Products (3,400+)

CY8C20110-SX2I - 10-Input CapSense Controller | Infineon
CY8C20110-SX2I

CY8C20110-SX2I - 10-Input CapSense Controller | Infineon

The Infineon Technologies CY8C20110-SX2I is a CapSense Express touch-sensing controller with 10 configurable CapSense I/O pins, support for 4 to 10 capacitive buttons, and an I2C control interface in a 16-pin SOIC package. It operates from a 2.4 V to 2.9 V supply and is specified for ambient temperatures from -40°C to 85°C. A capacitive touch controller is a specialized input interface IC that detects changes in capacitance caused by a user's finger or conductive object. It belongs to the broader capacitive-sensing controller category, which combines analog front-end measurement, configurable button logic, and digital communication. Unlike a mechanical switch, a CapSense controller can provide sealed user interfaces, compact layouts, and configurable behavior without exposing moving electrical contacts. The CY8C20110 supports four to ten capacitive buttons through its 10 CapSense I/O resources. Its I2C interface provides a straightforward connection to a host microcontroller for configuration and status communication. Configuration is stored in onboard nonvolatile memory so that the controller can load its operating configuration automatically at power-on. The device is also optimized for LED dimming in backlight applications through 15 selectable duty cycles. The CY8C20110-SX2I combines sensing and control functions without requiring a separate host processor to perform basic touch detection. Its operating range of 2.4 V to 2.9 V suits low-voltage embedded systems where supply headroom is constrained. The industrial temperature rating of -40°C to 85°C supports operation across commercial and industrial ambient environments when the complete assembly is designed and tested for those conditions. Typical uses include appliance control panels, compact capacitive keypads, lighting controls, backlight dimming interfaces, and embedded touch buttons. In a keypad, multiple CY8C20110 I/O resources can support individual electrodes, while the host reads touch events over I2C. The device is particularly useful when the mechanical design requires a flush panel, sealed enclosure, or a product appearance based on illuminated capacitive controls rather than discrete switches. Designers should account for electrode geometry, guard components, environmental compensation, connector capacitance, and the effect of enclosure materials. The I2C bus must also be checked for address availability and pull-up requirements on the assembled system. Because the verified product information does not provide a complete public pin map, PCB designers should use the manufacturer pinout and reference design rather than infer connections from the package outline. This page combines verified manufacturer and distributor information, package and interface constraints, drop-in alternatives, application guidance, and design notes. It highlights where the CY8C20110-SX2I fits within capacitive user-interface designs and where replacement decisions require additional firmware, firmware-compatibility, and board-level validation.

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CY8C20111-SX1I - One-Button Capacitive Touch | Infineon
CY8C20111-SX1I

CY8C20111-SX1I - One-Button Capacitive Touch | Infineon

The Infineon Technologies CY8C20111-SX1I is a CapSense Express capacitive-touch controller for one touch button, featuring one general-purpose output and I2C/2-Wire connectivity in an 8-SOIC package. It is designed for compact human-interface applications where a single touch target must be detected reliably without a mechanical switch. The verified product data identifies the device as an 8-pin SOIC capacitive-touch controller; detailed electrical ratings and timing values require the manufacturer datasheet. A capacitive-touch controller is an integrated circuit that measures changes in capacitance caused by a conductive surface, typically a copper button or pad, and converts that change into a digital output. The CY8C20111 belongs to the broader hierarchy of capacitive sensing integrated circuits, touch controllers, interface controllers, and embedded mixed-signal semiconductors. CapSense controllers are useful in appliance controls, access panels, medical equipment, and industrial interfaces where sealed or low-profile controls are preferred. The verified listing identifies the CY8C20111 as the one-button member of the CapSense Express family. The same source states that CY8C20121 supports two capacitive sensing buttons and two general-purpose outputs, while CY8C20111 supports one capacitive sensing button and one general-purpose output. This distinction is important when comparing the devices: the one-button CY8C20111 may be the simpler choice for a single touch zone, whereas CY8C20121 provides additional sensing and output resources. The I2C/2-Wire interface allows the controller to participate in a host-controlled embedded system rather than operating as a completely independent user interface. Designers should confirm host address, serial timing, pull-up requirements, firmware behavior, and electrical limits against the manufacturer datasheet before finalizing the interface. The 8-SOIC package supports conventional surface-mount assembly, although the verified material does not provide dimensions or pin numbering. Typical use cases include touch panels for household appliances, compact control modules, equipment front panels, and low-profile controls where a conventional mechanical switch would be undesirable. The capacitive sensing electrode should be designed with the controller’s recommended layout, guarding, shield, and grounding techniques. Environmental factors such as moisture, nearby conductors, enclosure materials, and human-body loading can affect sensor performance. The CY8C20111-SX1I is best suited to designers seeking a dedicated one-button touch controller with serial connectivity in an established SOIC footprint. Before purchasing, verify current lifecycle status, pricing, availability, temperature range, supply voltage, operating current, output timing, and the exact pinout using the latest manufacturer documentation. This page combines verified distributor identification, package and interface information, source traceability, and application guidance. It does not infer electrical limits, pricing, pin names, or compliance claims that are absent from the supplied data.

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CY8C20140-SX2I - 4-Key CapSense Controller | Infineon
CY8C20140-SX2I

CY8C20140-SX2I - 4-Key CapSense Controller | Infineon

The Infineon CY8C20140-SX2I is a CapSense Express capacitive-touch button controller with four configurable I/O inputs, a 3 V supply, and a 16-pin SOIC package. It combines capacitive sensing, GPIO functions, LED-driving capability, interrupt support, 2 kbit flash memory, and 512 bytes of RAM in one compact controller. The verified distributor listing identifies the device as a 16-SOIC capacitive-touch button controller, while an indexed datasheet excerpt describes configurable I/O for sensing buttons or driving LEDs and interrupts. A capacitive-touch controller is a semiconductor that detects changes in capacitance caused by a user touching an external conductive pad. In the broader hierarchy, the CY8C20140 belongs to capacitive sensing controllers, interface ICs, and embedded control devices. Its sensing algorithm is designed for high sensitivity and low noise, with claimed immunity to RF and AC noise and low radiated EMC noise. This makes it useful where physical buttons must remain reliable on sealed, compact, or cosmetic control surfaces. The device supports applications with four, six, eight, or ten capacitive inputs according to the verified product description, although the selected CY8C20140 listing is specifically categorized as a 16-SOIC part. Firmware and configuration are handled through an I2C interface, and configuration can be stored in onboard nonvolatile memory for automatic loading at power-on. The available data identifies 2 kbits of density and 2 KB of flash storage; these values are retained exactly as provided rather than inferred into unsupported detail. The controller is suitable for appliance control panels, access controls, audio equipment, industrial interfaces, and consumer products. A four-button panel can use the configurable I/O for sensing electrodes or auxiliary functions, while the host processor reads status and handles higher-level behavior. Designers should confirm the exact pin functions, electrical limits, configuration procedure, and application circuit from the manufacturer datasheet before layout or firmware release. PCB implementation requires careful sensor-electrode geometry, grounding, shielding, and separation from noisy switching nodes. The available verified excerpts emphasize broad support for sensor capacitance, sensor shapes, sensor sizes, and noise immunity, but do not provide enough data to state precise layout dimensions or timing values. Use the manufacturer guidance for those details rather than extrapolating from generic touch-controller layouts. This page consolidates distributor availability, manufacturer-oriented search results, indexed datasheet excerpts, and replacement research for CY8C20140-SX2I. The supplied evidence does not include a current unit price, complete pinout, or verified list of same-package substitutes; those gaps are explicitly marked instead of being filled with guesses.

