Interface ICs
Subcategories
Products (3,400+)
ATM90E36A-AU - 3-Phase Energy Metering AFE, 48-TQFP | Microchip
The Microchip (formerly Atmel) ATM90E36A-AU is a high-performance, poly-phase energy metering analog front-end (AFE) IC designed for three-phase four-wire (3P4W, Y0) and three-phase three-wire (3P3W, Y or Δ) systems, supplied in a 48-pin TQFP (7x7 mm) package. It integrates seven input channels (three voltage, four current) and provides active, reactive, and apparent energy computation with 0.1% accuracy over a wide dynamic range of 1000:1. The device operates from a 3.3V analog/digital supply with 1.8V internal logic support. An energy metering AFE (analog front-end) is a mixed-signal IC that combines sigma-delta ADCs, anti-aliasing filters, a DSP-based measurement engine, and digital calibration blocks. AFEs sit between current transformers / shunt resistors / voltage dividers and a host microcontroller, converting the analog line signals into computed energy quantities, RMS values, THD, and phase angles. Within the broader hierarchy, an energy metering AFE belongs to power management ICs and is typically classified as a data acquisition / signal chain IC in industrial metering subsystems. Key features include a built-in digital signal processor (DSP) for on-chip computation of mean active/reactive/apparent power, RMS voltage and current, power factor, line frequency, and harmonic distortion (THD) up to the 21st order. The IC exposes three configurable CF (calibration frequency) pulse outputs for active/reactive/apparent energy, plus three zero-crossing detection pins (ZX0/ZX1/ZX2) and three interrupt/warning outputs (IRQ0, IRQ1, WarnOut). Communication to the host MCU is via an SPI/UART selectable serial interface at up to 4 Mbps. Architecturally, the ATM90E36A-AU uses simultaneous sampling 16-bit second-order sigma-delta ADCs per channel with integrated digital integrators, eliminating the need for an external analog anti-aliasing filter on each current channel. On-chip temperature compensation and per-phase gain/phase calibration registers allow meter class 0.5S / 1.0 accuracy. The -AU suffix indicates the industrial temperature grade (-40C to +85C). Typical applications include three-phase smart electricity meters, sub-metering in solar PV and energy storage inverters, EV charging station billing, data acquisition terminals, power quality monitors, and industrial three-phase motor energy dashboards. The wide 1000:1 dynamic range also supports both CT-based and Rogowski-coil current sensors. The TQFP-48 footprint suits both through-hole-friendly reflow designs and retrofit metering modules. When designing with this part, pay attention to the SPI/UART mode selection pin and ensure the host MCU firmware matches the configured baud rate or clock polarity; mismatch is the most common bring-up issue. Decouple AVDD/DVDD with low-ESR 10uF plus 100nF ceramic pairs and provide a clean analog ground island to achieve the rated accuracy at low currents. This page synthesizes distributor pricing, drop-in package alternatives, and practical calibration notes not found in the bare manufacturer datasheet, with cross-references verified against the M90E36A datasheet revision and Microchip product family page.
ATMXT112S-MAUR - 112-Node maXTouch Touch Controller | Microchip
The Microchip Technology ATMXT112S-MAUR is a maXTouch S-Series capacitive touchscreen controller IC with 112 mutual-capacitance sensing nodes, housed in a 32-pin UQFN (4x4 mm) package. It supports screens up to 3.5 inches and delivers smartphone-grade multi-touch performance with integrated noise mitigation for operation in noisy environments. A capacitive touch controller is a mixed-signal IC that measures tiny capacitance changes on a touch sensor grid, converts them into touch coordinates, and communicates them to a host processor. In the system hierarchy, a touchscreen controller sits between the touch sensor (ITO pattern on glass or film) and the host MCU or application processor, forming part of the human-machine interface subsystem alongside display drivers and haptic feedback devices. Key features of the ATMXT112S-MAUR include its 112-node sensing matrix for dense electrode layouts, the maXTouch S-Series architecture optimized for small displays up to 3.5 inches, and an advanced noise mitigation system that rejects interference from display drivers and chargers. The device integrates acquisition logic and post-processing, offloading touch detection from the host CPU. Technically, the maXTouch S-Series uses a proprietary acquisition engine with mutual-capacitance scanning and built-in self-calibration. Configuration data is stored on-chip in nonvolatile memory, and communication with the host uses an I2C-compatible interface. The device supports moisture and gloved-finger handling modes and provides robust reporting rates for responsive user interfaces. Typical applications include feature phone touchscreens, handheld game consoles, digital still cameras, portable GPS navigation devices, and small industrial HMI panels. Any battery-powered product with a 3.5-inch or smaller capacitive display benefits from the low-power touch wake-up and high noise immunity. Design consideration: because touch performance depends strongly on the sensor pattern and panel stack-up, use Microchip's maXTouch configuration tooling and reference sensor designs; improper grounding near display VCOM lines is the most common source of false touches. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
ATMXT1386-Z2UIR - maXTouch 1386-Node Touch Controller | Microchip
The Microchip Technology ATMXT1386-Z2UIR is a capacitive touch screen controller from the maXTouch product platform, implementing a 1386-node multi-chip solution (4 chips) that combines charge-transfer acquisition technology with a powerful 32-bit AVR microcontroller core. It is supplied in a 64-terminal HVQCCN (LCC64) surface-mount package. A capacitive touch controller is an interface IC that measures changes in capacitance across a touch sensor grid, converts those measurements into touch coordinates, and communicates them to a host processor. Within the semiconductor hierarchy it sits under data acquisition ICs, specifically touch screen converters and controllers, and forms part of the broader human-machine interface (HMI) signal chain that includes the sensor glass, the controller IC, and the host firmware. Key differentiating features include the 1386-node acquisition capacity, which supports large-format touch panels with many simultaneous sensing channels; the multi-chip architecture that lets four devices cooperate on a single panel; and the integrated 32-bit AVR processing that performs filtering and gesture detection on-chip, reducing host CPU load. The maXTouch platform firmware can be updated in-system, enabling tuning for different glass stack-ups. The charge-transfer acquisition technique offers strong signal-to-noise performance against display noise, which is important for designs where the touch sensor is integrated into or placed close to an LCD. On-chip AVR computation allows advanced touch features such as multi-touch tracking, palm rejection, and moisture compensation depending on the configured firmware. Typical applications include industrial HMI touch panels, large-format touch screens for appliances and kiosks, medical equipment control surfaces, and embedded systems requiring robust multi-touch input on medium-to-large sensor arrays. A key design consideration is that this device has been discontinued by Microchip; the manufacturer officially recommends the ATMXT1066T2 touch controller as the alternative for new designs, so availability should be confirmed before committing to a BOM. This page synthesizes distributor listings, manufacturer product-page data, and cross-reference findings, including drop-in-replacement guidance and procurement notes not found in the manufacturer datasheet.
