10AS032H2F34E2LG - Arria 10 SX 320 SoC FPGA, 320K LE | Intel
MPN: 10AS032H2F34E2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2070.09 | $2,070.09 |
| 10 | $1850 | $18,500.00 |
| 100 | $1650 | $165,000.00 |
| 250 | $1500 | $375,000.00 |
| 500 | $1380 | $690,000.00 |
Drop-in alternatives for 10AS032H2F34E2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS032H1F34E1HG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1755 / Unit
View Datasheet →10AS032H2F34E1HG
✅ Drop-In✓ In Stock
$1227.9 / Unit
View Datasheet →10AS032H2F34E3LG
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10AS032H1F35E1HG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2540 / Unit
View Datasheet →10AS032E4F34I3SG
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10AS032H2F34E2LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX |
| Device Tier | 10AS032 (mid-density) |
| Configuration | SoC FPGA (HPS + FPGA fabric) |
| Logic Elements | 320,000 |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Operating Frequency | 1.5 GHz |
| Package | 1152-ball FC-FBGA (F34), 35 x 35 mm |
| Speed Grade | 2 |
| Temperature Grade | E2 (commercial/extended) |
| DSP Blocks | Variable-precision, IEEE 754 single-precision FP support |
| Memory Controller Hard IP | DDR4, DDR3, QDRII+, RLDRAM3 |
| Process Node | 20 nm |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Form of Terminal | Ball (BGA) |
| Terminal Pitch | 1 mm |
10AS032H2F34E2LG 1152-ball fc-fbga (f34), 35 x 35 mm Pin Configuration Guide
Complete pinout information for 10AS032H2F34E2LG (1152-ball fc-fbga (f34), 35 x 35 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS032H2F34E2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS032H2F34E2LG is suitable for 6 applications: Wireless Baseband Processing (4G/LTE Small Cell), Radar Signal Processing, Video Broadcast and Studio Equipment, Medical Imaging (Ultrasound / MRI Receiver), Industrial Machine Vision, 5G fronthaul and CPRI/eCPRI Aggregation.
Wireless Baseband Processing (4G/LTE Small Cell)
The 10AS032H2F34E2LG fits mid-density 4G/LTE small-cell baseband processing because its 320K logic elements, 14.1 Gbps transceivers, and integrated dual-core ARM Cortex-A9 HPS handle CPRI front-haul, PHY layer DSP, and L2/L3 stack on one device. The HPS runs the protocol stack and OAM while the FPGA fabric accelerates FFT, channel coding, and crest-factor reduction with deterministic throughput. Designers place CPRI via transceivers to the radio unit, dedicating fabric DSP blocks to the baseband pipeline, and use the hard DDR4 controller for shared L2/L3 buffers. The Arria 10 architecture's variable-precision DSP and 20 nm process deliver a favorable performance-per-watt ratio for outdoor small-cell deployments where thermal headroom is limited. Compared with discrete FPGA-plus-CPU designs, the SoC integration eliminates a chip, reduces board area, and simplifies timing closure between the stack and accelerator.
Recommended
Radar Signal Processing
The 10AS032H2F34E2LG supports phased-array radar signal processing where mid-density logic, fast transceivers, and a Linux-capable HPS accelerate the full chain: ADC deserialization, pulse compression, Doppler processing, and CFAR detection. Transceivers up to 14.1 Gbps interface directly to JESD204B/C ADCs at multi-GSPS rates, while the FPGA fabric runs FFT-based range-Doppler maps. The ARM Cortex-A9 HPS handles track formation, classification, and network uplink with deterministic latency. Designers typically allocate 60-70% of logic for the DSP pipeline and dedicate the HPS to control-plane tasks. The 20 nm process and on-chip M20K memory blocks keep per-channel power low, which is critical for airborne or vehicle-mounted radar where every watt raises thermal load. Compared to a pure FPGA design, the integrated HPS removes a separate SoM, reducing SWaP-C for size, weight, power, and cost.
Recommended
Video Broadcast and Studio Equipment
The 10AS032H2F34E2LG targets broadcast video processing - SDI routing, up/down/cross conversion, HDR mapping, and IP-based SMPTE ST 2110 transport - where mid logic density, multi-rate transceivers, and an integrated HPS for network and control processing fit cleanly. The FPGA fabric handles 12G-SDI physical interfaces, frame-buffer memory, and lookup-table color transforms, while the HPS runs the control plane for NMOS IS-04/IS-05, PTP timing, and web UI. Hard DDR4 controllers feed large frame buffers needed for 4K/UHD upconversion, and the 14.1 Gbps transceivers drive 25G Ethernet for ST 2110-20 essence streams. The SoC integration reduces rack-unit count in studio equipment and shortens design cycles by consolidating processing onto one chip. Compared to a pure-FPGA design, the HPS lets broadcast engineers run Linux control software without a separate SBC.
Recommended
Medical Imaging (Ultrasound / MRI Receiver)
The 10AS032H2F34E2LG supports mid-channel-count medical imaging where parallelism, deterministic latency, and regulatory compliance are essential. Transceivers capture raw data from JESD204B ADCs at high lane rates, while the FPGA fabric runs beamforming for ultrasound or FFT-based reconstruction pipelines for MRI receivers. The dual ARM Cortex-A9 HPS executes patient-interface software, network protocols, and DICOM upload, all on the same device. The 20 nm process and integrated DSP blocks achieve the throughput required for real-time imaging, while the SoC architecture simplifies IEC 62304 and FDA cybersecurity documentation by consolidating the processing chain. Designers typically dedicate most logic to the imaging pipeline and use the HPS for UI, storage, and network. Compared to discrete solutions, this part reduces PCB footprint, enabling more compact cart-based or handheld imaging systems.