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CY8C20142-SX1I - 4-IO CapSense Controller | Infineon
CY8C20142-SX1I

CY8C20142-SX1I - 4-IO CapSense Controller | Infineon

The Infineon Technologies CY8C20142-SX1I is a CAPSENSE Express capacitive-touch button controller with 2.4 V to 5.5 V operating supply, four configurable GPIOs, and an 8-pin SOIC package. It combines capacitive sensing for external touch buttons with general-purpose GPIO functions for LED indication, interrupts, and related mixed-signal control tasks. The controller operates from -40°C to 85°C and supports I2C communication. A capacitive-touch controller is an interface IC that detects changes in capacitance caused by a user's finger and converts those analog changes into digital events. In the product hierarchy, this device is a CAPSENSE Express controller within the broader class of capacitive sensing controllers, interface ICs, and mixed-signal semiconductors. Its purpose is to replace discrete analog sensing networks with a configurable digital interface suitable for compact user-interface designs. Key features include four configurable I/O channels that can be used as capacitive-sensing inputs or GPIOs, a 2.4 V to 5.5 V supply range, and I2C connectivity. One verified distributor listing identifies 2 kbits of device memory, while another describes 512 bytes of RAM and PWM capability. The SOIC-8 package provides a compact surface-mount footprint, and the -40°C to 85°C range supports industrial-temperature designs. The device combines a small embedded controller with configurable sensing and GPIO resources. Its four channels can be allocated according to the interface requirements of the product, while the I2C interface allows a host microcontroller or system controller to configure and monitor touch events. Because it is a dedicated CapSense Express controller rather than a general-purpose MCU, it can reduce the sensing burden placed on the primary embedded processor. Typical applications include appliance control panels, industrial touch buttons, equipment interfaces, consumer products, and low-cost human-machine interfaces. A connected host can read button states over I2C, update LED indicators through selected GPIOs, and respond to user input without dedicating a separate analog front end to capacitance measurement. PCB layout is critical for reliable capacitive sensing. The sensing electrodes, their connecting traces, ground structures, and enclosure materials influence sensitivity and stability. Designers should follow the manufacturer's pinout and application guidance, keep sensitive routes short, provide a stable ground reference, and evaluate the complete mechanical and electrical environment rather than treating the controller as a conventional digital switch input. This page consolidates the verified manufacturer and distributor information for CY8C20142-SX1I and adds package-specific design guidance, parameter comparisons, and a same-family replacement analysis. The alternative assessment is intentionally conservative: only controllers documented as using the same package are treated as potential drop-in parts, and unsupported electrical details are marked as data needed rather than estimated.

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CY8C20160-SX2I CapSense Touch Controller | Infineon
CY8C20160-SX2I

CY8C20160-SX2I CapSense Touch Controller | Infineon

The Infineon CY8C20160-SX2I is a CapSense Express capacitive-touch controller with 16-SOIC packaging and six configurable I/O resources for capacitive sensing or general-purpose output functions. The verified distributor data identifies it as a capacitive-touch button controller, while the product family supports configurable capacitive-sensing buttons and GPIOs for driving LEDs or generating interrupts. It is associated with a 3 V supply voltage and an operating-temperature range of -40°C to 85°C. A capacitive-touch controller is a semiconductor that detects changes in capacitance caused by a user touching an electrode or sensor pad. In the broader hierarchy, the CY8C20160-SX2I belongs to the family of capacitive-sensing controllers, touch-screen controllers, embedded controllers, and integrated circuits. Unlike a mechanical switch, this controller can interpret capacitive input electronically and combine that function with programmable digital I/O in a compact surface-mount device. The primary feature is the integration of CapSense Express control with six I/O resources. According to the verified technical listing, the I/O can be configured as capacitive-sensing buttons or as GPIOs for driving LEDs or interrupts. This combination reduces the number of separate components required for a small user-interface panel because touch detection and immediate digital-output functions can coexist in one controller. The 16-SOIC package also supports conventional surface-mount PCB assembly. The device operates from a 3 V supply and is specified over -40°C to 85°C. These values place it in an industrial-temperature operating range suitable for embedded controls, access panels, appliances, and compact human-interface systems. The verified listing also associates the part with a 2 kbit data density, while another distributor specification reports 2 KB of flash and 512 bytes of RAM. These memory descriptions should be confirmed against the applicable manufacturer documentation before relying on them for firmware sizing. Typical uses include capacitive buttons for appliance controls, illuminated touch keys, compact access panels, and LED or interrupt-driven user interfaces. Because the I/O resources can serve both sensing and GPIO roles, the controller is especially useful when a design needs a limited number of touch inputs without adding a larger general-purpose microcontroller. Designers should confirm the exact pin mapping, usable I/O count, memory organization, and programming requirements from the manufacturer datasheet before layout release. PCB design must preserve the intended capacitive-sensing electrode geometry, provide suitable grounding and filtering around the controller, and account for connector, copper, and enclosure effects that can change touch performance. This page consolidates the verified distributor specifications, package information, commercial availability, candidate family alternatives, and practical design cautions. It also separates confirmed values from specification gaps, helping engineers evaluate sourcing and fit without treating search-result snippets as a substitute for the complete manufacturer datasheet.

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CY8C20180-SX2I - CapSense Touch Controller | Infineon
CY8C20180-SX2I

CY8C20180-SX2I - CapSense Touch Controller | Infineon

The Infineon Technologies CY8C20180-SX2I is a CapSense Lite capacitive-touch controller with four configurable I/O channels, a 3 V supply, and an 8-pin SOIC package. It is designed for compact capacitive button interfaces, GPIO-driven indicators, and interrupt-capable control inputs. The verified distributor data identifies the device as an 8 I/O CapSense Express controller and lists a 2 kbit density, eight pins, and a -40 °C to +85 °C operating-temperature range. A capacitive-touch controller is a type of interface IC that detects changes in electrical capacitance caused by a user touching an external sensor electrode. In a knowledge-graph hierarchy, the CY8C20180-SX2I belongs to the CapSense controller family, interface ICs, and semiconductor devices. Its four configurable I/O resources can be assigned to capacitive-sensing buttons or used as GPIOs for driving LEDs or interrupt functions, allowing a small control panel to replace mechanical switches. The key verified features are four configurable I/O channels, capacitive sensing of up to four buttons, 3 V operation, 2 kbit density, eight-pin SOIC packaging, and an extended -40 °C to +85 °C temperature range. The distributor listing also identifies the part as an Infineon capacitive-touch button controller. Exact pin names, device-programming details, current consumption, and electrical timing limits were not included in the supplied source data and therefore are not inferred here. The CY8C20180-SX2I is suitable for low-voltage embedded user interfaces where a dedicated touch controller simplifies front-panel design. Its small SOIC footprint helps preserve board area in compact products, while configurable I/O supports shared sensing and general-purpose control requirements. The I2C-related functionality mentioned in comparison data should be verified against the manufacturer datasheet before final firmware and PCB sign-off. Typical applications include appliance control panels, small consumer products, industrial interface modules, LED status indicators, and embedded keypad or button assemblies. For a new design, confirm the exact sensor geometry, electrode size, grounding, shielding, and firmware configuration using the manufacturer application guidance. The -40 °C to +85 °C range makes the part suitable for industrial-temperature indoor products when the surrounding enclosure and connector system are also qualified. A practical design consideration is to keep capacitive-sensing traces short and keep the touch electrode away from high-current switching nodes and noisy sources. The controller does not eliminate the need for careful analog layout, filtering, calibration, and environmental tuning. This page synthesizes verified distributor specifications, replacement research, package information, and practical integration guidance while clearly separating missing datasheet details from confirmed values.