ATMXT1386E-Z2U - maXTouch 1386-Node Touch Controller | Microchip
The Microchip Technology ATMXT1386E-Z2U is a capacitive touchscreen controller from the maXTouch product platform, implementing a 1386-node multi-chip solution built from four chips. It combines Atmel's patented QMatrix charge-transfer capacitive sensing method with a powerful 32-bit AVR microcontroller, and supports up to 16 simultaneous touches with fast response time. A capacitive touchscreen controller is a type of sensor interface IC that measures mutual capacitance changes across a touch sensor grid, classifies and tracks finger touches, and reports coordinates to a host processor. Within the system hierarchy, it sits in the signal chain between the touch sensor (a patterned ITO or similar electrode layer on the display) and the host MCU or application processor, forming part of the broader human-machine interface (HMI) subsystem. Key features include the 1386 mutual-capacitance node count, which suits medium-to-large touch panels; the patented charge-transfer acquisition engine, which delivers high signal-to-noise measurement accuracy; and multi-touch tracking of up to 16 touches. The high-performance architecture enables fast response and unlimited-touch reporting up to the 16-touch limit, making the device suitable for demanding interactive displays. Technically, the mXT1386E uses a unique charge-transfer acquisition engine implementing the QMatrix capacitive sensing method patented by Atmel. Coupled with a state-of-the-art 32-bit AVR CPU, the entire touchscreen sensing solution can measure, classify and track finger touches with a high degree of accuracy. As a multi-chip (4-chip) solution, the family coordinates sensing across the node array within one firmware-managed platform. Typical applications include tablet and e-reader touchscreens, industrial HMI panels, and consumer electronics displays requiring robust multi-touch performance with gloved-hand and noise immunity characteristic of the maXTouch platform. Design consideration: this part is a multi-chip solution, so verify board space, mechanical stacking and firmware/configuration compatibility against the replacement controller before redesign. Note that Microchip has officially recommended the ATMXT1066T2 as the alternative touch controller for this family. This page synthesizes distributor sourcing data, the manufacturer-recommended replacement, and practical design notes not found in the manufacturer datasheet.
ATMXT1386E-Z2UR - maXTouch 1386-Node Touch Controller | Microchip
The Microchip Technology ATMXT1386E-Z2UR is a 1386-node capacitive touch screen controller from the maXTouch product platform, implemented as a multi-chip solution combining four chips that pair charge-transfer acquisition technology with a powerful 32-bit AVR microcontroller core. It supports up to 16 simultaneous touches with fast response, and communicates with the host processor through either an I2C-compatible interface or a USB interface, though only one interface should be used in any single design. A capacitive touch controller is an interface IC that measures changes in capacitance across a touch sensor grid, applies touch-detection and noise-immunity algorithms, and reports touch coordinates to a host MCU or application processor. Within the semiconductor hierarchy it sits under touch screen controllers, a subcategory of sensor interface ICs in the maXTouch family spanning small single-chip solutions up to large multi-chip nodes for large-format touch panels. Key differentiating features include the very high 1386-node sensor channel count, support for up to 16 concurrent touch points, self- and mutual-capacitance charge-transfer acquisition, and dual host communication options (I2C-compatible or USB). The multi-chip architecture scales acquisition bandwidth for large touch panels used in industrial HMI and commercial display designs. Technically, the ATMXT1386E integrates four chips operating as one synchronized controller, with the 32-bit AVR execution core running Microchip's maXTouch firmware for touch detection, palm rejection, and noise filtering. Configuration is typically loaded into EEPROM/flash by the host at power-up, allowing tuning of sensitivity and gesture behavior without firmware changes. Typical applications include large-format industrial touch monitors, commercial kiosks and point-of-information terminals, and multi-touch human-machine interfaces where many sensor nodes and reliable multi-touch detection are required. A key design consideration is that Microchip has flagged this product for end-of-life: the manufacturer-recommended alternative touch controller is the ATMXT1066T2, so new designs should target that device while the ATMXT1386E family remains available for last-time-buy and service inventory. This page synthesizes distributor sourcing, the manufacturer-recommended successor, and practical design guidance not found in the standard datasheet listing.
ATMXT1386XES-CHPSET2 - 1386-Node maXTouch Touch IC | Microchip
The Microchip Technology ATMXT1386XES-CHPSET2 is a 1386-node capacitive touch screen sensor IC solution from the maXTouch product platform, supplied as a multi-chip set of 4 chips. By combining charge-transfer touch sensing technology with a powerful 32-bit AVR microcontroller core, this device delivers large-format projected-capacitive touch detection with Microchip's maXTouch signal-processing algorithms. A capacitive touch controller is a specialized mixed-signal IC that scans a matrix of mutual-capacitance nodes on a touch sensor panel, converts capacitance changes into digital coordinates, and reports touch positions to a host processor over a digital interface. In the product taxonomy, this device belongs to Interface ICs > capacitive touch sensors, which sits within the broader families of human-interface devices, sensor interfaces, and mixed-signal integrated circuits. Key characteristics of the ATMXT1386 family include the 1386-node sensing capacity, an on-chip 32-bit AVR processing core for autonomous touch acquisition, and maXTouch filtering that supports gloved operation, passive stylus, and water-rejection behavior typical of the platform. The XES-CHPSET2 ordering code denotes a chip-set (multi-chip) configuration rather than a single monolithic die, which system designers must account for in PCB partitioning. Technically, the charge-transfer acquisition engine periodically drives and senses the electrode matrix, while the embedded AVR firmware applies noise filtering, baseline tracking, and touch classification. This architecture offloads all touch processing from the host, requiring only configuration data and touch reports over the communication interface. Typical applications include large-format touchscreen displays for industrial human-machine interfaces (HMI), point-of-information kiosks, and other commercial touch systems that previously used this high-node-count controller. A key design consideration: Microchip lists the ATMXT1066T2 as the recommended alternative touch controller for the ATMXT1386, since this multi-chip solution is obsolete and no longer recommended for new designs. This page synthesizes distributor availability data, the manufacturer's recommended migration path, and drop-in alternative analysis not found on the Microchip product page alone.
