10AS032H3F34E2SG vs 10AS032H2F34E2LG Comparison

Detailed side-by-side comparison of 10AS032H3F34E2SG by Intel and 10AS032H2F34E2LG by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10AS032H3F34E2SG 10AS032H2F34E2LG
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $2,120.00 $1,380.00
Family Arria 10 SX SoC FPGA Arria 10 SX
Logic Elements 320,000 320,000
Processor Cores Dual ARM Cortex-A9 MPCore with CoreSight —
Maximum Core Frequency 1.5 GHz —
Package 1152-ball FBGA, FC (35x35 mm) 1152-ball FC-FBGA (F34), 35 x 35 mm
Mounting Type Surface Mount Surface Mount (BGA)
Operating Temperature -40C to +100C (industrial) —
Speed Grade H3 2
RoHS Status Compliant Compliant
Lead Free Yes —
Process Node 20 nm 20 nm
Transceivers Integrated multi-gigabit transceivers Up to 14.1 Gbps [DATA_NEEDED: exact count for F34 package]
DSP Blocks Hardened floating-point DSP blocks Variable-precision, IEEE 754 single-precision FP support
Memory Interfaces DDR3 / DDR4 with hard controllers —
Configuration AES-encrypted bitstream support SoC FPGA (HPS + FPGA fabric)
Device Tier — 10AS032 (mid-density)
Processor Subsystem — Dual ARM Cortex-A9 MPCore with CoreSight
Maximum Operating Frequency — 1.5 GHz
Temperature Grade — E2 (commercial/extended)
On-chip Memory (M20K blocks) — Approx. 21 Mb [DATA_NEEDED: exact Mb from datasheet]
Memory Controller Hard IP — DDR4, DDR3, QDRII+, RLDRAM3
Form of Terminal — Ball (BGA)
Terminal Pitch — 1 mm

Datasheets & Resources

Browse All Products Create BOM Request Quote