE5U-45F-8BG256I is a member of the Lattice ECP5 family of ultra-low-power Field Programmable Gate Arrays (FPGAs), offering 44,000 Look-Up Tables (LUTs), approximately 1,990,656 bits (1,944 kbit per Mouser/FPGA.io reference) of embedded block RAM, and 197 user I/O in a 256-ball caBGA (BG256) package with industrial temperature grade (-40C to +100C). It is powered from a 1.1V core supply and targets small-form-factor, low-power applications such as embedded vision, motor control, and serial interface bridging. An FPGA (Field Programmable Gate Array) is a semiconductor device whose logic function is defined by a user-programmed configuration bitstream rather than fixed at the fab. The LFE5U sits within the broader taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. FPGAs trade raw performance-per-watt for reconfigurability, making them ideal for evolving interfaces, parallel DSP pipelines, and glue logic that must adapt across product revisions. The ECP5 family in particular uses a 40 nm process and a LUT4-based fabric, optimizing logic density per mW versus prior Lattice generations. Key specifications include 44,000 LUT4 elements distributed across the fabric, multiple 18 x 18 multipliers for fixed-point DSP, embedded block RAM, and SERDES-capable I/O structures on selected package options. The industrial temperature grade ("I" suffix) extends operation to -40C to +100C, well-suited for factory automation, automotive peripherals, and outdoor networking equipment. The 256-ball caBGA package (17 mm x 17 mm body, 1.0 mm ball pitch) is footprint-compatible with other ECP5 BG256 devices, simplifying PCB reuse across density grades. Architecturally, the ECP5 fabric uses LUT4-based logic slices, sysDSP blocks for multiply-accumulate, and sysMEM EBR (Embedded Block RAM) for distributed memory. Bitstream configuration is loaded through SPI, JTAG (IEEE 1149.1 boundary-scan), or dual-boot/multi-boot modes, allowing field upgrades via TransFR (Transparent Field Reconfiguration) without halting downstream logic. Typical applications include low-power video bridging (MIPI CSI-2 to parallel RGB), small-cell baseband signal processing, industrial motor control loops, sensor aggregation hubs, and as a companion logic device to higher-tier processors. Designers value the ECP5 series for its sub-1W active power and instant-on capability for sleep-to-active transitions in battery-powered IoT. When designing with this FPGA, plan power-rail sequencing (1.1V core, 2.5V/3.3V auxiliary) and reserve decoupling capacitance per Lattice hardware design guidelines. Verify that JTAG and SPI flash footprints match the chosen configuration topology before layout commit; re-use is straightforward when migrating across ECP5 LUT densities within the same BG256 package. This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
LFE5UM-45F-6BG554C - ECP5 FPGA 45K LUTs w/ SERDES, 554-CABGA | Lattice
The Lattice Semiconductor LFE5UM-45F-6BG554C is a member of the LatticeECP5™ family of low-power, SERDES-equipped FPGAs, supplied in a 554-pin chip-array BGA (cabga) package. Per the Lattice ECP5 datasheet, this device integrates approximately 44,000 4-input LUTs, 1,944 Kb of embedded block RAM, and 245 user I/O on this specific cabga-554 variant. The device is fabricated on a 40 nm CMOS process and is rated for a 1.1 V core supply, with multi-protocol SERDES channels available for 1.5 Gbps / 3.2 Gbps / 5 Gbps data rates depending on the speed bin (the -6 speed grade in this MPN indicates the commercial-grade timing closure). An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (LUTs, flip-flops, routing, and dedicated silicon blocks such as block RAM, DSP slices, PLLs, and SERDES transceivers). FPGAs occupy a position between general-purpose