ATMXT1664S1-CU - maXTouch Touchscreen Controller IC | Microchip Technology
The Microchip Technology ATMXT1664S1-CU is a maXTouch capacitive touchscreen controller IC from the maXTouch S-series family, supporting 1664 mutual-capacitance sensing nodes for projected-capacitive touch screens, supplied in a compact surface-mount package with RoHS3-compliant construction. According to distributor listings including DigiKey and Octopart, the device is classified as a Touch Screen Controller (IC SENSOR MAXTOUCH). A capacitive touchscreen controller measures mutual capacitance across a matrix of transmit and receive electrodes on the touch sensor. When a finger or passive stylus approaches the intersection of electrodes, local capacitance changes; the controller scans the matrix, converts the capacitance deltas to touch coordinates, applies gesture and noise filtering, and reports touch data to a host processor over an interface such as I2C or SPI. Touchscreen controllers sit within the broader hierarchy of sensor interface ICs and human-machine interface (HMI) semiconductors. The maXTouch S-series architecture integrates a high-performance acquisition engine with differential charge amplifiers, a configurable scan sequencer, and an embedded MCU core executing Microchip-supplied object-based firmware. Self- and mutual-capacitance fusion enables gloved-hand operation and water rejection, while frequency-hopping acquisition combats charger and display noise - a critical requirement for thin bezel tablets, POS terminals, and automotive HMI panels. Technical strengths of the family include high node counts supporting large-format touch panels, the maXTouch object model allowing configuration of key timings and thresholds via I2C registers, and mature firmware tooling through Microchip's maXTouch studio ecosystem. The S1 model designation reflects the firmware/feature configuration of the 1664-node silicon. Typical applications include 7-inch to 13-inch capacitive touchscreens in tablets, human-machine interfaces for white goods and appliances, point-of-sale and ticketing terminals, smart-home wall panels, and industrial operator panels where multi-touch and robust noise immunity are required. When designing with this controller, allocate a clean low-noise analog supply for the sensing core and route the sensor flex connector away from switching regulators; charger-mode noise often dominates real-world touch performance and must be verified with the intended display and charger pair. This page synthesizes distributor sourcing data, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet, with pricing as of 2026-09-19.
ATMXT1664S1-CUR - maXTouch 1664-Channel Touch Controller | Microchip
The Microchip Technology ATMXT1664S1-CUR is a maXTouch S Series capacitive touchscreen controller with 1664 mutual-sense channels, built on a 32-bit AVR microcontroller architecture, supplied in a reflow-capable surface-mount package for large-format touchscreen devices. A capacitive touch screen controller is an interface IC that measures capacitance changes across a grid of sensor electrodes to detect finger and stylus positions. Within the system hierarchy, it sits between the raw touch sensor (ITO pattern on glass or film) and the host application processor, converting analog charge-transfer measurements into touch coordinates over a digital interface. The maXTouch family from Microchip (originally Atmel) is a widely adopted line of such controllers used from wearables to large interactive displays. The ATMXT1664S1 belongs to the S Series, which brings the maXTouch architecture to large touchscreen devices. Its 1664 sensing channels support high electrode counts typical of large-format panels, while the integrated 32-bit AVR core performs on-chip acquisition, filtering, and gesture processing, offloading the host processor. Multiple S Series devices can operate simultaneously to drive very large screens, a scalability feature documented by Microchip for this family. The suffix structure of the part number encodes ordering options such as temperature grade and packaging (-CUR indicates a reflow-eligible, RoHS-grade ordering variant per Microchip nomenclature). As with all maXTouch parts, configuration of sensitivity, report rate, and multi-touch behavior is performed via firmware objects downloaded to the controller, allowing one PCB design to be tuned for different sensor stacks. Typical applications include large interactive displays, industrial HMI panels, point-of-information kiosks, and premium consumer touch devices where high channel count and robust noise immunity near displays or chargers are required. A key design consideration is that maXTouch controllers require a configuration file matched to the specific sensor pattern and stack-up; mismatched configurations degrade linearity and report rate. Verify communication with the host over the I2C-compatible interface during bring-up. This page synthesizes distributor availability, Microchip product data, and the manufacturer-recommended replacement ATMXT1664T3 into one reference, adding drop-in alternative guidance and design notes not found in the datasheet alone.
ATMXT2952T2-C2U - maXTouch Touch Controller | Microchip
The Microchip Technology ATMXT2952T2-C2U is a maXTouch capacitive touchscreen controller IC from the mXT2952T2 family, supporting up to 2952 touch channels and display sizes up to 21 inches, aimed primarily at industrial designs and housed in a BGA package. A capacitive touchscreen controller is a mixed-signal IC that measures mutual-capacitance changes across a touch sensor grid, converts the raw charge-transfer measurements into touch coordinates and gesture information, and reports them to a host processor over a digital interface. In the system hierarchy, it sits within the human-interface / data acquisition domain: touchscreen controller -> capacitive touch sensor IC -> sensor interface IC -> mixed-signal semiconductor. Key features of the ATMXT2952T2 family include Microchip's Adaptive Sensing technology, which automatically and intelligently switches between touch operating modes based on the detected object or environment, dynamic touch classification for finger, glove, stylus, and water rejection scenarios, and a debug port for tuning (per Microchip application note QTAN0050 'Using the maXTouch Debug Port'). The device supports I2C host communication; in I2C mode the pull-up resistor on the DBG_SS/GPIO0 shared ball is optional and present only if the ball is used as DBG_SS. The architecture pairs a charge-transfer analog front end with on-chip processing that performs self- and mutual-capacitance scanning, noise filtering, and touch classification. Adaptive Sensing allows the same controller to deliver reliable touch performance on thick cover lenses, in wet conditions, and under EMI conditions typical of industrial panels. Typical applications include industrial HMI touch panels up to 21 inches, factory automation displays, medical equipment screens, and commercial kiosk or point-of-information terminals where gloved-hand and water rejection are required. A key design consideration is the shared DBG_SS/GPIO0 ball: only one of these two functions can be selected, and the circuit must be designed accordingly; consult the manufacturer datasheet and QTAN0050 before finalizing the sensor flex pin mapping. Note that Microchip identifies ATMXT2952TD as the recommended alternative touch controller for the ATMXT2952T2, which is relevant for new designs and long-term supply planning. This page synthesizes distributor availability, the recommended replacement, and design guidance not consolidated in the manufacturer datasheet.
ATMXT768E-ABR - maXTouch Touchscreen Controller | Microchip
The Microchip Technology ATMXT768E-ABR is a maXTouch mXT768E-AT mutual-capacitance touchscreen controller IC designed for projected-capacitive touchscreens of up to 10.1-inch diagonal or even larger. It belongs to Microchip's maXTouch family of capacitive touch controllers and integrates signal-acquisition, touch-decision, and host-interface functions in a single device. A projected-capacitive (PCAP) touchscreen controller is a specialized mixed-signal IC that drives excitation signals across rows and columns of a transparent ITO sensor grid and measures mutual capacitance changes at each intersection. Within the system hierarchy, it sits between the raw touch sensor laminate and the host processor, delivering pre-processed touch coordinates over a digital interface. This class of device is fundamental to modern human-machine interface (HMI) design in industrial, medical, and consumer equipment. Key characteristics of the mXT768E-AT include high responsiveness for large-format screens, support for multi-touch reporting, and Microchip's maXTouch object-based reporting architecture in which touch data is conveyed as structured objects over an I2C or SPI-compatible host interface. The device is firmware-configurable, allowing tuning of sensitivity, rejection thresholds, and gesture behavior to match specific sensor stacks. The ATMXT768E-ABR was originally targeted at tablets, industrial HMI panels, point-of-sale terminals, and medical monitors in the 7-inch to 10.1-inch class. Note that Microchip's product page indicates this part is no longer recommended for new designs and recommends the ATMXT1189TD-A as the alternative touch controller for new development. Design consideration: because the mXT768E-AT is in end-of-life transition, new designs should evaluate the ATMXT1189TD-A and verify firmware migration effort, sensor-stack compatibility, and pin mapping before committing to a layout. This page synthesizes distributor availability, cross-reference data, lifecycle status, and practical design notes not found in the manufacturer datasheet alone, helping engineers make a supply-risk-aware selection decision.