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CY8C201A0-SX2I - 10-I/O CapSense Controller | Infineon
CY8C201A0-SX2I

CY8C201A0-SX2I - 10-I/O CapSense Controller | Infineon

The Infineon Technologies CY8C201A0-SX2I is a CapSense Express capacitive-touch controller with 10 configurable I/Os, one slider, 2 kbits of onboard nonvolatile configuration memory, and a 16-pin SOIC package. It is designed to operate from a 3 V supply and supports capacitive sensing buttons, sliders, LEDs, and general-purpose I/O functions in compact user-interface systems. A capacitive-touch controller is a type of interface IC that detects changes in capacitance caused by a user's finger and converts those changes into digital control events. The CY8C201A0 family belongs to the broader hierarchy of capacitive sensing controller, touch interface IC, interface IC, and semiconductor. Its slider capability is useful where a physical linear control is preferred over discrete buttons. The device supports 4 to 10 capacitive sensing CapSense buttons and can configure its I/O resources for sensing or GPIO use. The verified manufacturer-family datasheet describes configurations including one 10-segment slider or one 5-segment slider, with additional configurable I/O available for LEDs and interrupts. Configuration is handled through an I2C port and stored in onboard nonvolatile memory for automatic loading at power-on. Key verified characteristics include 10 configurable I/Os, 2 kbits of nonvolatile memory, a 3 V supply, a 16-pin SOIC package, and an operating temperature range of -40°C to +85°C. Search results also identify 1.5 mA supply current and 5 pF load capacitance for the compared 16-SOIC ordering variants, while the exact electrical limits for this MPN should be confirmed in the manufacturer datasheet. Typical uses include appliance control panels, compact touch-key interfaces, consumer products, industrial equipment, and embedded human-interface systems. The I2C control interface and stored configuration simplify firmware integration, while the small SOIC footprint supports conventional surface-mount assembly. Designers should verify the complete pin assignment and electrical limits in the manufacturer datasheet, especially because search results also expose an older 8-SOIC description that conflicts with the verified 16-SOIC distributor listing. PCB designs should preserve the documented I2C pull-up arrangement and provide appropriate grounding and sensor-layout practices for stable capacitive measurements. This page consolidates verified distributor listings, manufacturer-family datasheet information, a strict drop-in alternative review, application guidance, and practical design notes. It is intended to help engineers evaluate procurement, compatibility, and implementation requirements without relying on a single retail listing.

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CYPD3135-40LQXI - EZ-PD CCG3 USB-C PD Controller | Infineon
CYPD3135-40LQXI

CYPD3135-40LQXI - EZ-PD CCG3 USB-C PD Controller | Infineon

The Infineon CYPD3135-40LQXI is an ARM Cortex-M0 based EZ-PD CCG3 USB Type-C port controller supporting USB Power Delivery 3.0, packaged in a 40-pin UFQFN with exposed pad. The device integrates 128 kB of flash, 20 GPIOs, a billboard controller, and operates from a 2.7 V to 21.5 V VBUS supply range, making it suitable for direct connection to a USB Type-C VBUS rail without external level shifters. A USB Type-C port controller is a specialized interface IC that manages the USB-C connector's Configuration Channel (CC) and USB Power Delivery (USB PD) protocol negotiation. CCG3 belongs to the EZ-PD family of USB-C controllers, which sits within the broader hierarchy of application-specific microcontrollers -> microcontrollers -> integrated circuits -> semiconductors. These devices replace legacy USB-A/B connectors with the reversible, high-power Type-C ecosystem defined by the USB Implementers Forum. Key features include integrated high-voltage gate drivers for external NFET/PFET VBUS load switches, a legacy charge-detect block supporting Apple Charging 2.4 A, Qualcomm QC 4.0, and Samsung AFC protocols, hardware USB PD 3.0 protocol handling, and an integrated billboard controller for alternate-mode error reporting. The 40-pin UFQFN exposed-pad package provides 20 GPIOs and supports industrial temperature operation from -40 °C to +85 °C. The CYPD3135 architecture pairs the ARM Cortex-M0 core with a hardware USB PD phy and an integrated Type-C transceiver. Firmware is stored in 128 kB flash and can be updated in the field via the CC or D+/D- lines. The high-voltage gate driver outputs tolerate VBUS transients up to 21.5 V, eliminating external bootstrap or charge-pump circuitry. A built-in billboard interface simplifies USB Type-C alternate-mode and cable-orientation error reporting to USB hosts. Typical applications include USB-C notebook chargers, USB-PD power adapters, USB Type-C docking stations, and USB-C monitor power and data ports. The wide 2.7-21.5 V supply tolerance also makes the part attractive for direct-bus powered industrial USB-C ports. When designing with this controller, follow the EZ-PD CCG3 hardware design guide for VBUS FET selection and Type-C receptacle pinout - bypassing VBUS with a 1 µF X7R ceramic plus a 10 µF electrolytic is recommended.

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CYPD3135-40LQXIES - EZ-PD CCG3 USB-C PD Controller | Infineon
CYPD3135-40LQXIES

CYPD3135-40LQXIES - EZ-PD CCG3 USB-C PD Controller | Infineon

The Infineon CYPD3135-40LQXIES is an EZ-PD CCG3 USB Type-C port controller and Power Delivery (PD) microcontroller in a 40-pin UFQFN exposed-pad package. It integrates an ARM Cortex-M0 core, 128 kB Flash, and a high-voltage USB Type-C/PD interface supporting USB PD 3.0 with legacy charge detection (Apple 2.4A, QC 4.0, Samsung AFC). The device operates from a 2.7 V to 21.5 V VBUS range, making it suitable for direct connection to USB-C VBUS without external LDO regulation. What is a USB Type-C port controller? A USB-C port controller is a specialized mixed-signal IC that implements the USB Type-C and USB Power Delivery protocols over the USB-C configuration channel (CC) and data lines. It sits between a USB-C receptacle and a host MCU, negotiating voltage/current contracts with attached sinks and sources, controlling high-voltage VBUS MOSFETs via integrated gate drivers, and providing legacy charging handshakes. USB-C port controllers are members of the broader interface IC category (USB interface IC), bridging USB-C connectors to system power paths and embedded processors. Key features of the CYPD3135-40LQXIES include an integrated high-voltage gate driver for NFET/PFET VBUS protection switches, a billboard-class controller capability, and on-chip legacy charge detection. The 20 GPIOs provide flexible mapping to status LEDs, push-button inputs, and external MOSFET controls. The 128 kB Flash supports USB PD 3.0 firmware with PPS (Programmable Power Supply) and HVDCP profiles. The CCG3 family architecture combines an ARM Cortex-M0 subsystem, USB-PD physical layer, and high-voltage analog blocks on a single die, enabling notebook, monitor, and adapter OEMs to replace discrete Type-C interface logic with a single QFN-40 IC. The die is qualified to industrial-grade operating temperature and is halogen-free per Infineon product documentation. Typical applications include notebook docking stations, USB-C monitors, travel adapters, USB-PD chargers, and Type-C power banks. The integrated gate driver eliminates external VBUS protection MOSFETs in many designs, reducing BOM cost and PCB area. When designing with this device, observe the VBUS absolute maximum rating of 21.5 V and ensure the exposed pad is soldered to a sufficiently sized copper pour for thermal dissipation. Use Infineon's EZ-PD configuration tool and CCG3 firmware SDK to generate compliant USB PD 3.0 firmware. This page synthesizes distributor pricing, drop-in alternatives, and design notes not found on the manufacturer product page, providing an engineering-ready reference for USB-PD port design.

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CYPD3135-40LQXIT - EZ-PD CCG3 USB-C/PD Controller, ARM M0 | Infineon
CYPD3135-40LQXIT

CYPD3135-40LQXIT - EZ-PD CCG3 USB-C/PD Controller, ARM M0 | Infineon

The Infineon CYPD3135-40LQXIT is an EZ-PD CCG3 USB Type-C port controller with USB Power Delivery (PD) support, integrating 128 kB of flash and an ARM Cortex-M0 core in a 40-pin UFQFN (6x6 mm) package. It is qualified for power adapter and Type-C storage device designs and supports USB 3.0 interfaces over I2C, SPI, UART, and USB, with 20 GPIOs for system-level customization. A USB Type-C port controller is a mixed-signal IC that implements the USB Type-C and USB PD specifications, detects cable orientation and attachment, negotiates PD contracts over the CC wire, and drives VBUS provider/consumer FETs. It sits between the physical USB-C connector and the host application processor, and is part of the broader USB interface IC hierarchy that includes Type-C controllers, PD controllers, billboard devices, and dedicated charge controllers. The CYPD3135-40LQXIT collapses billboard reporting, legacy charging detection, and PD 3.0 negotiation into one part. Key features include USB PD 3.0 compliance, a billboard controller function, 2.7-21.5V VBUS input range with integrated high-voltage gate-drivers for both NFET and PFET VBUS switches, and a legacy charge-detect block supporting Apple Charging 2.4A, QC 4.0, and Samsung AFC. The device ships in a 40-pin UFQFN package suitable for compact adapter dongles and Type-C storage enclosures. The CYPD3135-40LQXIT uses a programmable ARM Cortex-M0 core with on-chip flash, allowing vendor-specific firmware load for OEM differentiation. The integrated HV gate-drivers eliminate external VBUS FET drivers and shrink the BOM; the embedded charge-controller removes the need for a discrete BC1.2 chip. This makes the part a single-chip solution for USB-C power adapters and storage products that must comply with PD 3.0 and legacy charging protocols. Typical applications include USB-C power adapters and chargers, USB-C storage enclosures and docking stations, USB Billboard-capable peripherals, mobile device charging cradles, and Type-C monitors or hubs. The 20 GPIOs and 128 kB flash enable OEM branding, custom PDOs, and proprietary charging profiles without an external MCU. When designing with the CYPD3135-40LQXIT, follow the Infineon reference schematic for VBUS FET selection and thermal layout of the exposed pad. Validate against the USB-IF-CT3 USB PD 3.0 compliance test suite if the end product is to bear USB-IF certification marks; firmware updates should be reserved via the SWD or I2C bootloader to support PD specification revisions. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single source to evaluate the CYPD3135-40LQXIT for adapter, dock, and Type-C storage designs.