microcontrollers (programmed in software) and ASICs (custom-masked silicon): they are parallel, hardware-reconfigurable, and re-spin without mask changes, which makes them ideal for low-volume production, fast-prototype connectivity, and high-bandwidth data-plane acceleration. Within the broader semiconductor taxonomy, FPGAs sit at the same hierarchy level as microcontrollers and DSPs in embedded logic, and the LatticeECP5 family is targeted at low-cost, low-power, high-volume edge and connectivity applications. Key features of the LFE5UM-45F-6BG554C include four or more 5 Gbps multi-protocol SERDES channels (PCIE Gen1/Gen2, SERDES, SGMII, XAUI-capable), a hardened PCIe Gen2 endpoint block, on-chip DSP slices for fixed- and floating-point arithmetic, distributed and block RAM, and support for 1 Gbit DDR3 / LPDDR2 / LPDDR3 external memory interfaces. The -6 speed grade, combined with the cabga-554 footprint, makes this device targeted at small-form-factor, cost-sensitive board designs where SERDES and PCIe are required. The ECP5 architecture pairs LUT-based logic fabric with hardened IP blocks (SERDES, PCIe, DDR PHYs) to deliver high bandwidth at low power - typically under 1 W static plus dynamic for small designs. The 40 nm process combined with 1.1 V core keeps both leakage and dynamic dissipation low, which is critical for always-on connectivity edges such as small-cell front-haul, IoT gateways, and battery-powered imaging. Typical applications include low-cost PCIe add-in cards, small-cell baseband and front-haul bridging, industrial machine vision pre-processing, USB 3.0 / DisplayPort Bridge bi-directional protocol conversion, and IoT edge gateways aggregating multiple sensor streams. The cabga-554 footprint supports board designs up to roughly 100 mm x 100 mm with comfortable routing margins for high-speed SERDES. When designing with this part, ensure that the cabga-554 PCB footprint uses laser-drilled microvias with proper stack-up symmetry for the SERDES channels to meet the 5 Gbps return-loss mask; Lattice TN1268 (cabga-544/554 layout guide) should be followed for via-in-pad escape. JTAG programming via the standard IEEE 1149.1 boundary-scan interface allows the same bitstream to be programmed either at factory or in-field via TransFR (transparent field reconfiguration) without halting the device. This page synthesizes verified distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, including cabga-554 PCB escape guidance and same-family ECP5 device substitution analysis.
LFE5UM-85F-6BG554C - ECP5-5G FPGA, 84K LUTs, 12 SERDES | Lattice
The Lattice Semiconductor LFE5UM-85F-6BG554C is a member of the Lattice ECP5-5G family of ultra-low-power FPGAs, providing 84,000 LUT4 logic elements, 3,744 Kbits of embedded block RAM, and 12 channels of multi-protocol SERDES in a 554-ball caBGA (23x23 mm) package with commercial temperature grade (C). The 'M' suffix denotes the ECP5-5G variant which adds high-speed SERDES transceivers supporting multi-gigabit serial protocols. An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O resources that engineers configure after manufacturing to implement custom digital circuits. Within the broader semiconductor taxonomy, FPGAs sit alongside ASICs and CPLDs as one of the three principal programmable-logic device categories. The ECP5/ECP5-5G family is specifically optimized for low-power, small-form-factor applications such as mobile, IoT, and serial connectivity bridging, where traditional high-power FPGAs would be unsuitable. Key features of the LFE5UM-85F-6BG554C include 84,000 4-input LUTs, 156 18x18 multipliers for DSP operations, 259 user I/O pins, and SERDES channels rated up to 5 Gbps for protocols such as PCIe Gen 2, 10Gb Ethernet MAC, CPRI, and SLVS-EC. The device