ATMXTS100-CU - maXStylus Active Stylus ASIC | Microchip
The Microchip Technology ATMXTS100-CU is a maXStylus Gen I active stylus ASIC designed for capacitive touch sensing systems, classified under Interface - Sensor, Capacitive Touch ICs and belonging to the maXTouch product series from Microchip Technology. The device ships in tape-and-reel packaging with a standard package quantity of 6,000 units per reel, and the part status is listed as Active per distributor and manufacturer data. An active stylus controller IC is a specialized mixed-signal device that implements the transmit and signal-processing functions of an active pen system, enabling a battery-powered stylus to communicate position, pressure, and hover information with a capacitive touchscreen that is driven by a companion maXTouch touch controller. Within the system hierarchy, this device sits alongside touch sensors and touch screen controllers inside the human-interface input subsystem of tablets, e-readers, signature pads, and other pen-enabled displays. Key characteristics identified from verified distributor data include the maXStylus Gen I generation designation, maXTouch series membership, capacitive touch interface classification, and active lifecycle status. This positions the ATMXTS100-CU within Microchip's established maXTouch ecosystem, which is widely deployed in commercial and industrial touchscreen designs. Architecturally, active stylus ASICs coordinate the stylus-tip signal generation and timing with the host touchscreen controller so that palm rejection, hover detection, and fine-line pen input can be achieved on standard mutual-capacitance panels. Designers typically pair the stylus ASIC with a maXTouch touchscreen controller on the host side to form a complete pen-and-touch subsystem. Typical applications include active pen input for tablets and 2-in-1 computing devices, digital signature capture terminals, and industrial touch panels requiring stylus precision. In each case the ASIC provides the dedicated stylus-side signal chain that a general-purpose MCU would struggle to replicate with equivalent latency and power efficiency. A key design consideration is that per available cross-reference information this device is generally not pin-compatible with capacitive touch sensors from competing vendors, so second-sourcing requires careful I/O voltage and interface evaluation. This page synthesizes distributor pricing channels, verified lifecycle data, and practical design notes not consolidated in the manufacturer datasheet.
ATPL230A-AKU-R - PRIME PLC Modem 128.6Kbps | Microchip
The Microchip Technology ATPL230A-AKU-R is a PRIME-compliant power line communications (PLC) base band modem IC delivering data rates up to 128.6 kbps from a 3.3 V supply in an 80-pin LQFP (12x12 mm) package. It integrates an AES-128 crypto engine, operates from -40C to +85C, and supports CENELEC-A, FCC, and ARIB frequency bands. A power line communications modem is a specialized embedded device that transmits data over existing AC mains or DC power distribution wiring, eliminating the need for dedicated communication cabling. In the system hierarchy, the ATPL230A belongs to the class of application-specific microcontrollers and communication transceivers, bridging the gap between a host MCU and the physical power-line medium via an analog front end and coupling network. Key features include full compliance with the PHY layer of the PRIME (PRoducts for Intelligent Metering Evolution) specification v1.3 and v1.4, independently selectable transmission bands up to 472 kHz, and baud rates ranging from 5.4 kbps to 128.6 kbps. Additional robust modes and frequency band extension improve link reliability in noisy grid environments, while the hardware AES-128 engine secures metering data without burdening the host processor. The ATPL230A uses a flexible architecture composed of hardware accelerators and co-processors, enabling a highly efficient PRIME PHY implementation. An SPI interface connects the modem to an external host microcontroller, which handles PRIME MAC/CON layers and application logic. This partitioning allows firmware upgrades on the host without touching the certified PHY layer. Typical applications include smart metering (electricity, gas, water), smart grid street lighting control, solar inverter communication, and building automation over mains wiring. The industrial temperature grade of -40C to +85C supports outdoor and cabinet-mounted metering equipment. When designing with this device, budget the analog front end (line driver, coupling transformer, and filters) carefully, as PHY performance in CENELEC-A, FCC, and ARIB bands depends strongly on the external network; Microchip reference designs should be followed for coupling circuitry. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
ATPL250A-AKU-R - G3-PLC Power Line Modem IC | Microchip
The Microchip Technology ATPL250A-AKU-R is a G3-PLC (Power Line Communication) modem system-on-chip delivered in an 80-pin LQFP (AKU) surface-mount package, rated for the industrial temperature range of -40C to +85C and supplied in Tape & Reel (T&R) green/RoHS packaging. It integrates hardware accelerators and coprocessors that achieve a highly efficient G3 PHY layer implementation for narrowband power line communication. A power line communication modem is a communication IC that transmits data over existing AC mains or DC power lines by modulating a carrier signal onto the line, eliminating the need for dedicated wiring. Within the system hierarchy, the ATPL250A sits between the physical analog line front end and the host microcontroller, offloading the computationally demanding PHY and MAC layers of the G3-PLC standard from the application processor. G3-PLC is an open standard promoted by the G3-PLC Alliance and supported by internationally recognized standards bodies, making it the dominant PLC technology for smart grid infrastructure. Key features include flexible support for G3-PLC CENELEC, ARIB, and FCC frequency profiles, which allows one design to serve global markets with different regulatory band plans. The hardware-accelerated architecture handles OFDM modulation, forward error correction, and convolutional interleaving in dedicated logic, delivering deterministic real-time performance that a pure software implementation cannot match. The device is classified by distributors as a Network Controller & Processor IC / power line communications microcontroller. The ATPL250A implements the G3 PHY layer with hardware accelerators and coprocessors, achieving spectral efficiency and robustness over hostile power line channels characterized by multipath fading, impulsive noise, and frequency-selective attenuation. This architecture lets a companion host MCU manage application logic, metering computation, or protocol translation while the ATPL250A transparently maintains the PLC link, including adaptive tone mapping and channel estimation. Typical applications include smart metering (electricity meters and data concentrators), smart lighting control, industrial and home automation, and home energy management gateways. In a data concentrator, the ATPL250A aggregates PLC traffic from hundreds of meters onto a backhaul link, making its PHY efficiency directly responsible for network capacity. When designing with the ATPL250A, pay close attention to the analog line driver and coupling network: PCB layout of the transmit path and use of the reference design from the Atmel/Microchip user manual are critical to meeting G3-PLC Alliance interoperability and local emissions regulations. This page synthesizes verified distributor data, drop-in alternatives from the same LQFP-80 ATPL PLC family, and selection guidance not consolidated in the manufacturer datasheet. Pricing and availability were last verified on 2026-09-19.