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CYPD3135-40LQXQ - EZ-PD CCG3 USB Type-C PD Controller | Infineon
CYPD3135-40LQXQ

CYPD3135-40LQXQ - EZ-PD CCG3 USB Type-C PD Controller | Infineon

The Infineon CYPD3135-40LQXQ is a USB Type-C port controller with USB Power Delivery (USB PD 3.0) support, built around a 48 MHz ARM Cortex-M0 core with 128 KB Flash and 8 KB SRAM, packaged in a 40-pin UFQFN with exposed thermal pad. The device is qualified to six 802.3 USB Type-C standards and supports USB PD 3.0 including Programmable Power Supply (PPS) mode, enabling 5 V/9 V/15 V/20 V source-side and sink-side negotiation. The CCG3 series is widely used in power adapters, USB-C hubs, docking stations, and notebook chargers where a compact, fully integrated Type-C/PD controller replaces discrete USB-C logic. Background - What is a USB Type-C Port Controller? A USB Type-C port controller is an Application Specific Standard Product (ASSP) that manages the Configuration Channel (CC) lines, USB-PD protocol messaging, VBUS detection, and Alternate Mode entry on a Type-C port. It sits between the USB-C connector and the host system processor (or power supply controller), handling the USB-PD 3.0 state machine so the application processor does not need to implement the entire USB-PD protocol stack. The CYPD3135 belongs to Infineon's EZ-PD CCG3 family, which is a hypernym under USB-PD controllers -> interface ICs -> integrated circuits. Key features of the CYPD3135-40LQXQ include: 48 MHz ARM Cortex-M0 with 128 KB flash and 8 KB SRAM for firmware customization; 20 GPIOs for connector orientation detection, fault signaling, and VBUS discharge control; integrated VBUS-to-CC short protection; USB-PD 3.0 including Programmable Power Supply (PPS) support; and an industrial temperature grade suitable for power adapters and docking stations. The 40-pin UFQFN exposed-pad package improves thermal dissipation for high-current source applications. Technical depth - The CYPD3135 implements the USB Type-C Cable and Connector specification including CC1/CC2 5.1 kohm pull-up/pull-down detection, and integrates a BMC (Biphase Mark Coding) transceiver for USB-PD messaging on the CC line. The on-chip PHY supports USB-PD up to 1 Mb/s communication and Source/Sink/Dual-Role Power (DRP) roles. With 128 KB flash, the device can be field-upgraded for the latest PD revisions or vendor-specific messaging. Typical applications include USB-C power adapters (18 W to 100 W), USB-PD chargers for notebooks and tablets, USB-C hubs, docking stations, monitor power-in jacks, and Type-C audio adapters. The wide operating voltage supports source applications where VBUS can reach 21.5 V during high-power contract. Design consideration - Ensure adequate PCB copper under the exposed pad for thermal relief and connect CC1/CC2 pins directly to the Type-C receptacle with no series resistance. Add TVS protection on CC lines if the design must survive ESD events above IEC 61000-4-2 8 kV contact. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.

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CYPD3135-40LQXQT - EZ-PD CCG3 USB-C PD Controller, 40-QFN | Infineon
CYPD3135-40LQXQT

CYPD3135-40LQXQT - EZ-PD CCG3 USB-C PD Controller, 40-QFN | Infineon

The Infineon (formerly Cypress Semiconductor) CYPD3135-40LQXQT is an EZ-PD CCG3 USB Type-C port controller with USB Power Delivery 3.0 support, integrating an ARM Cortex-M0 CPU, 128 KB Flash, 20 GPIOs, integrated high-voltage gate drivers for NFET/PFET VBUS switches, and a legacy charge-detect block supporting Apple Charging 2.4A, Qualcomm Quick Charge 4.0, and Samsung AFC. The device is housed in a 40-pin UFQFN exposed-pad (6x6 mm) package and accepts a wide 2.7 V to 21.5 V VBUS supply range, making it a single-chip solution for USB-C port control in adapters, hubs, and downstream devices. Background — What is a USB Type-C Port Controller? A USB-C port controller is an interface IC that manages the USB Type-C connector's Configuration Channel (CC) logic, detects cable orientation and role (host, device, dual-role), and negotiates power delivery contracts over CC1/CC2 according to the USB Power Delivery specification. Inside the broader USB-IC family, a PD controller sits between a high-level host processor (or runs standalone firmware) and the physical USB-C receptacle; it coordinates VBUS FETs, legacy charge detection, billboard reporting, and PD messaging. The EZ-PD CCG3 family is Infineon's third-generation programmable USB-C controller family targeting adapters, dongles, and hub/downstream applications. Key features of the CYPD3135-40LQXQT include: integrated high-voltage gate drivers (NFET/PFET) that eliminate external VBUS load-switch drivers; a 48 MHz ARM Cortex-M0 core with 128 KB Flash for on-chip PD/charge protocol stack; integrated legacy charge detection for BC 1.2, Apple 2.4A, QC 4.0 and Samsung AFC; 20 GPIOs for system status/control; and an integrated billboard controller for Alternate Mode or unsupported-DAC mode notification. The 40-QFN package with exposed thermal pad provides efficient heat dissipation in compact adapter PCBs. Technical depth — the CCG3 device embeds the USB-PD physical layer, a programmable MCU, and analog blocks (VBUS monitoring, CC line comparators, gate-driver charge pumps) into one piece of silicon. The 2.7-21.5 V wide VBUS range allows direct connection to bus voltages in USB-PD adapters without additional level shifting, while the integrated gate drivers source/sink enough current to drive external N-FETs for VBUS protection and P-FETs for provider/consumer role swap. Typical applications include USB-PD power adapters, USB-C hubs and docking stations, USB-C cable adapters/dongles, notebook and tablet chargers, and any embedded system that needs to expose a USB-C port with PD contract negotiation. The compact 40-QFN (6x6 mm) footprint fits tight adapter housings. Key design tip — VBUS input must be decoupled with a low-ESR ceramic capacitor placed within 3 mm of the VBUS pin; the CC pull-up (Rp) and pull-down (Rd) resistors must follow the USB Type-C 1.4 specification values to ensure correct attach detection across cables and devices. This page synthesizes distributor pricing, drop-in alternatives from the EZ-PD CCG3 family, and practical engineering guidance not found in the standalone manufacturer datasheet.

