10AX115N2F40I2SG vs 10AX115N2F40E2LG Comparison
Detailed side-by-side comparison of 10AX115N2F40I2SG by Intel and 10AX115N2F40E2LG by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10AX115N2F40I2SG | 10AX115N2F40E2LG |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $3,750.00 | $1,980.00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 1,150,000 | 1,150,000 |
| Embedded Memory Bits | 68,857,856 | — |
| Adaptive Logic Modules (ALMs) | 427,200 | 42,720 |
| Registers | 1,708,800 | — |
| User I/O | 600 | — |
| Transceiver Protocol | GX (up to 14.1 Gbps) | — |
| Transceiver Count | [DATA_NEEDED: transceiver count exact value] | — |
| DSP Blocks | Variable-precision, hard floating-point | Hardened floating-point, up to 1.5 TFLOPs |
| Package | 1517-ball FCBGA, 40 x 40 mm, 1.0 mm pitch | 1517-ball FC-BGA (F40) |
| Operating Temperature | -40C to +100C (Industrial) | 0C to 100C (E2 commercial) |
| Speed Grade | 2 | -2 |
| Process Technology | TSMC 20 nm | 20 nm |
| RoHS Status | Compliant | Compliant |
| Mounting Type | Surface Mount (flip-chip BGA) | — |
| Embedded Memory | — | 68,857,856 bits (28.05 Mbits) |
| Maximum User I/O | — | 600 |
| High-Speed Transceivers | — | 24 (up to 17.4 Gbps) |
| Hardened PCIe | — | Gen3 x8, Gen2 x8 |
| Core Voltage | — | 0.9 V (SmartVID) |
| Package Dimensions | — | 45 x 45 mm |
| Memory Interfaces | — | DDR4 up to 2400 Mbps, DDR3, QDR IV, RLDRAM III |
| Configuration Interface | — | JTAG, Active Serial, Fast Passive Parallel |