ATPL250A-AKU-Y - G3-PLC Power Line Modem 3.3V | Microchip
The Microchip Technology ATPL250A-AKU-Y is a G3-PLC (Power Line Communication) modem microcontroller IC operating from a 3.3V supply, housed in an 80-pin LQFP (AKU) package, rated for the industrial temperature range of -40C to +85C. A power line communication modem is a specialized communication IC that transmits and receives data over existing AC mains or DC power lines, eliminating the need for dedicated wiring. It sits within the broader hierarchy of communication ICs and embedded processors: PLC modem -> telecom interface IC -> network controller -> microcontroller-class system-on-chip. G3-PLC is an open standard promoted by the G3-PLC Alliance and supported by internationally recognized standards bodies, widely deployed in smart grid infrastructure. The ATPL250A features a flexible architecture composed of hardware accelerators and coprocessors that achieve a very efficient G3 PHY layer implementation. According to the Microchip ATPL250A datasheet, the device supports G3-PLC CENELEC, ARIB, and FCC profiles, making it adaptable to regional regulatory band plans across Europe, Japan, and North America. The hardware-based PHY offloads modulation, coding, and windowing tasks from software, reducing CPU load and improving real-time determinism. This combination of flexible coprocessor architecture and multi-profile band support makes the ATPL250A a compact and highly efficient device for a wide range of smart grid applications, including smart metering (smart meters and data concentrators), street lighting control, industrial and home automation, and home area network gateways. The 80-pin LQFP provides sufficient GPIO and peripheral interfaces to host application firmware alongside the modem function. When designing with the ATPL250A, careful attention must be paid to the analog front-end coupling network between the modem and the power line, as line impedance variation directly affects achievable data rate and link reliability. Microchip provides the ATPL250A Evaluation Kit (documented in device document 00002299B) as a hardware platform for evaluating the modem and integrating it into custom designs. This page synthesizes distributor pricing, drop-in family alternatives, and practical design guidance not found in the manufacturer datasheet, consolidating data from DigiKey, Mouser, Octopart, and Microchip documentation as of 2026-09-19.
AX58100LT - 2/3-Port EtherCAT Slave Controller | ASIX
The ASIX Electronics AX58100LT is a 2/3-port EtherCAT Slave Controller (ESC) with two integrated Fast Ethernet PHYs, operating from a 3.3V supply and packaged in an 80-pin LQFP-EP (10x10 mm). It implements the EtherCAT slave protocol in hardware and exposes 2 or 3 PHY ports plus digital host interfaces (SPI / host bus) to an external MCU, making it one of the most integrated single-chip ESCs in its class. An EtherCAT Slave Controller is a specialized industrial Ethernet IC that handles the EtherCAT protocol (a deterministic real-time Ethernet standard originally developed by Beckhoff and standardized by the EtherCAT Technology Group) without burdening the host CPU. The EtherCAT protocol itself falls under the broader hierarchy of industrial fieldbuses -> real-time Ethernet -> industrial communication IC -> semiconductor. The "slave" role means the device sits on the bus as a node that processes the EtherCAT datagram on the fly as it traverses each port, in contrast to an EtherCAT master which orchestrates the network. The AX58100LT integrates two 100BASE-TX Fast Ethernet PHYs directly on-die, eliminating the need for external PHY chips and reducing BOM cost, PCB area, and signal-integrity complexity for servo drives, distributed I/O, and sensor modules. With 100 Mbit/s full-duplex ports, it supports standard EtherCAT cycle times down to the 12.5 us micro-period range and the typical 1 ms motion-bus update rate. The industrial-grade -40C to +105C operating range suits it for servo, motion control, and factory automation deployments. Typical applications include EtherCAT servo motor drives, decentralized digital I/O modules, EtherCAT sensor interfaces, robotic joint controllers, EtherCAT junction or branch modules, and other industrial-automation nodes. The STM32F303RE host reference design published by ST validates AX58100LT for FOC (field-oriented control) servo loops and points designers toward proven firmware stacks. When designing with the AX58100LT, ensure the 80-pin LQFP-EP exposed pad is soldered with sufficient thermal via arrays to dissipate internal PHY power, and route the differential MDI pairs as 100-ohm differential controlled-impedance traces. The host MCU should run an ASIX-supported EtherCAT slave stack (e.g., SOES or SSC ported to the chosen MCU) to maximize bus conformance. This page synthesizes distributor pricing, LQFP-80 drop-in alternatives, and practical industrial-board design notes not found in the raw manufacturer datasheet, giving the BOM engineer a complete procurement and design entry point for EtherCAT nodes built around the AX58100LT.
B50280C1KFBG - Octal 10/100/1000 PHY Transceiver | Broadcom
The Broadcom B50280C1KFBG is an octal 10/100/1000 Mbps Ethernet PHY transceiver integrated circuit designed for high-density networking line cards and switch aggregation. The device integrates eight independent Gigabit Ethernet physical layer transceivers in a single package, supporting full-duplex operation over twisted-pair copper media, and is targeted at enterprise switching platforms where port density and per-port power are both critical design constraints. An Ethernet PHY (Physical Layer Device) is the lowest-speed layer of the OSI networking stack, handling the analog signaling, encoding/decoding, clock recovery, and link training required to push bits over a Cat5e/Cat6 cable. PHY transceivers sit beneath the MAC and switch fabric; an octal PHY like the B50280C1KFBG aggregates eight Gigabit PHYs into one IC to simplify PCB routing, reduce component count, and minimize board area compared to using eight discrete single-port PHYs. PHY -> Ethernet transceiver -> Networking IC -> Interface IC -> Integrated Circuit is the broader hypernym chain. The B50280C1KFBG supports auto-negotiation, auto-MDI/MDIX crossover, Energy Efficient Ethernet (EEE, IEEE 802.3az), and 802.1AE MACsec readiness depending on firmware build. Each port independently negotiates 10/100/1000BASE-T, recovers clock and data, and presents GMII/RGMII to the host MAC. The integrated DSP-based echo canceller and baseline wander correction enable robust 100m Cat5e link performance without external magnetics beyond the standard 1:1 transformer. Typical applications include top-of-rack and leaf switches, network interface cards with multi-port PHYs, router line cards, industrial Ethernet switches, and telecom access equipment. Per-port power below ~1W and the octal integration make it especially suited for chassis switches where hundreds of Gigabit ports must be supported within thermal and power budgets. Designers should pay attention to the SGMII/SerDes reference clock architecture, the quad-port group power sequencing, and the requirement for dedicated 1:1 isolation transformers per port. PCB layout for the B50280C1KFBG demands careful 100-ohm differential pair routing for each of the eight MDI channels with strict length matching. This page synthesizes distributor pricing, package specifications, and drop-in alternatives that are not found in the manufacturer datasheet alone, providing a single reference for engineers evaluating the B50280C1KFBG against multi-port PHY options from Broadcom and competitor families.
