10CX105YF672I5G vs 10CX105YF672E6G Comparison

Detailed side-by-side comparison of 10CX105YF672I5G by Intel and 10CX105YF672E6G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10CX105YF672I5G 10CX105YF672E6G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $108.00 $100.55
Family Cyclone 10 GX —
Logic Elements (LE) 104,000 105,000
Embedded Memory (bits) 8,641,536 —
Adaptive Logic Modules (ALM) 39,240 (estimated from 104K LE) 38,000
18x19 Multipliers 156 —
User I/O Banks [DATA_NEEDED: User I/O Banks] —
Maximum User I/O 236 —
Transceivers Up to 12 (PCIe Gen2 capable) —
Maximum Transceiver Data Rate 12.5 Gbps —
Hard PCI Express Blocks 1 (Gen2 x1/x2/x4) —
Hard Memory Controllers DDR3, DDR4, LPDDR3 —
Process Technology 20 nm —
Package 672-ball FCBGA (F672) 672-BBGA, FCBGA (F672)
Package Pitch 1.0 mm —
Operating Temperature -40C to +100C (Industrial) 0 °C to +100 °C
Mounting Type Surface Mount (BGA) Surface Mount (SMD/SMT)
MSL Level 3 —
RoHS Status Compliant Compliant
Supply Voltage (Core) 0.9 V (typical) —
Supply Voltage (I/O) 1.2 V to 3.0 V (multi-voltage I/O) —
Series — Cyclone® 10 GX
Device Family — Cyclone 10 GX
Logic Cells — 104,000
Embedded Memory — 8.439 Mbit (8,641,536 bits)
User I/Os — 236
Core Operating Voltage — 0.9 V
Speed Grade — -6 (commercial)
Packaging — Tray
Process Node — 20 nm (TSMC)
Design Software — Quartus Prime Standard

Datasheets & Resources

Browse All Products Create BOM Request Quote