LCMXO3LF-6900C-5BG256C - 6864-LUT MachXO3LF FPGA | Lattice
MPN: LCMXO3LF-6900C-5BG256C ✓ Active| Qty | Unit Price | Extended |
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LCMXO3LF-6900C-5BG256C Overview
An FPGA is a programmable digital semiconductor whose lookup tables, registers, interconnects, and I/O blocks are configured to implement custom parallel logic. Within the hierarchy of programmable-logic devices, an FPGA sits above simple programmable logic and below application-specific programmable devices. The MachXO3 family emphasizes low-power operation, instant-on configuration, flexible I/O, and a high I/O-to-logic ratio for control, bridging, and interface-management designs.
Key verified features of the LCMXO3LF-6900C-5BG256C include 6,864 LUTs, 240 Kbits of embedded RAM, 206 I/O, a commercial temperature grade, and a slow speed grade. Its 256-LFBGA package supports dense board integration while providing a substantial pin count for high-fanout interfaces. The part is identified as a 2.5 V and 3.3 V programmable device, making it relevant to systems that need configurable logic without committing to an ASIC.
The MachXO3LF architecture combines programmable logic, embedded block RAM, and flexible I/O resources in a single device. The 240 Kbits of RAM can be used for buffers, state machines, protocol translation, or small data-processing functions when a design does not require a larger external memory. Its 206 I/Os are useful for bridging legacy peripherals, translating interface signaling, or implementing control logic around processors and sensors.
Typical applications include industrial interface expansion, camera and display control, communication bridging, embedded control, and low-power consumer electronics. The LCMXO3LF family is also supported by the MachXO3LF Starter Kit, which contains an LCMXO3LF-6900C-5BG256C device and provides a practical evaluation platform with SPI Flash for boot and dual-boot experiments.
Designers should verify pin assignments, voltage-bank requirements, configuration pins, supported I/O standards, clocking, and power sequencing against the manufacturer datasheet before layout. BGA assembly also requires controlled PCB escape routing, inspection, and thermal design. The page combines verified distributor information, lifecycle caveats, datasheet links, and application guidance while leaving unspecified electrical values explicitly marked for data completion.
Drop-in alternatives for LCMXO3LF-6900C-5BG256C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with LCMXO3LF-6900C-5BG256C (same form factor and footprint) — differing in Package, Speed Grade, Supply Voltage, Mounting Type, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
LCMXO3LF-6900C-5BG256I
✅ Drop-In📋 Reference alternative (not in catalog)
LCMXO3LF-6900C-6BG256I
✅ Drop-In📋 Reference alternative (not in catalog)
LCMXO3L-6900C-5BG256C
✅ Drop-In📋 Reference alternative (not in catalog)
LCMXO3LF-9400C-5BG256C
✅ Drop-In📋 Reference alternative (not in catalog)
LCMXO3LF-2100C-5BG256C
✅ Drop-In📋 Reference alternative (not in catalog)
LCMXO3LF-6900C-5BG256C Maximum Ratings & Electrical Characteristics
| Device Type | MachXO3LF field-programmable gate array (FPGA) |
| Logic Elements | 6,864 LUTs |
| Embedded Memory | 240 Kbits |
| I/O Count | 206 I/Os |
| Supply Voltage | 2.5 V and 3.3 V |
| Package | 256-LFBGA |
| Package Type | BGA-256 |
| Speed Grade | Slow grade |
| Temperature Grade | Commercial |
| Configuration | Non-volatile, instant-on FPGA |
| I/O Signaling | MIPI, LVDS, and sub-LVDS support identified in verified data |
| Programmable Logic | FPGA LUT-based programmable logic |
| Embedded RAM Type | Embedded block RAM |
| Development Support | MachXO3LF Starter Kit supported |
| Configuration Memory Support | SPI Flash external boot and dual-boot evaluation support |
| Mounting Type | Surface mount |
LCMXO3LF-6900C-5BG256C bga-256 Pin Configuration Guide
Pin configuration for LCMXO3LF-6900C-5BG256C (bga-256 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for LCMXO3LF-6900C-5BG256C.
Refer to the datasheet for full pin configuration.
Typical Applications
LCMXO3LF-6900C-5BG256C is suitable for 6 applications: Industrial Interface Expansion, Communication Bridge and Protocol Translation, Display and Sensor Control, Embedded Control and Glue Logic, Consumer Electronics and Power-Efficient Products, Rapid FPGA Evaluation and Education.
Industrial Interface Expansion
The LCMXO3LF-6900C-5BG256C fits industrial interface expansion when a controller needs programmable glue logic without a custom ASIC. Its 6,864 LUTs can implement control, address decoding, status monitoring, and protocol sequencing, while 206 I/Os provide connections to sensors, actuators, memory, and legacy peripherals. The 2.5 V and 3.3 V operating references make it useful for systems with conventional digital voltage rails. Because the target is identified as commercial-temperature, the design must confirm the ambient range and reliability needs against the manufacturer documentation. The FPGA also supports non-volatile, instant-on configuration, which helps maintain deterministic control behavior after power restoration.