BCM47083SL01 - Single-Band 11n WLAN SoC | Broadcom
Broadcom BCM47083SL01 is a single-band IEEE 802.11n WLAN system-on-chip (SoC) chipset offered in the BCM47083 family for embedded wireless networking equipment. The verified distributor information identifies it as an RF System on a Chip and confirms the 802.11n, single-band WLAN function. The available records identify Broadcom as the manufacturer and Broadcom Avago as the legacy distributor brand designation. A manufacturer datasheet URL, package dimensions, pin count, pinout, operating-frequency range, and detailed electrical ratings are not included in the supplied source data. An RF system-on-chip is an integrated semiconductor that combines wireless radio, baseband processing, and supporting control functions into one device. Within the product hierarchy, it is a WLAN connectivity SoC, a type of wireless network interface integrated circuit, and therefore belongs to the broader semiconductor and integrated-circuit categories. Integration can reduce the component count and board area required for an embedded 802.11n access point, router, gateway, or other connected product compared with a discrete radio approach. The principal verified feature of BCM47083SL01 is single-band IEEE 802.11n operation. This makes it relevant to embedded systems requiring Wi-Fi connectivity without a dual-band radio requirement. The device is listed by Mouser as an RF System on a Chip and WLAN chipset, while the DigiKey and Octopart records identify it as a Broadcom microprocessor-class component. Current distributor availability information compares listings from four distributors, with individual vendors such as Hotenda and Bettlink indicating stock. Because the supplied data does not contain a Broadcom datasheet, detailed RF characteristics cannot be stated safely. Information such as operating frequency, transmit power, receiver sensitivity, supported antenna interfaces, processor architecture, memory configuration, supply voltage, package type, and operating-temperature range requires the missing manufacturer document. The MPN suffix may encode ordering, temperature, or packaging information, but it must not be decoded without an authoritative part-number guide. Consequently, this page does not infer those parameters from the suffix. Typical implementation areas include embedded Wi-Fi routers, wireless gateways, access points, home automation controllers, industrial gateways, and connected consumer equipment. In these systems, the BCM47083SL01 can serve as the central WLAN connectivity component while an Ethernet controller or physical-layer transceiver handles wired networking. Site-listed LAN8720A-CP and DP83822HRHBR parts are examples of Ethernet-interface components that may appear in a broader connected product, although their use with BCM47083SL01 is not verified by the supplied Broadcom documentation. Design review should begin with the official Broadcom datasheet and package drawing. Pin assignment, exposed-pad requirements, RF routing, antenna matching, power sequencing, decoupling, PCB stack-up, and thermal management must be checked against the exact ordering variant. Do not reuse an existing footprint solely from distributor metadata; confirm the physical package and exposed thermal pad before schematic capture or PCB release. This page combines verified distributor descriptions, current sourcing links, specification gaps, engineering-use analysis, and design cautions in one decision-oriented record. It distinguishes confirmed facts from unavailable manufacturer parameters so engineers can identify what must be checked before qualifying BCM47083SL01 in a production wireless design.
BCM5221KPB - 10/100 Ethernet Transceiver | Broadcom
The Broadcom BCM5221KPB is a 10/100BASE-TX/FX mini-PHY Ethernet transceiver with integrated physical-layer signaling, a 64-terminal BGA package, and industrial-temperature positioning. It is designed for network interfaces that need copper or fiber connectivity, link-status control, low-power operation, and compact PCB integration. The verified distributor data identifies the part as a 1/1 Ethernet transceiver, while the Broadcom data sheet provides the authoritative technical details for electrical, mechanical, and software configuration requirements. What is an Ethernet transceiver? An Ethernet transceiver is an interface IC that converts digital data into physical network signals and converts received signals back into digital data. A 10/100BASE-TX/FX mini-PHY sits below the Ethernet MAC and handles the physical encoding, clocking, signal conditioning, and link-related functions required for 10 Mb/s and 100 Mb/s networks. It belongs to the interface-IC hierarchy: Ethernet interface transceiver, physical-layer device, network-interface IC, and semiconductor. The BCM5221KPB is identified in the supplied data as a Broadcom 10/100BASE-TX/FX mini-PHY transceiver. The verified source list includes an official Broadcom PDF and distributor listings from DigiKey, Mouser, Octopart, Win Source, and other suppliers. The package is identified by the Partstack result as a square 64-terminal BGA with a ball terminal form and industrial temperature grade. Exact pin assignments, electrical limits, media interfaces, clocking modes, and register details remain tied to the manufacturer data sheet. Typical uses include embedded Ethernet equipment, industrial controllers, network adapters, telecom access equipment, and systems requiring a compact copper/fiber physical-layer interface. In a copper link, the device connects the Ethernet MAC-side digital interface to the transformer-coupled 10/100BASE-TX network. In a fiber-oriented implementation, the FX capability can support the appropriate optical-module interface, subject to the detailed application requirements in the Broadcom data sheet. Its industrial-grade identification makes it more relevant to equipment operating outside consumer-only temperature ranges, although exact temperature limits must be taken from the manufacturer documentation. Designers should verify the package land pattern, ball assignments, decoupling requirements, media-side components, and supported operating modes directly against the Broadcom data sheet. PCB layout is especially important for high-speed physical-layer signals; controlled impedance, short return paths, uninterrupted reference planes, and careful isolation between transmit and receive paths can reduce signal-integrity risk. Do not infer pin compatibility or substitute parts from package similarity alone. This product page combines the verified source URLs, practical interface-transceiver context, and explicit data gaps. It does not invent missing electrical values, pricing, pin names, or alternative cross-references that were not present in the supplied evidence.
BCM5222KPF - Dual-Port 10/100BASE-TX Ethernet PHY | Broadcom
Broadcom BCM5222KPF is a highly integrated dual-port 10/100BASE-TX Ethernet transceiver with digital adaptive equalization, ADC, phase-lock loop, line driver, encoder, decoder, and required support circuitry in a monolithic CMOS device. It supports IEEE 802.3u Fast Ethernet operation, including the Media Independent Interface (MII) and Auto-Negotiation functions, and is supplied in a 100-ball FBGA package. An Ethernet PHY, also called a physical-layer transceiver, is the interface between a digital network controller and copper Ethernet cabling. It converts transmitted digital symbols into analog signaling, receives and equalizes incoming analog signals, and converts them back into digital data. The BCM5222KPF places two Fast Ethernet physical-layer channels and their common support functions into one device, reducing external component count in dual-port network equipment. According to the manufacturer datasheet, BCM5222 integrates an adaptive equalizer, ADC, PLL, line driver, encoder, decoder, and support circuitry. The device is designed for dual-port 10/100BASE-TX networks and includes MII and Auto-Negotiation support. The verified distributor data identifies an industrial temperature grade, ball terminal form, square package shape, FBGA package code, and 100 terminals. Detailed electrical limits, pin assignments, clock requirements, and register behavior must be confirmed in the manufacturer datasheet before design release. The BCM5222 family is suited to Ethernet switches, routers, network interface cards, embedded gateways, industrial controllers, and other systems requiring two copper Fast Ethernet ports. Its integrated CMOS implementation can simplify board layout compared with a discrete transceiver approach, although careful separation of analog and digital circuits remains essential. MII compatibility allows connection to a compatible Ethernet MAC, while Auto-Negotiation supports speed and duplex negotiation according to the system configuration. A practical design must preserve the transceiver's required decoupling, controlled clocking, MII signal integrity, and high-speed differential routing. The 100-ball FBGA package requires careful escape routing and via-in-pad or via-near-pad strategy on multilayer PCBs. Because the supplied data does not include verified pin names or detailed timing, power, and environmental limits, engineers should use the official BCM5222 data sheet for the complete schematic, layout, and component-selection checklist. This product page combines the official Broadcom datasheet reference, distributor package data, and practical Ethernet-PCB guidance. It does not infer undocumented alternatives or specifications. Review the source links and manufacturer documentation for procurement, lifecycle, and design qualification requirements.