Recommended
Industrial Machine Vision
The 10AS032H2F34E2LG fits industrial machine vision lines where multiple cameras stream at high frame rates and the system must run both image processing and a Linux-based HMI/network stack. The FPGA fabric handles Bayer demosaic, lens correction, blob detection, and AI inference preprocessing, while the HPS runs the HMI, OPC-UA, and PLC protocols. Hard DDR4 controllers buffer multi-stream video, and the 14.1 Gbps transceivers drive CoaXPress or 10 GigE Vision cameras. The SoC architecture consolidates two-chip designs onto one device, cutting PCB area, BOM, and supply-chain risk for factory-floor deployments. Designers typically allocate 50-70% of logic to image processing and use the HPS for industrial protocol stacks. Compared to GPU-based vision systems, the Arria 10 SX delivers deterministic latency and lower power per channel for high-speed inspection.
Recommended
5G fronthaul and CPRI/eCPRI Aggregation
The 10AS032H2F34E2LG suits 5G fronthaul aggregation where multiple remote-radio units converge through CPRI or eCPRI onto an aggregation switch. The 14.1 Gbps transceivers handle multiple CPRI Option 7-3 or eCPRI streams, the FPGA fabric performs packet aggregation, timing synchronization, and IQ data routing, while the HPS runs management-plane protocols including PTP, SyncE, and O-RAN M-plane. The 320K logic elements are sufficient for 8-12 aggregated radio streams, and the SoC integration collapses two-chip fronthaul designs onto one device. Compared to ASIC solutions, the Arria 10 SX accelerates time-to-market for new fronthaul splits and protocol revisions. Designers benefit from the deterministic latency of the FPGA pipeline and the Linux flexibility of the HPS for OAM and orchestration.
Recommended
Recommended Products Summary
Engineering reference data for 10AS032H2F34E2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS032H2F34E1HG | 10AS032H1F34E1HG | 10AS032H2F34E3LG | 10AS032E4F34I3SG |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-ball FC-FBGA (F34), 35x35 mm | 1152-ball FC-FBGA (F34), 35x35 mm - same | 1152-ball FC-FBGA (F34), 35x35 mm - same | 1152-ball FC-FBGA (F34), 35x35 mm - same | 1152-ball FC-FBGA (F34), 35x35 mm - same |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 |
| SoC Variant | H2 (dual-core ARM Cortex-A9) | H2 (dual-core ARM Cortex-A9) | H1 (single-core) | H2 (dual-core ARM Cortex-A9) | E4 (no HPS, fabric-only) |
| Speed Grade | 2 | 1 | 1 | 3 | 3 |
| Temperature Grade | E2 (commercial/extended) | E1 (industrial) | E1 (industrial) | E2 (commercial/extended) | I3 (industrial) |
| Transceivers | Up to 14.1 Gbps [DATA_NEEDED: count] | Up to 14.1 Gbps - same | Up to 14.1 Gbps - same | Up to 14.1 Gbps - same | Up to 14.1 Gbps - same |
| Approx. Unit Price (USD, qty 1) | ~$2,070 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Lifecycle Status | Active | Active | Active | Active | Active |
Key Differentiators
- Mid-density Arria 10 SX SoC FPGA with H2 dual-core HPS (vs 10AS066H2F34E2LG (higher-density sibling))
- H2 SoC variant (dual-core ARM Cortex-A9) over H1 single-core (vs 10AS032H1F34E1HG)
- Speed grade 2 timing performance over grade 3 (vs 10AS032H2F34E3LG)
Design Notes
The 1152-ball FC-FBGA package at 1 mm pitch requires an HDI PCB stack-up with laser-drilled microvias. Use a minimum 12-layer stack with dedicated ground and power planes adjacent to the BGA fanout layer. Decoupling must include bulk caps on each voltage rail plus high-frequency 0402 ceramic caps placed within 2 mm of the balls. Length-matching is critical for DDR4 interfaces (target ±25 ps within byte lanes).
At full transceiver utilization (multiple 14.1 Gbps lanes) and high DSP block utilization, the Arria 10 SX can dissipate 15-20 W. A heatsink with thermal interface material or forced-air cooling is typically required. Estimate: with a 31 C/W junction-to-ambient thermal resistance on the 35x35 mm FC-FBGA, a 15 W load produces approximately 465 C junction temperature rise above ambient - so thermal management is non-optional. Always derive thermal design from the Quartus PowerPlay report for your actual design.
Place the HPS boot source (QSPI flash, SD card, or NAND) within 50 mm of the HPS boot pins to meet boot timing. Separate HPS and FPGA fabric power rails even though they share the same silicon - this allows independent power sequencing required by the boot ROM. Route the HPS-to-FPGA bridges (AXI) with length matching and keep the bridges on inner layers to avoid coupling with high-speed transceivers.
Do not assume the 10AS032H2 (H2 dual-core HPS) and 10AS032E4 (E4 fabric-only) are interchangeable - they share the same F34 ball map but E4 disables the HPS block, requiring full pin reassignment. Verify against the device pin-out file and the Arria 10 migration guide before swapping. Also confirm speed grade timing: speed grade 2 (this part) and speed grade 3 differ in achievable fMAX, so a grade-2 design may not meet timing on grade 3 silicon.
Compliance Information
RoHS compliant per Intel/Altera product page. Not AEC-Q100 qualified - this is a commercial/industrial-grade FPGA. REACH and conflict-minerals compliance available from Intel's product compliance portal.
