10AS032H3F34E2SG - Arria 10 SX 320K LE SoC FPGA 1152-FBGA | Intel
MPN: 10AS032H3F34E2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2680 | $26,800.00 |
| 100 | $2475 | $247,500.00 |
| 500 | $2290 | $1,145,000.00 |
| 1,000 | $2120 | $2,120,000.00 |
Drop-in alternatives for 10AS032H3F34E2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS032H3F34E2LG
✅ Drop-In✓ In Stock
$1650 / Unit
View Datasheet →10AS032H3F34I2SG
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View Datasheet →10AS032H2F34E2SG
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View Datasheet →10AS032H2F34E2LG
✅ Drop-In✓ In Stock
$1380 / Unit
View Datasheet →10AS032H1F34E1HG
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View Datasheet →10AS032H3F34E2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 320,000 |
| Processor Cores | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Core Frequency | 1.5 GHz |
| Package | 1152-ball FBGA, FC (35x35 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (industrial) |
| Speed Grade | H3 |
| RoHS Status | Compliant |
| Lead Free | Yes |
| Process Node | 20 nm |
| Transceivers | Integrated multi-gigabit transceivers |
| DSP Blocks | Hardened floating-point DSP blocks |
| Memory Interfaces | DDR3 / DDR4 with hard controllers |
| Configuration | AES-encrypted bitstream support |
10AS032H3F34E2SG 1152-ball fbga, fc (35x35 mm) Pin Configuration Guide
Complete pinout information for 10AS032H3F34E2SG (1152-ball fbga, fc (35x35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS032H3F34E2SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS032H3F34E2SG is suitable for 6 applications: Wireless Baseband Processing, Software-Defined Radio (SDR), Industrial Machine Vision, Medical Imaging Accelerator, Protocol Bridging and Industrial Networking, Embedded Compute and Edge Acceleration.
Wireless Baseband Processing
The 10AS032H3F34E2SG's 320K logic elements and dual ARM Cortex-A9 cores at 1.5 GHz deliver the throughput needed for mid-range wireless baseband DSP and protocol stack processing. Its hardened floating-point DSP blocks accelerate FFT, channel estimation, and turbo-decoding kernels, while the HPS handles MAC-layer scheduling and upper-stack software. With transceiver rates up to 17.4 Gbps, it interfaces directly to RF front-ends and CPRI/OBSAI links. The 1152-ball F34 package provides the I/O budget required for multiple antenna streams and parallel ADC/DAC interfaces, making it a strong fit for small-cell LTE and 5G NR baseband units.
Recommended
Software-Defined Radio (SDR)
Software-defined radio platforms benefit from the 10AS032H3F34E2SG's combination of reprogrammable FPGA fabric and the dual ARM Cortex-A9 hard processor system running up to 1.5 GHz. The FPGA implements wideband DDC/DUC, channelizers, and waveform-specific modulators, while the HPS runs the radio control plane, network stack, and waveform selection logic. Integrated transceivers up to 17.4 Gbps connect directly to wideband ADC/DAC pairs. The SoC architecture eliminates a companion processor, reducing board area and BOM cost for portable SDR applications in defense and commercial wireless test equipment.
Recommended
Industrial Machine Vision
The 10AS032H3F34E2SG is well-suited for high-speed machine vision inspection systems where multi-camera sensor fusion and real-time image processing must run concurrently. Its 320K logic elements and hardened floating-point DSP accelerate Bayer demosaicing, convolution kernels, and feature extraction at line rates exceeding 10 Gbps. The dual ARM Cortex-A9 cores run the vision application stack, PLC interface, and network protocols. The HPS DDR controller supports simultaneous buffering from multiple high-resolution sensors without taxing FPGA fabric memory bandwidth, while the F34 BGA package provides the GPIO and SERDES lanes needed for Camera Link, CoaXPress, or GigE Vision aggregation.
Recommended
Medical Imaging Accelerator
The 10AS032H3F34E2SG's hard floating-point DSP and high logic density make it an effective accelerator for medical imaging modalities including ultrasound beamforming, CT reconstruction, and MRI FFT pipelines. The ARM Cortex-A9 subsystem manages the user interface, DICOM networking, and image post-processing while the FPGA fabric performs the parallel beamforming or back-projection math. The hardened memory controllers drive DDR3 or DDR4 buffer memory directly from the FPGA, eliminating external bridge chips. With proper medical-grade design practices, the 10AS032H3F34E2SG serves as the compute core for portable and mid-tier imaging systems.