BCM5222KQMG - Dual-Port 10/100 Ethernet PHY | Broadcom
The Broadcom BCM5222KQMG is a dual-port, full-duplex Ethernet physical-layer transceiver supporting 10 Mbps and 100 Mbps operation in a 100-lead MQFP package measuring 14 x 20 mm. The device belongs to the Ethernet PHY hierarchy, where a PHY connects a digital media-access controller to a copper Ethernet network through an MII interface. An Ethernet PHY is the physical-layer portion of an Ethernet communication system. It converts digital data into signals suitable for transmission over twisted-pair cabling and recovers timing and data from received signals. According to the Broadcom BCM5222 data sheet, the BCM5222 integrates a digital adaptive equalizer, analog-to-digital converter, phase-locked loop, line driver, encoder, decoder, and supporting circuitry in one monolithic CMOS device. It complies with the IEEE 802.3u requirements for Fast Ethernet, including the Media Independent Interface and Auto-Negotiation sections. The verified distributor listing identifies BCM5222KQMG as a 2/2 full-Ethernet transceiver with PHY functionality and a 100-MQFP package. A separate indexed specification describes the BCM5222 family as a dual-port 10/100BASE-TX Fast Ethernet transceiver. These facts make the part applicable to dual-port embedded networking equipment, but the supplied data does not state the exact PHY-versus-MAC division for every internal function, nor does it provide a complete electrical performance table for this orderable MPN. Its monolithic integration is significant because it consolidates several receive and transmit signal-chain blocks into one component. The integrated adaptive equalizer supports copper-channel signal conditioning, while the phase-locked loop, converter, line driver, encoder, and decoder form the core transmit and receive implementation described by Broadcom. The supported MII and Auto-Negotiation functions help connect the PHY to an Ethernet MAC through a conventional parallel interface. Typical application candidates include industrial Ethernet controllers, embedded network appliances, printer and scanner interfaces, network interface cards, and dual-port embedded communication systems. Because the verified excerpts do not provide supply voltage, operating temperature, media reach, cable length, jitter, latency, EMI performance, or exact register compatibility, these specifications must be checked in the manufacturer data sheet before schematic sign-off. A practical design decision is to preserve the 100-MQFP footprint and verify the exact MII pin assignments before routing. Designers should also check the Broadcom reference design or application guidance for recommended magnetics, termination, crystal or clock requirements, decoupling, and controlled-impedance layout. Those implementation details cannot be inferred solely from the distributor classification. This page separates verified BCM5222KQMG facts from unavailable orderable-part details and synthesizes sourcing, comparison, and design considerations for engineers. It does not substitute generic Ethernet-PHY claims for missing manufacturer data, helping procurement and hardware teams distinguish confirmed specifications from parameters that still require verification.
BCM53101EKMLG - 7-Port 10/100 Ethernet Switch | Broadcom
Broadcom BCM53101EKMLG is a feature-enhanced seven-port Ethernet switch integrated on a 65 nm process, combining five 10/100 MACs, five integrated 10/100 PHYs, packet buffering, media access control, and one Gigabit Ethernet port in a single controller. The component is categorized as a 10/100 Base-T/TX PHY interface controller and supports operation from a 1.2 V supply, according to the Broadcom manufacturer datasheet. An Ethernet switch is a network-interface controller that connects multiple internal or external nodes through dedicated or shared frame-processing resources. Within the semiconductor hierarchy, BCM53101EKMLG is a switch controller, interface IC, and integrated circuit rather than a general-purpose processor. Its integrated MAC, PHY, and buffer functions reduce the component count required for a multiport Fast Ethernet design and simplify software-facing network management. The device is identified as a seven-port design that combines six Fast Ethernet connections with one Gigabit Ethernet connection. Five integrated 10/100 PHYs support copper networking interfaces, while the additional higher-speed port provides a path to a Gigabit Ethernet uplink. The integrated packet buffers help the switch manage frame traffic internally without requiring a separate switch controller for basic frame reception and forwarding. The 65 nm CMOS implementation is significant for a multiport networking device because it supports a high level of analog and digital integration while operating from a 1.2 V supply. Low-voltage operation can reduce power requirements in network appliances, although the final system should account for regulator efficiency, signal conditioning, magnetics, and thermal conditions under real traffic loads. Typical uses include compact Ethernet switches, network-interface controllers, industrial Ethernet equipment, embedded networking appliances, and access systems that combine multiple 10/100 links with a Gigabit uplink. The integrated PHY and MAC arrangement is particularly useful when board area, connector count, and design complexity must be controlled. External Ethernet transformers and carefully controlled impedance routing remain necessary for compliant copper interfaces. Designers should use the manufacturer pin-description table when assigning balls, power rails, reference clocks, media interfaces, and configuration signals. Decoupling, clock integrity, thermal via placement, and high-speed signal routing should follow the manufacturer's reference layout. Before a substitution is approved, verify that the complete pin list, package, operating conditions, register behavior, and PHY specifications match the target design. This page combines the BCM53101EKMLG functional summary, sourcing guidance, application context, design cautions, and a comparison framework intended to support faster engineering decisions. It emphasizes the differences that matter during component selection rather than presenting the switch as a generic Ethernet controller.