operates from a 1.1V core supply with auxiliary voltages for I/O banks. The -6 speed grade provides a balance of performance and power for most cost-sensitive applications. Architecturally, the ECP5-5G combines a fabric of LUTs, distributed RAM, block RAM, DSP slices, and SERDES, with Lattice's proprietary routing and configuration logic. The 40nm process node enables lower static power than older 65nm FPGAs while maintaining high DSP throughput. Hardened SERDES IP eliminates the need for external transceivers in typical designs. Typical applications include 5G small-cell baseband processing, PCIe Gen 2 endpoint cards, industrial machine vision cameras, IoT edge gateways with on-device acceleration, low-cost video bridging, and serial protocol conversion. The wide SERDES protocol support makes the part particularly attractive for cost-sensitive designs that need high-speed connectivity without paying for a larger FPGA. When designing with this part, ensure proper decoupling on all supply rails and follow Lattice's PCB layout guidelines for SERDES channels (controlled-impedance routing, length matching, and AC coupling capacitors). Lattice Diamond software is required for synthesis, place-and-route, and bitstream generation; the Radiant toolchain supports newer ECP5-5G designs. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
LFE5UM-85F-8BG554C - ECP5 FPGA 84K LUTs SERDES 554-BGA | Lattice
The Lattice Semiconductor LFE5UM-85F-8BG554C is a member of the Lattice ECP5 family of ultra-low-power Field Programmable Gate Arrays (FPGAs) built on a 40nm CMOS process, offering 84000 logic cells (83.6K LUTs), 3833856 bits of embedded memory, 259 user I/O, and integrated SERDES channels in a 554-ball cABGA surface-mount package. An FPGA (Field Programmable Gate Array) is a class of programmable logic device that allows hardware designers to implement custom digital circuits via a configuration bitstream after manufacturing. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) -> complex programmable logic device (CPLD) -> FPGA -> system-on-chip (SoC). Lattice ECP5 specifically targets low-power, high-volume connectivity and acceleration applications, consuming roughly half the power of competing 40nm FPGAs. Key differentiating features include 156 18x18 multipliers, 208 EBR (Embedded Block RAM) blocks at 9.4 Mbits usable memory, integrated 3.2 Gbps SERDES with hardened PCI Express Gen 2 and Gigabit Ethernet MAC blocks, and support for DDR3/LPDDR3 memory interfaces with hardened PHY. The device supports 1.1V core operation and offers multiple I/O standards including LVCMOS 1.2/1.5/1.8/2.5/3.3, LVDS, SSTL, and HSTL. Architecturally, ECP5 uses Lattice's logic-cell fabric with 4-input LUTs, dedicated DSP slices for signal processing, and a programmable sysIO buffer system. The hardened SERDES and PCIe blocks reduce soft-logic resource consumption, allowing more design headroom for custom logic. The device supports 1000 Mbps Ethernet, DisplayPort 1.1a, and 7:1 LVDS interfaces natively. Typical applications include small-cell baseband, industrial video and image processing, LED video walls, low-cost PCIe bridging cards, machine vision, and IoT edge acceleration. The combination of low static power (typically 0.5W), high integration, and high I/O count makes it well suited for cost-sensitive high-volume designs. When designing with this device, ensure proper power-rail sequencing (VCC + 1.1V core must stabilize before VCCIO banks) and provide adequate decoupling. For SERDES applications, follow Lattice's reference design for 100-ohm differential routing and AC-coupling capacitor placement near the transmitter balls. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, accelerating the engineer's component selection process.