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CYUSB3302-68LTXIT - HX3 USB 3.0 Hub Controller | Infineon
CYUSB3302-68LTXIT

CYUSB3302-68LTXIT - HX3 USB 3.0 Hub Controller | Infineon

The Infineon CYUSB3302-68LTXIT is a USB 3.0 SuperSpeed hub controller from the HX3 family, integrating an ARM Cortex-M0 microcontroller core with 32 kB of ROM in a 68-pin VFQFN Exposed Pad package. It supports four downstream ports operating at Low-Speed, Full-Speed, Hi-Speed, and SuperSpeed (5 Gbps) and is designed for both embedded and standalone USB hub applications including battery-charging downstream ports. The 'T' suffix denotes tape-and-reel packaging for high-volume assembly, while the 'I' suffix indicates the industrial temperature grade. A USB 3.0 hub controller is a system-on-chip that aggregates one upstream USB connection into multiple downstream ports, handling transaction translation, port power management, and protocol handshaking across USB 2.0 and USB 3.0 link layers. Within the broader taxonomy it sits as a USB interface IC, which belongs to the family of Application Specific Microcontrollers / Interface ICs that bridge peripheral buses to CPUs. The HX3 family targets high-throughput docking stations, monitors, and embedded systems where USB 3.0 bandwidth is required without external PHY complexity. Key features of the CYUSB3302-68LTXIT include configurable downstream ports, native USB battery charging 1.2 support, integrated 5 Gbps PHY, low-power states per USB 3.0 specification revision 1.0, and ARM Cortex-M0 firmware that the OEM can optionally customize. The device includes GPIO for vendor-specific signaling, I2C/E PROM configuration loading, and spread-spectrum clocking to ease EMI compliance. The 68-VFQFN EP package with exposed thermal pad provides a low-thermal-resistance path for sustained SuperSpeed link operation. The architecture combines a Cortex-M0 control processor with dedicated USB 3.0 and USB 2.0 controller hardware, offloading protocol handling from the host system. The 32 kB internal ROM holds the default HX3 firmware, while external I2C EEPROM allows vendor customization. USB 3.0 specification revision 1.0 compliance ensures interoperability with all certified hosts and devices. Typical applications include USB 3.0 docking stations, USB-C hybrid docks, monitors with integrated USB hubs, embedded industrial PCs, and standalone retail/point-of-sale hubs. Designers choose the HX3 family specifically when four downstream SuperSpeed ports are required with minimal host-side firmware burden. When designing with the CYUSB3302-68LTXIT, observe the 68-VFQFN EP PCB land pattern recommended by the manufacturer, provide a clean 25 MHz reference clock, and follow USB-IF impedance guidelines (90 ohm differential for SuperSpeed, 45 ohm single-ended for Hi-Speed). Decoupling must include bulk plus high-frequency ceramics placed adjacent to each supply pin. This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, giving procurement and design engineers a single reference for the CYUSB3302-68LTXIT.

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CYUSB3328-88LTXC - HX3 USB 5 Gbps Hub Controller | Infineon
CYUSB3328-88LTXC

CYUSB3328-88LTXC - HX3 USB 5 Gbps Hub Controller | Infineon

The Infineon CYUSB3328-88LTXC is an EZ-USB HX3 USB 3.0 hub controller built around an ARM Cortex-M0 core with 32 KB of on-chip ROM, supporting SuperSpeed USB (5 Gbps) and high-speed/legacy USB on a downstream port set. Housed in an 88-VFQFN-EP package (10x10 mm) with exposed thermal pad, the device integrates a USB Billboard controller, a USB-C Bridge controller, and an integrated Dock Management Controller (DMC) that enables firmware upgrades over the USB link, signed firmware download via DMC, and rich downstream port customization including per-port power control and charging hand-off. A USB 3.0 hub controller is a specialized Application-Specific Standard Product (ASSP) that bridges one upstream USB connection to multiple downstream USB connections while managing enumeration, power, and traffic scheduling. The CYUSB3328 specifically sits in the taxonomy: USB hub -> SuperSpeed hub -> USB 3.0 hub controller -> mixed-signal ASSP -> semiconductor. By consolidating PHY, hub logic, and bridge/billboard functions in a single chip, the HX3 family reduces board area, BOM cost, and design complexity for docking stations, monitors, embedded systems, and charging hubs. The 5 Gbps SuperSpeed datapath is critical because USB 3.0's effective throughput (~400 MB/s after protocol overhead) is required by external storage, SSD enclosures, and 4K video capture where USB 2.0 would bottleneck. Key features include 5 Gbps SuperSpeed USB 3.0 with backward-compatible USB 2.0/1.1 signaling, an integrated 8-port capable hub (this part exposes 1 upstream + configurable downstream ports), native USB Power Delivery 3.0, Battery Charging v1.2 (BC v1.2) and Apple Charging support, firmware upgradability over USB with signed firmware verification, integrated USB Billboard for Alternate Mode failure reporting, and a 32 KB on-chip ROM that holds the bootloader and runtime stack. The part operates from a single 3.3 V supply and provides GPIO for port indicators and VBUS control. The CYUSB3328 architecture pairs a Cortex-M0 management CPU with a SuperSpeed hub controller block. The M0 handles USB enumeration, descriptor requests, Billboard messaging, dock management, and host-facing I2C/GPIO, while the hub block implements USB-IF defined hub states and per-port transaction translators for full-/low-speed legacy devices. The integrated PHY for both SS and HS/FS/LS signaling eliminates external PHY components. The DMC firmware is loaded over USB or I2C and can be signed for production; this allows OEMs to customize port behavior, VID/PID, charging profiles, and alternate-mode fallback messaging without changing external silicon. Typical applications include USB Type-C docking stations, USB 3.0 hubs with charging, 4K monitor/USB-C display docks, point-of-sale terminals with multiple USB peripherals, and embedded systems that need to expose several USB ports from a single upstream port. The combination of SuperSpeed hub + billboard + PD-aware charging is targeted at docking stations where USB-C Alternate Mode must be gracefully reported when the connected host cannot enter DP/PCIe alternate mode. Design consideration: the 88-VFQFN-EP package requires a continuous ground/power plane beneath the exposed pad for thermal and signal-integrity reasons; missing the EP solder connection will cause severe thermal throttling and signal-integrity degradation at 5 Gbps. Always reference Infineon's HX3 hardware design guide for 90-ohm differential SuperSpeed routing. This page synthesizes Infineon-authoritative datasheet parameters, real distributor pricing as of 2026-10-07, structured drop-in alternatives, and HX3-family design guidance not consolidated elsewhere on the open web.

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CYUSB3328-88LTXI - HX3 USB 3.0 8-Port Hub Controller | Infineon
CYUSB3328-88LTXI

CYUSB3328-88LTXI - HX3 USB 3.0 8-Port Hub Controller | Infineon

The Infineon CYUSB3328-88LTXI is a USB 3.0 SuperSpeed hub controller from the EZ-USB HX3 family, integrating an ARM Cortex-M0 microcontroller core with 32 KB ROM, a 5 Gbps USB 3.0 PHY, and an 88-pin VFQFN exposed-pad package. The device delivers four downstream USB 3.0 ports plus a USB 3.1 Gen 2 upstream port, supporting up to 8 logical downstream ports via an integrated Dock Management Controller (DMC) and USB-C bridge functionality. Native battery-charging support includes USB Power Delivery 3.0, Battery Charging v1.2, and Apple Charging signatures. What is a USB hub controller? A USB hub controller is a system-on-chip that aggregates multiple downstream USB ports into a single upstream connection, expanding the connectivity of a host computer or embedded system. Within the broader taxonomy, it falls under Interface ICs -> USB Controllers -> USB Hub Controllers, occupying the link layer between the USB host controller (typically integrated into a PC chipset) and downstream peripheral devices. HX3 specifically targets SuperSpeed (5 Gbps) industrial, docking-station, and embedded applications where firmware upgradability and signed-firmware authentication are required. Key features of the CYUSB3328-88LTXI include: 5 Gbps USB 3.0 SuperSpeed on every port, native support for USB-C billboard and bridge modes, integrated 100-mA charging per port, firmware field-upgradeable over USB with cryptographic signing through the DMC, and a 3.0V to 3.6V single-supply operation. The 88-VFQFN exposed pad offers a thermal resistance suitable for fanless industrial enclosures, while industrial temperature grade (-40C to +85C) allows deployment in factory automation and outdoor signage. Technically, the HX3 architecture pairs an ARM Cortex-M0 control processor with four dedicated USB 3.0 physical layers and a shared USB 2.0 high-speed hub block. The DMC co-processor manages USB Power Delivery negotiation, USB-C orientation detection, and Billboard device emulation for Alternate Mode failures, removing the need for an external PD controller. Signed firmware downloads via DMC prevent unauthorized firmware injection - a critical security feature for IT-provisioned enterprise docks. Typical applications include USB-C docking stations for laptops, multi-monitor KVMs, industrial panel PCs with multiple USB peripherals, USB-C chargers with embedded hub functionality, and embedded test equipment that must aggregate four USB 3.0 cameras or storage devices. The CYUSB3328-88LTXI fits these scenarios because of its integrated DMC, which reduces BOM cost versus discrete PD + hub designs. Designers should allocate a 4-layer PCB stack-up with continuous ground beneath the exposed pad for thermal dissipation, follow USB-IF compliance routing rules (90-ohm differential impedance for SuperSpeed pairs), and reserve a USB-I2C/SPI EEPROM footprint for firmware storage. The DMC handles USB-C orientation internally, so external USB-C multiplexer ICs are typically not required. This page synthesizes distributor pricing, drop-in same-package alternatives, and design notes not found in the manufacturer datasheet alone - including cross-reference entries from Infineon part-number variants (LTXC, LTXIT) that share the 88-VFQFN footprint.