BCM53108IMLG - 9-Port FE Switch with EEE | Broadcom
The Broadcom BCM53108IMLG is a 9-port Fast Ethernet switch with Energy Efficient Ethernet (EEE) support, supplied as an interface integrated circuit for embedded networking equipment. The verified product listing identifies the device as a 9-port FE switch with EEE, while detailed electrical ratings, package dimensions, pin assignments, operating-temperature limits, and supported media interfaces are not included in the available technical records. An Ethernet switch is a network-semiconductor device that connects multiple physical-layer ports to a higher-layer network processor or switching fabric. The BCM53108IMLG combines multiple Fast Ethernet endpoints with EEE capability, allowing compatible links to reduce power consumption when traffic is idle. This makes the device relevant to gateways, routers, industrial Ethernet equipment, access systems, and embedded network appliances requiring several 100BASE-T connections. The part is identified in the available listing as a Broadcom interface IC and is categorized as an Ethernet interface device rather than a general-purpose logic IC. Its 9-port FE architecture provides a concentrated set of Fast Ethernet connections in one device, reducing the number of discrete network-interface components required in a multi-port product. EEE support can also help reduce system power when connected devices and link partners implement the same energy-saving behavior. The package and exact pinout are not available in the supplied product records. Consequently, a footprint replacement should not be selected from the part description alone. Before schematic capture, PCB layout, or production sourcing, engineers should obtain the manufacturer datasheet and compare power pins, port interfaces, management signals, reference clock requirements, reset behavior, and package drawing against the target design. Typical uses include industrial routers, building-control gateways, IP-camera and surveillance systems, embedded Linux appliances, and Ethernet aggregation products. In each case, the 9-port Fast Ethernet arrangement can simplify board partitioning, while EEE can lower activity-related power when both ends of a link support the feature. This page combines the confirmed product identity, switch-port count, EEE feature, packaging information, and practical sourcing context with design guidance that helps distinguish a confirmed drop-in replacement from a merely similar Ethernet interface. A final replacement decision must use the manufacturer’s package drawing and pin-description tables rather than distributor category labels alone.
BCM53134MKFBG - Ultra-Low-Power Gigabit Switch | Broadcom
Broadcom BCM53134MKFBG is an ultra-low-power, highly integrated, smart-managed Gigabit Ethernet switch controller with a 256-ball FBGA package measuring 11 x 11 mm. It supports multiport Gigabit Ethernet connectivity and is based on Broadcom's ROBO architecture. The device is designed for cost-sensitive network equipment requiring Gigabit-class forwarding, integrated management, compact PCB area, and low system power consumption. An Ethernet switch controller is a network-interface semiconductor that connects multiple Ethernet ports, manages traffic between them, and provides the physical-layer and control functions needed in routers, gateways, access equipment, and embedded network appliances. Within the broader hierarchy, BCM53134MKFBG is an Ethernet switch interface, a networking semiconductor, and a member of the power-management-conscious communication-IC category. Its multiport architecture consolidates repetitive switching functions into one highly integrated device. The principal product attributes are a 256-FBGA package with an 11 x 11 mm body, Gigabit Ethernet switching, ultra-low-power operation, smart-managed functionality, and an ROBO-based architecture. These characteristics make the controller suitable for space-constrained products that need multiple Gigabit network connections without implementing each port as a discrete interface. Its integrated design can reduce board area and simplify the relationship between the host processor and physical network interfaces. Technical selection requires attention to the complete Broadcom product brief, including supported port count, interface media, management features, electrical characteristics, clocking, and application topology. Because this controller is packaged in a 256-ball FBGA, its implementation is intended for multilayer PCB construction and careful escape-routing rather than simple hand-soldering. Designers should preserve the land pattern, ball assignment, power distribution, thermal design, and reference circuitry specified by Broadcom. Typical applications include home gateways, routers, access points, set-top equipment, industrial Ethernet controllers, and other embedded network products that need a compact multiport Gigabit Ethernet solution. In these systems, BCM53134MKFBG can centralize Ethernet switching while the system processor manages higher-level services, configuration, and user traffic. The ROBO architecture is relevant when the design prioritizes integrated switching with cost-effective network management. The main design trade-off is integration versus board complexity. Using a 256-ball BGA saves board area and supports a dense multiport implementation, but it requires exact footprint matching, multilayer routing, adequate via density, and disciplined power and return-path planning. Before releasing a PCB, verify the pinout, reference configuration, clock requirements, thermal layout, and software-support requirements against the current Broadcom product brief. This product summary combines the exact package and positioning stated by Broadcom with engineering guidance for selecting, laying out, and sourcing the BCM53134MKFBG. It highlights why the part is selected for multiport Gigabit Ethernet systems, while directing engineers to the manufacturer documentation for detailed implementation parameters.
BCM53134PKFBG - Ethernet Switch Interface | Broadcom
The Broadcom BCM53134PKFBG is an Ethernet switch interface controller packaged in a 256-ball FBGA package measuring 11 mm by 11 mm. The device is manufactured using CMOS technology and is identified as a commercial-temperature Ethernet transceiver or switch controller. Its listed electrical characteristics include a 1 V supply voltage and a maximum operating temperature of 70°C. The package uses a 0.65 mm ball pitch, while component listings report 212 terminals in the device terminal description. An Ethernet switch interface controller is a semiconductor that integrates multiple functions required to connect network endpoints through copper or fiber media. Within the broader hierarchy, it belongs to Ethernet controllers, then network interface controllers, interface ICs, integrated circuits, and semiconductors. The BCM53134 family is positioned for embedded networking equipment where integrated Ethernet switching, physical-layer support, and cable diagnostics can simplify the connection between a host processor and external network ports. Key listed features include cable diagnostics, an ultra-low-power operating mode, CMOS construction, and a compact 256-FBGA package. The low-power mode is relevant to designs in which the controller must reduce consumption while the network remains idle or partially active. Cable diagnostics provide a mechanism for detecting faults in copper links, while the 11 mm by 11 mm land pattern supports space-constrained boards that cannot accommodate a large quad-flat package. Commercial temperature grading supports designs operating up to 70°C. The device is presented in distributor records as an Ethernet switch interface IC and also as an Ethernet transceiver. This terminology reflects the device's networking role and its integration of switching and physical connectivity functions. Its exact port count, media interfaces, clocking architecture, register organization, electrical thresholds, and power-consumption figures should be confirmed from the Broadcom manufacturer documentation before schematic capture or PCB implementation. The available product records do not expose a manufacturer-hosted technical datasheet URL. Typical BCM53134PKFBG applications include industrial Ethernet gateways, managed network switches, set-top and customer-premises equipment, embedded routers, access equipment, and other systems that require a dedicated Ethernet switch interface. The controller can be paired with magnetics, a clock source, nonvolatile storage, and a host processor. Designers should allocate continuous board area for high-speed routing, maintain controlled return paths, and validate power sequencing across the 1 V core and other required supply rails. PCB implementation requires careful BGA fanout, via placement, and layer-transition planning for the 0.65 mm pitch array. The exposed thermal behavior of the 256-FBGA package must be evaluated against board copper rather than treated as an isolated IC condition. Signal-integrity work should include Ethernet line impedance, connector or magnetics placement, and return-path continuity. Because package and terminal descriptions differ across catalog records, engineers should confirm the exact ball map and mechanical drawing before releasing artwork. This product page consolidates the confirmed package, electrical, environmental, and feature information into an engineering-oriented reference. It also distinguishes confirmed catalog characteristics from parameters that require direct confirmation in the manufacturer documentation. That separation helps designers assess fit at an early stage without treating incomplete interface details as released design data.