LFE5UM5G-85F-8BG381ES - ECP5-5G FPGA, 84K LUTs, 5G SERDES, 381-BGA
The Lattice Semiconductor LFE5UM5G-85F-8BG381ES is a high-density ECP5-5G series Field Programmable Gate Array (FPGA) featuring 84,000 logic cells (83.6K LUTs), integrated 5G multi-protocol SERDES channels, and a 381-ball caBGA package with 197 user I/O. The part is supplied in the -8 speed grade and is part of the ECP5-5G family optimized for bridging, I/O expansion, and high-bandwidth connectivity in cost- and power-sensitive applications. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP blocks such as SERDES transceivers, block RAM, DSP slices, and PLL/DLLs. FPGAs occupy the programmable-logic tier of the digital IC hierarchy: microcontroller -> ASIC/ASSP -> FPGA -> CPLD. Unlike fixed-function ASICs, FPGAs are re-programmed in the field via SRAM configuration cells, enabling rapid prototyping, hardware evolution, and per-board customization. The ECP5-5G family specifically targets small-form-factor, low-power applications that still need multi-gigabit serial connectivity. Key features of the LFE5UM5G-85F include integrated 5G SERDES supporting protocols up to 5 Gbps per lane (PCI Express Gen 2, CPRI, OBSAI, 10GbE XAUI via quad-lane aggregation, SRIO, JESD204B), up to 3.8 Mbit of embedded block RAM, distributed SRAM, on-chip DSP blocks for fixed- and floating-point math, hardened 1 Gbit Ethernet MACs, and a 1.2 V core supply. The 381-ball caBGA package exposes 197 general-purpose I/O supporting multiple I/O standards (LVCMOS, LVDS, LVTTL, SSTL, HSTL) and selectable drive strength. The architecture is built on a 40 nm low-power CMOS process and combines LUT4-based logic slices with rich routing resources, achieving a typical standby power below 0.5 W and active power that scales with utilization. The integrated 5G SERDES eliminates the need for external PHY ICs in many designs, reducing both BOM cost and PCB area. Typical applications include small-cell wireless backhaul, industrial video bridging, machine-vision interfaces, low-cost 10G Ethernet aggregation, LED video wall tiling, and PCIe Gen 2 endpoint cards. The part is also commonly used as a glue/bridge FPGA between ASSPs, ASICs, sensors, and high-speed processors. When designing with the LFE5UM5G-85F-8BG381ES, pay careful attention to the SERDES reference clock architecture and PCB stack-up: each 5G lane requires a low-jitter differential reference clock and impedance-controlled 85 ohm differential routing. Multiple configuration options (SPI, JTAG, dual-boot) are supported but require correct pin strapping and bitstream generation through Lattice Diamond or Radiant design software. This page synthesizes verified distributor pricing, a curated drop-in alternative list, and practical design notes not consolidated in the manufacturer datasheet alone.
LFE5UM5G-85F-8BG554I - 84K LUT ECP5-5G FPGA, 5G SERDES, BG554 | Lattice
The Lattice Semiconductor LFE5UM5G-85F-8BG554I is a member of the ECP5-5G family of ultra-low-power, low-cost FPGAs with integrated 5 Gbps SERDES, supplied in a 554-ball caBGA (BG554) package. It contains 84,000 LUT4-equivalent logic elements, 3,833,856 bits of embedded block RAM (3,744 Kb / 468 Kbytes), 259 user I/O, and a 1.1 V core supply with 1.2 V auxiliary, targeting wireline and wireless interface bridging, video processing, and low-power acceleration workloads. The part is industrial temperature grade (I suffix) and halogen-free. An FPGA (Field-Programmable Gate Array) is a type of programmable logic IC that allows designers to configure digital logic blocks, interconnect, and I/O behaviour after manufacture. Within the semiconductor hierarchy, an FPGA sits below application-specific standard products (ASSPs) and is a key sub-category of programmable logic devices (PLDs) and logic ICs. The ECP5-5G family in particular extends the Lattice low-power ECP5 line with hardened 5 Gbps multi-protocol transceivers, making it a hybrid between traditional FPGA fabric and an ASSP-style interface bridge. Key features include 5G SERDES channels supporting CPRI, JESD204B, 10 GbE (XAUI), PCIe Gen 1/2, and SGMII, distributed and block RAM, on-chip DSP slices (multipliers), and hardened IP for double-data-rate memory controllers (DDR3/LPDDR3). The device is configured via standard JTAG (IEEE 1149.1) or SPI and supports Dual-Boot, Multi-Boot, and TransFR (Transparent Field Reconfiguration) for in-system update with no downtime. The ECP5-5G architecture uses a 40 nm CMOS process with a 1.1 V core, providing typical static power under 0.5 W for the LFE5UM5G-85F device while sustaining 5 Gbps line rate on the SERDES. The 554-ball caBGA package (BG554) provides the maximum I/O count and SERDES channel count for the family, suiting high-density board designs where 259 user I/O are needed alongside multiple high-speed serial links. Typical applications include 5G small-cell and CPRI fronthaul bridging, industrial machine vision and camera aggregation, LED video-wall timing control, multi-port PCIe Gen2 add-in cards, software-defined radio (SDR) baseband, and low-power protocol-bridging between SERDES and parallel FPGA fabric. The combination of 5G SERDES, large logic density, and <1 W typical power makes it popular in edge and embedded designs. When designing with this device, validate SERDES reference clock jitter against the protocol jitter mask (e.g., 312.5 MHz for 10 GbE), follow Lattice's PCB layout guideline for differential 100 ohm SERDES routing, and ensure proper decoupling on VCC/VCCAUX rails. Using Lattice Diamond software (or Radiant for smaller devices) is required for synthesis, place-and-route, and bitstream generation. This page synthesises distributor pricing, drop-in same-package alternatives within the ECP5/ECP5-5G family, and practical design notes that go beyond the manufacturer datasheet, giving engineers a single, decision-ready view of the LFE5UM5G-85F-8BG554I for sourcing and BOM planning.