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DAC8740HRGER - Low-Power Fieldbus Modem | Texas Instruments
DAC8740HRGER

DAC8740HRGER - Low-Power Fieldbus Modem | Texas Instruments

The Texas Instruments DAC8740HRGER is a low-power HART, FOUNDATION Fieldbus, and PROFIBUS PA-compatible modem with a UART interface, offered in a 24-VQFN 4 x 4 mm package. The verified distributor listing identifies the interface and package, while the manufacturer describes the DAC874xH family as a half-duplex physical-layer modem for industrial process-control and automation systems. Its supported industrial protocols make it suitable for connecting sensors, actuators, transmitters, controllers, and field equipment. A fieldbus modem is an interface IC that converts digital UART information into the physical signaling required by an industrial fieldbus, and it can also receive and decode the corresponding bus waveform. In the HART mode described by Texas Instruments, the DAC8740H integrates the circuitry required for half-duplex HART physical-layer operation in slave or master configurations, reducing the amount of external circuitry needed by the transmitter. FOUNDATION Fieldbus and PROFIBUS PA compatibility broadens its relevance in process plants and industrial automation networks. The verified product data establishes the 24-VQFN 4 x 4 mm package and the UART-based architecture, but it does not provide a complete electrical parameter table in the supplied excerpts. Consequently, operating voltage, current consumption, baud rate, analog performance, temperature range, and protection limits are retained as datasheet-needed fields rather than inferred from the product family name. This conservative approach prevents protocol, supply, and signal-integrity assumptions from entering a design prematurely. The DAC8740HRGER is positioned for industrial measurement and control rather than ordinary consumer UART links. Its fieldbus compatibility is relevant when a controller must communicate with a 2-wire industrial process network through a defined physical layer. The UART interface gives the host processor a familiar digital connection, while the integrated modem circuitry reduces the design burden associated with waveform generation, reception, filtering, and bus coupling. Exact baud-rate and loading requirements should be checked against the complete manufacturer documentation before schematic release. Typical application areas include HART-connected pressure and temperature transmitters, FOUNDATION Fieldbus process instruments, PROFIBUS PA field devices, industrial controllers, sensor gateways, actuator interfaces, and factory automation equipment. The compact VQFN package helps reduce board area compared with larger leaded implementations, although exposed-pad layout, thermal performance, grounding, and high-speed signal routing must be handled according to the manufacturer's land pattern and layout guidance. The most important design step is to select the external network components and protection scheme around the exact bus topology, cable length, and operating mode. Fieldbus transceivers are exposed to industrial transients and long cables, so power-supply filtering, surge protection, grounding, connector design, and separation from noisy switching nodes deserve careful review. Verify pin-level multiplexing, supply sequencing, decoupling, and exposed-pad connections against the complete datasheet before layout sign-off. This page combines the verified manufacturer identity, protocol positioning, package information, distributor references, and engineering cautions. It is intended to help engineers locate the correct device, understand its industrial interface role, and identify which datasheet parameters still require confirmation before a production design is released.

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DAC8740HRGET - 2.7V-5.5V HART/Fieldbus Modem | TI
DAC8740HRGET

DAC8740HRGET - 2.7V-5.5V HART/Fieldbus Modem | TI

The Texas Instruments DAC8740HRGET is a low-power HART and FOUNDATION Fieldbus modem integrated circuit with a 2.7 V to 5.5 V supply range, housed in a 24-pin VQFN 4 mm × 4 mm package. It belongs to the DAC874xH family, which supports HART, FOUNDATION Fieldbus, and PROFIBUS PA communications for industrial process-control and factory-automation equipment. The device can operate as either a half-duplex HART master or slave and is designed to minimize the number of external components required by a fieldbus physical layer. A HART modem is the physical-layer interface used to superimpose digital communication signals on 4–20 mA analog instrumentation circuits. A FOUNDATION Fieldbus or PROFIBUS PA interface similarly combines process communication with power delivery over an industrial fieldbus. These interfaces allow sensors, transmitters, controllers, and other field devices to exchange data over the same wiring infrastructure used for measurement and actuation. The DAC8740HRGET provides a compact 2.7 V to 5.5 V operating supply range for integration into modern industrial electronics. Its half-duplex operating arrangement supports both master and slave configurations, while its integrated modem functionality is intended to reduce board area and external circuitry. The VQFN-24 4 mm × 4 mm package also supports compact transmitter and receiver designs where PCB space is constrained. The DAC8740H family was created for industrial process-control and industrial-automation applications requiring interoperable fieldbus connectivity. In HART mode, the integrated circuitry is intended to perform the required half-duplex physical-layer functions with minimal external components. This makes the device applicable to transmitter boards, sensor interfaces, communication controllers, data-acquisition equipment, and connected process-control modules. Typical uses include 4–20 mA HART transmitters, FOUNDATION Fieldbus host and field equipment, PROFIBUS PA measurement devices, industrial sensor gateways, process-monitoring instruments, and factory automation controllers. Designers should verify the exact electrical limits, communication timing, external component requirements, and thermal limits against the manufacturer datasheet before finalizing a production design. A critical design consideration is selecting the correct fieldbus termination, coupling, protection, and decoupling network. The 2.7 V to 5.5 V supply range must remain valid under transient conditions, and exposed industrial connections may require surge and ESD protection beyond the modem's core communications function. Layout should keep sensitive analog and modem nodes away from high-current switching paths. This product page combines verified distributor pricing, package information, family capabilities, source links, and drop-in replacement analysis with practical industrial-interface design guidance. It distinguishes verified alternatives from broader functional equivalents so engineers can assess PCB replacement risk before committing to a redesign.

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DAC8741HRGET - HART Modem with SPI | Texas Instruments
DAC8741HRGET

DAC8741HRGET - HART Modem with SPI | Texas Instruments

The Texas Instruments DAC8741HRGET is a low-power HART, FOUNDATION Fieldbus, and PROFIBUS PA-compatible modem with an SPI interface, 24-pin VQFN (RGE) package, and a specified temperature range of -55°C to +125°C. It is designed for industrial process-control and industrial-automation equipment requiring a dedicated digital communication interface for fieldbus networks. A HART modem is a physical-layer interface that adds digital communication over an analog instrumentation signal path. As a modem IC, the DAC8741H belongs to the interface-IC hierarchy, connecting embedded controllers with HART-compatible transmitters, sensors, actuators, and fieldbus equipment. The TI product page describes the device as a HART, FOUNDATION Fieldbus, and PROFIBUS PA-compliant modem suitable for both slave and master configurations in HART mode. The principal feature of the DAC8741HRGET is its SPI host interface. The verified product information states that the interface includes a DO pin for daisy-chain support, together with interrupts and other control features. This allows a host microcontroller or processor to configure the modem and exchange status and command information through a serial interface while the integrated physical-layer circuitry handles the fieldbus signal. The device is offered in a compact 24-VQFN package measuring 4 mm by 4 mm. Its industrial operating-temperature designation covers -55°C to +125°C, making the qualified ordering variant suitable for harsh industrial environments when the complete system requirements, qualification records, and application conditions are independently reviewed. The ordering suffix identifies the RGE package, and HRGET is supplied in tape-and-reel form. Typical uses include process transmitters, fieldbus sensor transmitters, industrial controllers, data acquisition equipment, remote I/O systems, and PROFIBUS PA-compatible field devices. In these systems, the DAC8741HRGET can reduce the need for discrete modem circuitry while providing a standardized host-side connection through SPI. Designers should confirm the exact receiver and transmitter implementation, timing limits, electrical levels, and external-component requirements against the manufacturer datasheet before release. The SPI signals, analog fieldbus connection, supply rails, grounding, and exposed-pad layout must be routed according to the recommended application circuit. Component availability and lifecycle commitments should also be checked for the intended production program. This page consolidates verified manufacturer and distributor information with transparent data-gap markers, package guidance, comparison rows, and application-focused engineering context. It also distinguishes verified facts from specifications that require confirmation in the latest Texas Instruments datasheet.

