10AX115N2F40I2SG vs 10AX115N2F40E2LG Comparación
Comparación detallada lado a lado de 10AX115N2F40I2SG por Intel y 10AX115N2F40E2LG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX115N2F40I2SG | 10AX115N2F40E2LG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3.750,00 | $1.980,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 1,150,000 | 1,150,000 |
| Embedded Memory Bits | 68,857,856 | — |
| Adaptive Logic Modules (ALMs) | 427,200 | 42,720 |
| Registers | 1,708,800 | — |
| User I/O | 600 | — |
| Transceiver Protocol | GX (up to 14.1 Gbps) | — |
| Transceiver Count | [DATA_NEEDED: transceiver count exact value] | — |
| DSP Blocks | Variable-precision, hard floating-point | Hardened floating-point, up to 1.5 TFLOPs |
| Encapsulado | 1517-ball FCBGA, 40 x 40 mm, 1.0 mm pitch | 1517-ball FC-BGA (F40) |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | 0C to 100C (E2 commercial) |
| Speed Grade | 2 | -2 |
| Process Technology | TSMC 20 nm | 20 nm |
| Estado RoHS | Compliant | Compliant |
| Tipo de montaje | Surface Mount (flip-chip BGA) | — |
| Embedded Memory | — | 68,857,856 bits (28.05 Mbits) |
| Maximum User I/O | — | 600 |
| High-Speed Transceivers | — | 24 (up to 17.4 Gbps) |
| Hardened PCIe | — | Gen3 x8, Gen2 x8 |
| Core Voltage | — | 0.9 V (SmartVID) |
| Package Dimensions | — | 45 x 45 mm |
| Memory Interfaces | — | DDR4 up to 2400 Mbps, DDR3, QDR IV, RLDRAM III |
| Configuration Interface | — | JTAG, Active Serial, Fast Passive Parallel |