10AS048E2F29I2SG vs 10AS048E1F29I1HG Comparison
Detailed side-by-side comparison of 10AS048E2F29I2SG by Intel and 10AS048E1F29I1HG by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10AS048E2F29I2SG | 10AS048E1F29I1HG |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,980.00 | $1,920.00 |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA |
| Logic Elements | 480,000 | 480,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| Max HPS Frequency | 1.5 GHz | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (M20K + MLAB) | Approx. 28 Mbits total | — |
| DSP Blocks | [DATA_NEEDED: DSP block count and precision] | [DATA_NEEDED: DSP block count] |
| Transceivers | Multi-protocol up to 12.5 Gbps | [DATA_NEEDED: transceiver count and data rate] |
| Hard Memory Controllers | DDR4 / DDR3 / QDRII+ / RLDRAM3 | — |
| PCIe Hard IP | PCI Express Gen2/Gen3 | — |
| Process Technology | 20 nm TSMC | — |
| Package | 780-ball FC-FBGA (29 mm × 29 mm) | 780-ball FCBGA, 29x29 mm |
| Temperature Grade | Industrial | — |
| Lead-Free / RoHS | Yes | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Bitstream Security | AES-256 encryption, JTAG protection | — |
| Configuration Controller | On-chip | — |
| Operating Temperature | -40 °C to +100 °C (industrial) | -40C to +100C (Industrial) |
| HPS Clock Frequency | — | Up to 1.5 GHz |
| Process Node | — | 20 nm |
| Number of Terminals | — | 780 |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Embedded Memory | — | [DATA_NEEDED: embedded RAM bits] |
| MSL Level | — | [DATA_NEEDED: MSL rating] |
| RoHS Status | — | Compliant |