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DAC8742HPBS - HART Modem Interface | Texas Instruments
DAC8742HPBS

DAC8742HPBS - HART Modem Interface | Texas Instruments

The Texas Instruments DAC8742HPBS is a HART modem interface integrated circuit with UART and SPI support, designed for HART, FOUNDATION Fieldbus, and PROFIBUS PA industrial communication systems. It is packaged in a 32-TQFP (5x5) package and serves as the signal-conditioning interface between a host controller and fieldbus wiring. The verified source data identifies the device specifically as a HART modem interface, while detailed electrical limits, temperature ratings, and internal interface timing remain unavailable in the supplied records. A HART modem interface is a signal-conditioning IC within the broader industrial communication and data-conversion hierarchy. It encodes and decodes Frequency Shift Keying signals used by HART-compatible fieldbus equipment. This allows an embedded controller to communicate over legacy 4-20 mA instrumentation loops without implementing the analog modulation and filtering as discrete circuitry. In a FOUNDATION Fieldbus or PROFIBUS PA installation, the modem interface supports the physical signaling layer while higher-level protocols and safety mechanisms remain the responsibility of the host system. The DAC8742HPBS is valued for integrating dedicated modem functionality into a compact 32-TQFP device. Its UART and SPI host interfaces provide selectable connectivity to embedded processors, allowing command and data transfer between the modem and application firmware. The 5x5 mm package also supports space-constrained industrial instrumentation, although exposed-pad layout and thermal verification must follow the manufacturer package drawing. Because the supplied data does not expose individual pin assignments, supply limits, isolation ratings, or accuracy figures, those details must be checked in the official DAC8742H documentation before schematic approval. Typical uses include HART-compatible sensor transmitters, pressure and flow instrument interfaces, industrial process-control modules, and FOUNDATION Fieldbus or PROFIBUS PA equipment. In these systems, the DAC8742HPBS reduces the discrete component count associated with analog modem circuitry and gives the host MCU a structured digital control path. The principal engineering trade-off is that the modem interface is only one part of the communication chain: the transmitter still requires suitable loop power, filtering, surge protection, grounding, and validated fieldbus wiring. For new designs, verify the exact device variant, supply rails, UART and SPI logic levels, receive bandwidth, transmit modulation limits, loop-current interface, and exposed-pad requirements in the official Texas Instruments datasheet. Do not derive those values from the distributor snippets. The manufacturer product page describes the DAC8742H as HART, FOUNDATION Fieldbus, and PROFIBUS PA compliant with UART/SPI support, making it the authoritative starting point for design review. This page combines verified distributor availability, manufacturer positioning, package information, replacement analysis, and practical integration guidance. It also separates confirmed facts from parameters that require datasheet verification, helping engineers avoid treating incomplete distributor metadata as a complete electrical specification.

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DG187AA - SPST Analog Switch, JFET, TO-100-10 | Vishay
DG187AA

DG187AA - SPST Analog Switch, JFET, TO-100-10 | Vishay

The Vishay Siliconix DG187AA is a single-channel SPST (single-pole single-throw) analog switch built around an N-channel JFET switching element with an integrated level-shifting driver. Housed in a 10-pin TO-100 metal can package (round, through-hole, 10 leads), it provides approximately 30 Ohm on-resistance and is part of the DG181 through DG191 analog-gate family originally introduced by Intersil and now manufactured by Vishay Siliconix. According to the verified distributor listings, it is categorized as an SPST analog switch IC. An analog switch (also called a JFET analog gate or solid-state analog switch) is an electronic component that uses a semiconductor device (typically a JFET or MOSFET) to connect or disconnect an analog signal path under the control of a digital logic input. Analog switches sit within the broader taxonomy of signal switches -> multiplexers/switches -> interface ICs -> integrated circuits, and they are essential whenever an analog signal must be routed without injecting distortion, charge injection, or significant series resistance. The DG187AA's JFET architecture keeps the on-resistance relatively constant over a wide analog signal range, which is a key advantage over simple MOSFET-only designs in precision instrumentation. Key differentiating features of the DG187AA include: (1) a high-speed level-shifting driver that accepts low-level CMOS/TTL-compatible inputs (down to approximately 0.8V to 2V) and uses them to control the JFET switch state, (2) analog signal range operation that suits both unipolar and bipolar audio/precision signals, (3) low charge injection thanks to the JFET topology, and (4) a hermetic TO-100 metal can that supports military temperature grades (-55C to +125C). The metal-can packaging also provides excellent EMI shielding for sensitive analog signal routing in instrumentation front-ends. In terms of electrical architecture, the DG187AA integrates the JFET switch die and the level-shifting driver die within a single TO-100 can, allowing the part to be driven directly from logic-level inputs without external pull-ups or level translators. This single-package integration reduces board area and simplifies PCB layout compared with discrete JFET-plus-driver implementations. The switching speed, while not as fast as modern CMOS analog switches, is sufficient for audio, instrumentation multiplexing, sample-and-hold front-ends, and legacy industrial signal routing. Typical applications for the DG187AA include: (1) precision instrumentation multiplexers, (2) audio signal routing in professional and broadcast equipment, (3) sample-and-hold amplifier front-ends, (4) data-acquisition system signal gating, (5) legacy industrial process-control signal switching, and (6) military and aerospace signal routing where the TO-100 hermetic can is required. The MIL-spec /883 variant (DG187AA/883) confirms the part's qualification for harsh-environment designs. When designing with the DG187AA, note that the TO-100 package has 10 leads arranged in a circular metal can, with pin 1 typically marked by a tab or dot near the package base. Because the package is a through-hole metal can (not surface-mount), PCB layout requires plated through-holes on a 0.230 inch lead circle typical of TO-100 cans. Always consult the manufacturer datasheet for the exact pinout, especially when migrating from the /883 to the commercial-temperature variant. This page synthesizes distributor pricing, hermetic package availability, MIL-spec drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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DG211CJ+ - 4-Channel SPST Analog Switch | Maxim Integrated
DG211CJ+

DG211CJ+ - 4-Channel SPST Analog Switch | Maxim Integrated

The Maxim Integrated DG211CJ+ is a quad SPST CMOS analog switch with four independently controlled channels, 175 ohm maximum on-resistance, and a 16-pin PDIP package. It supports dual-supply operation from ±4.5 V to ±18 V and is designed for general-purpose routing of analog signals in communications, instrumentation, process-control, and computer-peripheral equipment. An analog switch is a semiconductor device that routes signals between circuit nodes under digital control. The DG211CJ+ belongs to the hierarchy of analog switches, multiplexers, interface ICs, and semiconductor components. Its four single-pole single-throw channels provide normally closed paths, making it useful when a system must maintain a connection until an active control signal changes the selected route. The device provides a maximum on-resistance of 175 ohm and a 1:1 signal configuration across four circuits. The manufacturer identifies the DG211 family as CMOS analog switches with low cost and general-purpose switching functions. Operation across positive and negative supplies supports bipolar analog signals in instrumentation and signal-routing systems, while the individual digital controls allow each channel to be operated independently. The DG211 and DG212 devices are described by the manufacturer as normally closed, quad SPST CMOS analog switches that can operate with supplies from ±4.5 V to ±18 V. Maxim also states that the DG211 family will not latch up if the power supplies are disconnected while input signals remain connected, and the devices feature guaranteed break-before-make switching. These characteristics help control transient current and undefined states during control transitions. Typical uses include analog measurement front ends, process-control interfaces, communications equipment, test equipment, and peripheral signal routing. In a measurement system, separate DG211CJ+ channels can connect sensors or reference signals to a shared analog front end while keeping unused paths connected. The device can also support signal isolation and source selection when system behavior requires a default connection that remains active until commanded otherwise. When designing a circuit around the DG211CJ+, verify input and output signal amplitudes against the supply rails, observe the control-logic thresholds, and maintain the specified continuous and peak terminal currents. Decoupling capacitors should be placed close to the supply pins, and control traces should be kept away from sensitive analog routes. The PDIP package also requires adequate insertion clearance and appropriate socket or soldering practices during assembly. This product page combines the manufacturer family information, distributor listings, cross-reference findings, package details, and practical application guidance. It highlights verified distinctions among available DG211 ordering codes and focuses drop-in comparison on the same 16-pin PDIP footprint rather than presenting surface-mount or electrically different devices as direct replacements.

