10AS048E1F29I1HG - Arria 10 SX SoC FPGA, 480K LE, 1.5GHz | Intel
MPN: 10AS048E1F29I1HG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2620 | $26,200.00 |
| 100 | $2380 | $238,000.00 |
| 500 | $2150 | $1,075,000.00 |
| 1,000 | $1920 | $1,920,000.00 |
Drop-in alternatives for 10AS048E1F29I1HG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AS032E4F29I3SG
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View Datasheet →10AS032E4F29I3LG
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View Datasheet →10AS032E4F29E3SG
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View Datasheet →10AS032E4F29E3LG
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View Datasheet →10AS032E4F27I3SG
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View Datasheet →10AS032E4F27I3LG
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View Datasheet →10AS048E1F29I1HG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 480,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Frequency | Up to 1.5 GHz |
| Process Node | 20 nm |
| Package | 780-ball FCBGA, 29x29 mm |
| Operating Temperature | -40C to +100C (Industrial) |
| Mounting Type | Surface Mount (Flip-Chip BGA) |
| Number of Terminals | 780 |
| Terminal Form | Ball |
| Package Code | BGA |
| Package Shape | Square |
| RoHS Status | Compliant |
10AS048E1F29I1HG square Pin Configuration Guide
Complete pinout information for 10AS048E1F29I1HG (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS048E1F29I1HG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048E1F29I1HG is suitable for 8 applications: Wireless Baseband / 5G NR PHY Acceleration, High-End Video Processing and Broadcast, Radar and Electronic Warfare Front-End, Industrial Motor Control and Drive, Medical Imaging (Ultrasound / CT Reconstruction), Aerospace Telemetry and Avionics, High-Performance Computing / Datacenter Acceleration, Test & Measurement Instrumentation.
Wireless Baseband / 5G NR PHY Acceleration
The 10AS048E1F29I1HG's 480K logic elements and integrated DSP blocks make it well suited for 4G LTE and 5G NR baseband digital front-end processing. Multi-Gbps CPRI/eCPRI links to remote radio heads run through the Arria 10 transceivers while the fabric accelerates FFT/CRS/channel-estimation datapaths, and the dual 1.5 GHz ARM Cortex-A9 HPS handles the MAC scheduler. Compared with discrete FPGA-plus-asset implementations, the integrated HPS eliminates an inter-chip interface and reduces PCB complexity. Placed at the heart of a DU (distributed unit), it deterministically processes PHY-layer channels at line rate.
Recommended
High-End Video Processing and Broadcast
With 480K LE and high-speed transceivers, the 10AS048E1F29I1HG serves broadcast studio equipment (12G-SDI/quad-link 3G-SDI routers, UHD video encoders, contribution encoders) and professional video walls. The HPS cores run a Linux control plane for IP-based broadcast glue (SMPTE 2022, SMPTE 2110), while the FPGA fabric processes uncompressed 4K/8K pixel streams with sub-frame latency. Power dissipation of the 20 nm Arria 10 at full load is lower than older 28 nm FPGAs, simplifying cooling in broadcast racks. Designers should pair it with external HDMI 2.0/2.1 PHYs and DP 1.4 retimers for consumer-side interfaces.
Recommended
Radar and Electronic Warfare Front-End
The 10AS048E1F29I1HG's combination of hardware DSP blocks, high-speed transceivers, and the dual 1.5 GHz ARM HPS supports phased-array radar front-end digital beamforming and electronic-warfare channelized receivers. The FPGA fabric performs beamforming weights, FFT, pulse compression, and Doppler filtering at the line rate required by modern AESA radars. The HPS controls mode scheduling, calibration, and external Ethernet-based data forwarding. Industrial temperature grade allows deployment on outdoor radar masts and tactical EW platforms.
Recommended
Industrial Motor Control and Drive
The Arria 10 SX SoC FPGA delivers deterministic sub-microsecond control loop latency for high-precision servo drives and multi-axis CNC controllers. The 480K LE fabric hosts multi-axis field-oriented control (FOC) algorithms running at 100 kHz+ switching frequency, while the HPS runs the motion controller and EtherCAT/CIP-Safety stack. Industrial temperature grade and 20 nm process efficiency make the device viable for the fan-less cabinet enclosures typical of modern servo amplifiers.
Recommended
Medical Imaging (Ultrasound / CT Reconstruction)
Ultrasound beamforming, CT filtered-back-projection, and MRI gradient control benefit from the 10AS048E1F29I1HG's 480K LE fabric and DSP blocks. Per-channel beamformers running on hundreds of FPGA DSP slices achieve deterministic per-beam latency, while the dual Cortex-A9 cores perform patient I/O, control plane, and image post-processing. Industrial temperature grade supports integration into medical cart and rack-mount systems. Designers should validate IEC 60601-1 patient-safety isolation requirements externally; the SoC FPGA itself does not provide isolation.
Recommended
Aerospace Telemetry and Avionics
The Arria 10 SX SoC FPGA is suitable for flight-test telemetry aggregation, MIL-STD-1553/ARINC 429 protocol bridging, and UAV command-and-control payloads. Industrial temperature grade tolerates cockpit thermal envelopes when paired with appropriate cold-plate mounting. The HPS runs an RTOS for telemetry packaging while the FPGA fabric handles sensor pre-processing, encryption acceleration, and high-speed serial links to ground stations. Note that fully-qualified MIL-PRF variants would require additional screening beyond the standard industrial part.
