10CL010ZM164I8G vs 10CL010YM164C8G Comparison

Detailed side-by-side comparison of 10CL010ZM164I8G by Intel and 10CL010YM164C8G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10CL010ZM164I8G 10CL010YM164C8G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $23.10 $12.10
Family Cyclone 10 LP Cyclone 10 LP
Logic Elements 10,320 10,320
Embedded Memory 423,936 bits (414 Kbits) 414 Kbit (M9K blocks)
Embedded 18x18 Multipliers 46 56
Maximum User I/O 101 —
Package 164-ball MBGA (FineLine BGA, M164) 164-ball MBGA (Micro BGA, 8x8 mm)
Operating Temperature -40C to +100C (Industrial) —
Process Technology 60 nm low-power CMOS —
Core Voltage 1.0 V (typical), 1.2 V I/O banks 1.0 V nominal (range 1.0 V to 1.1 V)
Configuration Modes PS, FPP, JTAG —
PLLs 4 (per device, exact count [DATA_NEEDED: PLL count]) 4
I/O Standards LVTTL, LVCMOS, LVDS, SSTL, HSTL —
External Memory Support DDR2, DDR3, LPDDR2 (via soft IP) —
RoHS Status Compliant Compliant
Packaging Tray (I8G suffix) —
Maximum User I/Os — 224
Process Node — TSMC 60 nm low-power
Speed Grade — -8C (commercial, 8 speed grade)
Operating Junction Temperature — 0 C to +85 C (commercial)
Configuration Method — SRAM-based, JTAG/AS/AP/PS
Transceivers — None (general-purpose FPGA, no high-speed SERDES)
Hard PCIe Controller — 1x PCIe Gen1 (x1/x2 root port or endpoint)
Mounting Type — Surface Mount (BGA)
MSL Level — 3 (per JEDEC J-STD-020)
Lead-Free — Yes

Datasheets & Resources

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