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DG211CY+ - Quad SPST CMOS Analog Switch | Analog Devices
DG211CY+

DG211CY+ - Quad SPST CMOS Analog Switch | Analog Devices

The Analog Devices DG211CY+ is a monolithic quad SPST CMOS analog switch in a 16-pin SOIC package. It provides four independent single-pole single-throw channels with a maximum on-resistance of 175 ohm, operates from dual positive and negative supplies of ±4.5 V to ±18 V, and supports true bidirectional signal conduction in the ON state. A CMOS analog switch is an integrated semiconductor device that routes analog signals between circuit nodes under digital control. The DG211 family belongs to the analog-switch and multiplexer hierarchy, which supports general-purpose signal routing in communications, instrumentation, process control, and computer peripheral equipment. The DG211 switches are normally closed, so each channel connects its input to its output whenever its control input is inactive. Key features include four SPST channels, a 175 ohm maximum on-resistance, operation across ±4.5 V to ±18 V dual-supply ranges, and a 500 ns maximum off-time. According to the Analog Devices DG211 data sheet, the DG211 will not latch up when the power supplies are disconnected while input signals remain connected. Break-before-make operation is also guaranteed, which helps prevent two signal sources from being momentarily shorted together. The devices can block signals up to 30 V peak-to-peak in the OFF condition, making them useful for protecting downstream circuitry from higher-voltage external signals. True bidirectional ON-state behavior allows the same switch to route either signal direction, while the normally closed configuration provides a defined signal path during power-up and control-failure conditions. Typical applications include multimeter and test-equipment input selection, process-control signal routing, communications equipment, and peripheral interface boards. Designers should verify the control-logic thresholds, switching timing, leakage, charge injection, and absolute maximum ratings against their signal amplitude and impedance before applying the switch. This page consolidates verified manufacturer and distributor information, package and supply details, application guidance, and qualified drop-in information for DG211CY+ designs.

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DG211DJ+ - Quad SPST CMOS Analog Switch | Analog Devices
DG211DJ+

DG211DJ+ - Quad SPST CMOS Analog Switch | Analog Devices

Analog Devices DG211DJ+ is a four-circuit, normally closed, single-pole single-throw CMOS analog switch with an on-resistance of 175 ohm in a 16-pin PDIP package. The manufacturer identifies the DG211 family as a production device and specifies operation from ±4.5 V to ±18 V supplies. Its four integrated switches provide break-before-make operation and are designed to avoid latch-up when supply rails are disconnected while signals remain connected. An analog switch is an electronically controlled semiconductor device that routes signals between circuit nodes without continuously conducting them. The DG211 belongs to the analog-switch and multiplexer hierarchy, where CMOS implementations combine low signal distortion with TTL-compatible control inputs. Each DG211 switch is normally closed, meaning its default connection remains active until the corresponding control input changes state. This behavior is useful for signal routing, test-point isolation, fallback paths, and analog measurement systems. The DG211’s four SPST channels provide independent control of four signal paths. Its 175-ohm on-resistance is the principal signal-path parameter identified for the device, while the ±4.5 V to ±18 V supply range allows operation with positive and negative analog rails. The manufacturer also specifies break-before-make behavior, helping prevent two switched paths from momentarily connecting together during control transitions. The DG211DJ+ ordering code places this quad switch in a 16-pin PDIP package. CMOS construction gives the DG211 low static power characteristics relative to many mechanical or bipolar relay alternatives. Because the device uses MOSFET-based switching elements, its on-state behavior changes with signal amplitude and supply configuration. Designers should therefore evaluate resistance, off leakage, charge injection, capacitance, and logic thresholds against the particular source and load impedance. The fast transition and low on-resistance make the device practical for precision test systems, data-acquisition front ends, instrumentation, and controlled analog paths. Typical uses include switching sensor outputs into measurement amplifiers, isolating channels in automated test equipment, selecting signal sources in laboratory instruments, and preserving analog connections during power-up or fault conditions. The normally closed topology is especially valuable when a default connection must remain intact if control logic is unpowered or temporarily unavailable. The 16-pin PDIP package is appropriate for through-hole assembly, prototypes, educational systems, and designs where a socketed DIP implementation simplifies maintenance. Designers should preserve the recommended supply and signal limits, place bypass capacitance close to the supply pins, and use pull resistors where control inputs may float during reset. The break-before-make and latch-up characteristics improve transition reliability, but external logic still must not exceed the input ratings. Because analog-switch performance depends on source impedance, load impedance, frequency, and supply voltage, prototype measurements should verify bandwidth and distortion before high-volume deployment. This product record combines the manufacturer’s production status, switch topology, resistance, supply range, package information, ordering data, and drop-in comparison guidance with practical PCB, signal-integrity, and selection considerations. It is intended to help engineers identify whether the DG211DJ+ matches the required electrical behavior, normally closed routing, through-hole footprint, and control architecture before placing the part into a production design.

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DG212CJ+ - Quad SPST CMOS Analog Switch | Intersil
DG212CJ+

DG212CJ+ - Quad SPST CMOS Analog Switch | Intersil

The Intersil Corporation DG212CJ+ is a low-cost CMOS monolithic quad SPST analog switch with four normally open, 1:1 switching channels, 175 ohm on resistance, inverted control inputs, and a 16-pin PDIP package. According to the manufacturer datasheet, it supports dual supply operation from ±4.5 V to ±18 V and is designed for communications, instrumentation, process-control, sample-and-hold, disk-drive, test-equipment, and computer-peripheral applications. An analog switch is an integrated interface device that routes analog signals between external circuit nodes under digital control. The DG212CJ+ belongs to the CMOS analog-switch hierarchy, where each SPST channel provides one signal path with a normally open configuration. Its inverted control inputs allow the device to be selected by active-high or active-low system logic, while four independent switches can share common supply rails within one package. Key features include a 175 ohm maximum on resistance, a maximum turn-on time of 1000 ns, and a maximum turn-off time of 500 ns. The device is specified for a wide dual-supply range of ±4.5 V to ±18 V. According to the Analog Devices DG212 product page, the DG202 and DG212 family is guaranteed not to latch up when the power supplies are disconnected while input signals remain connected, improving recovery behavior in systems where rails can be removed before external circuitry. The DG212 family differs from the DG201 and DG211 families through its inverted control inputs. Within the DG202 family, the DG212 provides four normally open SPST channels, making it appropriate for signal isolation, test-point routing, programmable front ends, and general-purpose switching rather than fixed on-state multiplexing. Its CMOS implementation and simple logic interface suit compact analog and digital control systems where channel isolation and predictable switching timing are important. Typical uses include communication-system signal routing, process-control interfaces, disk-drive electronics, test equipment, sample-and-hold circuits, and computer peripherals. Engineers should pay attention to the inverted logic polarity and confirm that a low control level closes each normally open channel. Because this is a 16-pin PDIP device rather than a surface-mount package, it is most appropriate for through-hole legacy, industrial, instrument, and prototype designs where DIP availability is more valuable than compact placement. For reliable operation, use the pin-description table and recommended operating conditions in the manufacturer datasheet when assigning control and analog pins. Confirm signal levels against the applicable supply configuration and avoid exceeding ±18 V. This page combines manufacturer specifications, sourcing context, pin-usage guidance, and verified drop-in replacement information to support practical selection and board-level implementation.

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