Recommended
Communication Bridge and Protocol Translation
The Lattice MachXO3LF device can act as a communication bridge when two interfaces require different signaling or framing behavior. The 6,864 LUTs provide parallel datapath and state-machine capacity, while the 240 Kbits of embedded RAM can hold modest packet buffers or protocol state. Its 206 I/Os support multiple external interfaces and control signals, although the exact supported standards and voltage banks must be verified for the selected design. Verified data identifies MIPI, LVDS, and sub-LVDS support, making the device relevant for display, sensor, and high-speed interface-adaptation work. Engineers should confirm timing, I/O standards, and pin constraints before committing a bridge architecture.
Recommended
Display and Sensor Control
For display and sensor-control systems, the LCMXO3LF-6900C-5BG256C can consolidate timing, control, and interface-management logic in a compact programmable device. Its large 206-I/O count helps connect display timing signals, sensors, reset lines, and data buses, while the LUT and RAM resources support sequencing and local buffering. The verified data specifically identifies MIPI, LVDS, and sub-LVDS support, but the exact supported data rates and I/O arrangements remain to be confirmed in the datasheet. The device's non-volatile instant-on architecture is useful where control behavior must resume quickly after power cycles. Final design work must validate electrical standards, clocking, and power sequencing.
Recommended
Embedded Control and Glue Logic
The LCMXO3LF-6900C-5BG256C is appropriate for embedded control tasks that need programmable logic close to a processor, sensor, or memory device. A design can use the 6,864 LUTs for state machines, bus arbitration, interrupt control, and peripheral timing, with the 240 Kbits of embedded RAM available for small buffers or configuration-dependent storage. The 256-BGA package supports high-density routing in compact industrial or consumer products, while 2.5 V and 3.3 V references align with common digital rails. Since the target is listed as commercial temperature grade, environmental requirements must be checked separately. Use the MachXO3LF toolchain and device documentation for synthesis, fitting, timing closure, and programming.
Recommended
Consumer Electronics and Power-Efficient Products
The Lattice MachXO3LF-6900C-5BG256C can add programmable functionality to consumer products without developing a full custom ASIC. Its non-volatile configuration supports compact implementation of user-interface logic, accessory control, signal routing, and protocol adaptation. The 6,864 LUTs and 240 Kbits of RAM provide enough resources for moderate control functions, while the 206 I/Os simplify connection to buttons, indicators, sensors, and external controllers. The verified data identifies a 2.5 V and 3.3 V programmable device and a commercial grade. Designers should still validate quiescent power, dynamic power, I/O current, thermal performance, and all supported voltage-bank combinations using the official datasheet before production release.
Recommended
Rapid FPGA Evaluation and Education
The LCMXO3LF-6900C-5BG256C is suitable for FPGA evaluation, prototyping, and education because a MachXO3LF Starter Kit is verified to include this device. The board context provides a practical way to evaluate external boot and dual-boot behavior with SPI Flash, reducing the amount of custom hardware required before a design is production-ready. The target's 6,864 LUTs, 240 Kbits of RAM, and 206 I/Os allow meaningful examples involving counters, state machines, memory buffers, and multi-I/O control. Engineers should still follow the starter-kit schematic, programming procedure, and current Lattice development tools rather than infer board connections from the MPN.
Recommended
Recommended Products Summary
Engineering reference data for LCMXO3LF-6900C-5BG256C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | LCMXO3LF-6900C-5BG256I | LCMXO3LF-6900C-6BG256I | LCMXO3L-6900C-5BG256C | LCMXO3LF-9400C-5BG256C | LCMXO3LF-2100C-5BG256C |
|---|---|---|---|---|---|---|
| Package | 256-LFBGA | 256-LFBGA | 256-LFBGA / CSFBGA-256 distinction reported | BG256 family | BG256 family | BG256 family |
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
Key Differentiators
- Verified 206-I/O resource for dense interface expansion (vs LCMXO3L-6900C-5BG256C)
- Explicit 240 Kbits embedded memory (vs LCMXO3LF-6900C-5BG256I)
- Commercial slow-grade designation (vs LCMXO3LF-6900C-6BG256I)
- Directly documented evaluation platform (vs LCMXO3LF-9400C-5BG256C)
Design Notes
The target uses a 256-pin BGA package, so PCB layout must follow the exact Lattice package drawing and escape-routing recommendations. Verify power and ground pin distribution, decoupling requirements, configuration pins, and BGA via geometry before release. Do not substitute a generic 256-ball symbol because the verified data does not provide the complete pin table for this exact MPN.
The verified device data identifies MIPI, LVDS, and sub-LVDS support, but the applicable signal rates, input thresholds, output levels, and bank restrictions are not supplied. Check each high-speed interface against the current MachXO3LF datasheet, preserve specified trace geometry and reference planes, and validate timing with the intended toolchain and board constraints.
The target is listed for 2.5 V and 3.3 V operation. Build the power tree only after confirming which rails belong to each supply bank and which pins require local decoupling. Avoid assuming that the two voltage references are interchangeable across every I/O or core domain. Use the manufacturer power-sequencing and quiescent-current data when available; the supplied verified results do not include those values.
Do not treat a related BG256 MachXO3 part as an automatic drop-in replacement. The verified search results show family, speed-grade, and package-description differences, but they do not establish complete pin, timing, memory, or voltage compatibility. Before substitution, compare the exact package drawing, pin table, speed grade, temperature grade, resource counts, configuration method, and Lattice programming support.
Compliance Information
The supplied verified web data does not provide verified RoHS, REACH, lead-free, halogen-free, or conflict-minerals statements for this exact MPN. AEC-Q100 is not applicable based on the supplied FPGA classification and no automotive qualification is stated.
