10AS066K2F35E2LG vs 10AS066K3F35I2LG Comparison
Detailed side-by-side comparison of 10AS066K2F35E2LG by Intel and 10AS066K3F35I2LG by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10AS066K2F35E2LG | 10AS066K3F35I2LG |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $3,360.00 | $3,712.06 |
| Family | Arria 10 SX | Arria 10 SX SoC FPGA |
| Logic Elements | 660,000 | 660,000 |
| Process Technology | 20 nm TSMC | — |
| Hard Processor System (HPS) | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 1.5 GHz | — |
| Adaptive Logic Modules (ALMs) | 248,440 | — |
| Embedded Memory (M20K + MLAB) | Approx. 87 Mbits | — |
| DSP Blocks | 396 (variable-precision) | [DATA_NEEDED: variable-precision DSP block count] |
| Transceivers | 24 channels up to 17.4 Gbps | — |
| Hard Memory Controllers | DDR3/DDR4 with ECC | — |
| Package | 1152-ball FCBGA, 35 x 35 mm | 1152-ball FCBGA (F35), 35x35 mm |
| Core Voltage | 0.9 V | — |
| Temperature Grade | Industrial (E2 = -40C to +100C junction) | — |
| Mounting Type | Surface Mount | Surface Mount (FCBGA) |
| RoHS Status | Compliant | Compliant |
| Hard Processor System | — | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Speed | — | 1.5 GHz |
| Process Node | — | TSMC 20 nm |
| Operating Temperature | — | -40C to +100C (Industrial) |
| Speed Grade | — | K3 (mid-speed) |
| Logic Voltage | — | 0.9 V core |
| Transceiver Data Rate (max) | — | 28.05 Gbps |
| Number of I/O Banks | — | [DATA_NEEDED: exact bank count for F35 variant] |
| Maximum User I/O | — | [DATA_NEEDED: user I/O count] |
| Embedded Memory | — | [DATA_NEEDED: M20K block memory count] |
| PCIe Hard IP | — | PCIe Gen3 x8 hard IP |
| External Memory Support | — | DDR4, DDR3, LPDDR3, QDR IV, RLDRAM III |