10CL010ZM164I8G vs 10CL010YM164C8G Vergleich
Detaillierter Direktvergleich von 10CL010ZM164I8G von Intel und 10CL010YM164C8G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10CL010ZM164I8G | 10CL010YM164C8G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $23,10 | $12,10 |
| Family | Cyclone 10 LP | Cyclone 10 LP |
| Logic Elements | 10,320 | 10,320 |
| Embedded Memory | 423,936 bits (414 Kbits) | 414 Kbit (M9K blocks) |
| Embedded 18x18 Multipliers | 46 | 56 |
| Maximum User I/O | 101 | — |
| Gehäuse | 164-ball MBGA (FineLine BGA, M164) | 164-ball MBGA (Micro BGA, 8x8 mm) |
| Betriebstemperatur | -40C to +100C (Industrial) | — |
| Process Technology | 60 nm low-power CMOS | — |
| Core Voltage | 1.0 V (typical), 1.2 V I/O banks | 1.0 V nominal (range 1.0 V to 1.1 V) |
| Configuration Modes | PS, FPP, JTAG | — |
| PLLs | 4 (per device, exact count [DATA_NEEDED: PLL count]) | 4 |
| I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL | — |
| External Memory Support | DDR2, DDR3, LPDDR2 (via soft IP) | — |
| RoHS-Status | Compliant | Compliant |
| Packaging | Tray (I8G suffix) | — |
| Maximum User I/Os | — | 224 |
| Process Node | — | TSMC 60 nm low-power |
| Speed Grade | — | -8C (commercial, 8 speed grade) |
| Betriebs-Sperrschichttemperatur | — | 0 C to +85 C (commercial) |
| Configuration Method | — | SRAM-based, JTAG/AS/AP/PS |
| Transceivers | — | None (general-purpose FPGA, no high-speed SERDES) |
| Hard PCIe Controller | — | 1x PCIe Gen1 (x1/x2 root port or endpoint) |
| Montageart | — | Surface Mount (BGA) |
| MSL-Level | — | 3 (per JEDEC J-STD-020) |
| Lead-Free | — | Yes |