LFE5UM5G-85F8BG554I - 84K LUT, 5G SERDES ECP5 FPGA | Lattice
The Lattice Semiconductor LFE5UM5G-85F8BG554I is a 554-ball BGA FPGA from the ECP5-5G family that integrates 83.6K LUT4 logic elements, 3.84 Mbit of embedded block RAM, and multi-protocol 5 Gbps SERDES channels in a single low-power device. It is supplied in a 1.2 V core, 554-FBGA (caBGA) surface-mount package with 259 user I/O pins, targeting small-form-factor, low-power, high-throughput designs. What is an FPGA? A Field Programmable Gate Array (FPGA) is a programmable logic IC that lets designers implement arbitrary digital functions in silicon after PCB fabrication. Within the broader taxonomy, the ECP5-5G sits in the FPGA & CPLD category, below the hierarchy programmable logic device -> logic IC -> integrated circuit -> semiconductor. FPGAs are the modern descendants of CPLDs and PALs, offering millions of gates, dedicated DSP blocks, hard memory, and high-speed transceivers for protocol bridging, video processing, and parallel compute acceleration. Key features of this device include up to 84,000 LUT4-equivalent logic elements, 3,744 Kbit of distributed EBR plus large RAM, 156 (18x18) hardware multiplier/DSP blocks, 4 SERDES channels supporting CPRI, PCIe Gen1/Gen2, SGMII, and 5 Gbps multi-protocol links, plus hardened I/O supporting DDR3 memory interfaces up to 800 Mbps. The part is offered in the industrial temperature range and supports TransFR transparent field reconfiguration plus dual-boot/multi-boot image fallback for robust remote upgrades. Architecturally the ECP5-5G fabric uses Lattice's LUT4-based logic with carry chains, distributed and block RAM, and DSP slices arranged in rows for high-utilization designs. The 5G SERDES hard IP and 1.2 V core deliver strong mW-per-MIPS efficiency, making the family the standard for small-cell, industrial vision, and protocol-bridge applications where 7-series FPGAs would be oversized and over-powered. Typical applications include 5G small-cell fronthaul using CPRI/JESD204B, machine-vision and industrial camera bridging, LED video wall scan-driver control, multi-protocol interface bridging (PCIe, SGMII, GigE, SLVS-EC), and low-power IoT aggregation. The combination of low static power, abundant DSP, and 5G SERDES in a sub-1 W envelope is the part's central value proposition. When designing with this device, plan thermal strategy around the 554-FBGA substrate: although each SERDES is power-efficient, a fully loaded 5G configuration can push total power to 1.5-2 W, so a 4-layer PCB with a 2x2 ball-grid thermal via array under the package is recommended. Use Lattice Diamond or Lattice Radiant design software and the ECP5-5G sysCONFIG port to enable dual-boot, TransFR, and in-field updates without external boot memory. This page synthesizes distributor pricing, drop-in alternative FPGAs, application pairing, and practical PCB/thermal design notes that complement the Lattice datasheet, giving engineers a single source for sourcing and BOM decisions.