10AS048E2F29I2SG vs 10AS048E1F29I1HG 비교
다음의 상세 나란히 비교: 10AS048E2F29I2SG 제조: Intel 및 10AS048E1F29I1HG 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | 10AS048E2F29I2SG | 10AS048E1F29I1HG |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $1,980.00 | $1,920.00 |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA |
| Logic Elements | 480,000 | 480,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| Max HPS Frequency | 1.5 GHz | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (M20K + MLAB) | Approx. 28 Mbits total | — |
| DSP Blocks | [DATA_NEEDED: DSP block count and precision] | [DATA_NEEDED: DSP block count] |
| Transceivers | Multi-protocol up to 12.5 Gbps | [DATA_NEEDED: transceiver count and data rate] |
| Hard Memory Controllers | DDR4 / DDR3 / QDRII+ / RLDRAM3 | — |
| PCIe Hard IP | PCI Express Gen2/Gen3 | — |
| Process Technology | 20 nm TSMC | — |
| 패키지 | 780-ball FC-FBGA (29 mm × 29 mm) | 780-ball FCBGA, 29x29 mm |
| Temperature Grade | Industrial | — |
| Lead-Free / RoHS | Yes | — |
| 실장 유형 | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Bitstream Security | AES-256 encryption, JTAG protection | — |
| Configuration Controller | On-chip | — |
| 동작 온도 | -40 °C to +100 °C (industrial) | -40C to +100C (Industrial) |
| HPS Clock Frequency | — | Up to 1.5 GHz |
| Process Node | — | 20 nm |
| Number of Terminals | — | 780 |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Embedded Memory | — | [DATA_NEEDED: embedded RAM bits] |
| MSL 레벨 | — | [DATA_NEEDED: MSL rating] |
| RoHS 상태 | — | Compliant |