Recommended
Protocol Bridging and Industrial Networking
Industrial gateways benefit from the 10AS032H3F34E2SG's combination of FPGA-accelerated protocol conversion and the ARM Cortex-A9 HPS running a Linux or RTOS control plane. The FPGA fabric implements deterministic EtherCAT, PROFINET, or TSN endpoints with sub-microsecond jitter, while the HPS hosts the application logic, OPC-UA server, and cloud connectivity. Integrated multi-gigabit transceivers enable 10G uplinks without external PHY chips. The wide operating temperature range and robust BGA package suit industrial cabinet mounting where mechanical and thermal stress is significant.
Recommended
Embedded Compute and Edge Acceleration
For edge-compute nodes requiring hardware acceleration of AI inference, video transcoding, or sensor-fusion pipelines, the 10AS032H3F34E2SG delivers 320K logic elements plus dual ARM Cortex-A9 cores to handle control-plane and data-plane workloads simultaneously. The FPGA fabric accelerates CNN layers, FFT pipelines, and custom DSP kernels while the HPS runs the application framework, file system, and network stack. The integrated transceivers connect to high-speed sensors and backhaul links, and the DDR4 controller supports large working-set memories for batch processing. The SoC integration reduces board complexity and power compared to discrete CPU + FPGA designs.
Recommended
Recommended Products Summary
Engineering reference data for 10AS032H3F34E2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS032H3F34E2LG | 10AS032H3F34I2SG | 10AS032H2F34E2SG | 10AS032H2F34E2LG | 10AS032H1F34E1HG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FBGA, FC (35x35 mm) | 1152-ball FBGA, FC (35x35 mm) - same | 1152-ball FBGA, FC (35x35 mm) - same | 1152-ball FBGA, FC (35x35 mm) - same | 1152-ball FBGA, FC (35x35 mm) - same | 1152-ball FBGA, FC (35x35 mm) - same |
| Speed Grade | H3 | H3 | H3 | H2 | H2 | H1 |
| Temperature Grade | E2 (industrial) | E2 (industrial) | I2 (industrial) | E2 (industrial) | E2 (industrial) | E1 (industrial) |
| Ball Finish | SG (SnPb) | LG (lead-free) | SG (SnPb) | SG (SnPb) | LG (lead-free) | HG (lead-free) |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 |
| HPS Cores | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Max Core Frequency | 1.5 GHz | 1.5 GHz | 1.5 GHz | ~1.4 GHz (H2 bin) | ~1.4 GHz (H2 bin) | ~1.3 GHz (H1 bin) |
Key Differentiators
- Speed grade H3 bin delivers the highest Fmax in the Arria 10 SX F34 family (vs 10AS032H2F34E2SG)
- Dual ARM Cortex-A9 HPS integrated with 320K LE FPGA fabric in a single SoC (vs 10AS032H3F34E2LG)
- 1152-ball FCBGA package supports 17.4 Gbps transceivers and DDR3/DDR4 interfaces (vs Cyclone 10 GX)
Design Notes
Estimated: At typical 40-60% logic utilization plus active HPS and 8 transceivers, the 10AS032H3F34E2SG draws approximately 15-22 W. Plan a multi-rail supply: 0.85V core, 1.1V HPS, 1.5V DDR, 2.5V aux, plus the 1.8V/3.3V I/O bank voltages. Use the Quartus Prime PowerPlay early estimator before committing to PCB stackup. Place bulk ceramic capacitors within 5 mm of each BGA power pin pair to suppress transient droop.
The 1152-ball FCBGA package has a typical junction-to-ambient theta-JA of approximately 8-12 C/W with proper PCB thermal design, but this requires a 12-layer or thicker PCB with a continuous ground plane and thermal vias under the die. Without these, junction temperature can exceed 100C and trigger thermal throttling. For sustained high utilization, attach a heat sink with thermal interface material rated for the package's 35x35 mm footprint. Junction temperature must stay below 100C for industrial-grade operation.
The 1.0 mm pitch 1152-ball BGA requires HDI PCB fabrication with microvias and a 12-layer or thicker stackup for signal-integrity compliance. Match-length all DDR3/DDR4 traces within the channel skew tolerance (typically 25 ps for DDR4), and use 100-ohm differential routing for SERDES lanes. The HPS boot configuration requires a dedicated QSPI or SD card interface routed on inner signal layers with proper decoupling on the boot power rail.
Do not confuse speed grades: H3 is fastest, H2 is mid-bin, H1 is slowest; substituting a lower grade after PCB fab typically fails timing closure. Always validate the chosen part's pinout against the current Quartus pin-out file before tape-out, as Intel occasionally revises pin assignments. Ensure the HPS boot mode strapping resistors are correctly set before first power-up, or the device may not boot. Finally, verify that any third-party IP cores support the specific Arria 10 SX device ID.
Compliance Information
SG suffix denotes SnPb ball finish; LG/HG variants are lead-free. RoHS compliance refers to overall product - verify ball-finish code for RoHS-strict assemblies. AEC-Q100 is not applicable as Arria 10 SX is not an automotive-qualified part.