Recommended
High-Performance Computing / Datacenter Acceleration
Although Arria 10 SX is mid-range, the 10AS048E1F29I1HG is deployed in edge-computing and datacenter acceleration cards where the HPS handles PCIe endpoint management and the fabric accelerates compression, cryptography, or packet processing at line rate. The integrated HPS removes an external BMC or co-processor on SmartNIC reference designs. For higher-throughput acceleration, designers typically move to Stratix 10 or Agilex 7 FPGAs, but the Arria 10 SX remains attractive for cost-sensitive edge nodes.
Recommended
Test & Measurement Instrumentation
PXI-based protocol analyzers, high-speed serial protocol testers, and oscilloscope DSP engines leverage the 10AS048E1F29I1HG's transceiver and DSP resources. The HPS manages the host-side API, while the FPGA fabric implements real-time eye-diagram analysis, BER counters, and protocol-aware triggers. Compared with discrete-FPGA implementations, the SoC form factor reduces BOM count and simplifies USB-C/PCIe host connectivity on modular instruments.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048E1F29I1HG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS032E4F29I3SG | 10AS032E4F29I3LG | 10AS032E4F29E3SG | 10AS032E4F29E3LG | 10AS032E4F27I3SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FCBGA 29x29 mm (F29) | 780-FCBGA 29x29 mm (F29) - same | 780-FCBGA 29x29 mm (F29) - same | 780-FCBGA 29x29 mm (F29) - same | 780-FCBGA 29x29 mm (F29) - same | 780-FCBGA 27x27 mm (F27) |
| Logic Elements | 480,000 | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 |
| Hard Processor System | Dual ARM Cortex-A9 up to 1.5 GHz | Dual ARM Cortex-A9 up to 1.5 GHz | Dual ARM Cortex-A9 up to 1.5 GHz | Dual ARM Cortex-A9 up to 1.5 GHz | Dual ARM Cortex-A9 up to 1.5 GHz | Dual ARM Cortex-A9 up to 1.5 GHz |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Extended | Extended | Industrial |
| Process Node | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Family | Arria 10 SX SoC | Arria 10 SX SoC | Arria 10 SX SoC | Arria 10 SX SoC | Arria 10 SX SoC | Arria 10 SX SoC |
| AEC-Q100 Automotive Grade | No (industrial) | No | No | No | No | No |
| Typical 1-piece Price (USD) | 2,850 (as of 2026-09-05) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest-density Arria 10 SX variant in the 780-ball F29 footprint (vs 10AS032E4F29I3SG)
- Industrial temperature grade in same pinout (vs 10AS032E4F29E3SG)
- H-speed grade vs L-speed grade (vs 10AS032E4F29I3LG)
- 29x29 mm FCBGA package (vs 10AS032E4F27I3SG)
Design Notes
Estimated: at full HPS + fabric utilization, the Arria 10 SX dissipates 12-18 W. With a 780-ball FCBGA, the package junction-to-ambient thermal resistance is ~15 C/W without heat-spreader attachment. Designers must include a heat spreader (copper or graphite) and thermal vias (0.3 mm pitch, 12-16 per cm^2) under the BGA. A 4-layer PCB with continuous ground planes is mandatory; a 6-layer stack-up is preferred for thermal spreading on SoC FPGA designs.
Use a microvia stack-up (laser-drilled microvias to top/bottom layers, 0.2 mm pitch BGA fan-out) to break out the 1.0 mm pitch FCBGA. Match trace impedance for HPS DDR3/DDR4 interfaces (50 ohm single-ended, 100 ohm differential) and transceiver channels (100 ohm differential). Provide independent decoupling: 100 nF X7R per power pin pair, 4.7 uF bulk per rail. Follow Intel's Arria 10 SoC FPGA design guidelines for transceiver channel routing and length matching within 0.127 mm for HPS DDR4 byte lanes.
Estimated: power-supply sequencing follows Intel's Arria 10 SoC power-up order (VCC, VCCPT, VCCPGM, VCCP_HPS, VCC_HPS, then transceiver rails). Use a multi-rail PMIC with sequence control - Linear Technology (ADI) LTC2977 or Renesas ISL68127 are common reference designs. Tolerance on HPS core voltage is +/- 2.5%; VCC is +/- 3%. Decouple each rail with both bulk tantalum/polymer and ceramic X7R MLCCs.
Do not omit the configuration flash - the Arria 10 SX requires external QSPI or parallel flash for FPGA and HPS boot. Common pitfalls: missing JTAG pull-ups (10 kohm to VCCIO), missing HPS reset supervisor (TPS3808 or equivalent), and using wrong speed grade tools in Quartus Prime. Confirm the HPS boot flow (QSPI->NAND->eMMC->SD) is configured for your boot device. Note: cross-tool flow requires Quartus Prime 18.1 or later for SoC EDS HPS integration.
For HPS DDR4/LPDDR4 interfaces, place the SoC FPGA within 50 mm of the DRAM and use fly-by routing with series-termination resistors (33 ohm) at the controller. For transceiver channels operating at 12.5 Gbps, maintain a continuous reference plane under each lane and use a 4-layer PCB minimum with stripline routing for backplane applications. AC-coupling capacitors (100 nF) are required at the transmitter side per Intel's reference design; pre-emphasis and equalization are configured via the Arria 10 transceiver toolkit.
Compliance Information
RoHS compliant per Intel product compliance. Not AEC-Q100 qualified - industrial temperature grade only. Lead-free FCBGA per Intel datasheet. No halogen/PFAS disclosures required for this product family per Intel's documentation.
