10CX150YF780E6G vs 10CX150YF780I6G Comparison

Detailed side-by-side comparison of 10CX150YF780E6G by Intel and 10CX150YF780I6G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10CX150YF780E6G 10CX150YF780I6G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $575.00 $325.00
Series Cyclone 10 GX —
Family Cyclone 10 GX Cyclone 10 GX
Process Technology 20 nm —
Logic Elements (LE) 150,000 150,000
Adaptive Logic Modules (ALM) 56,480 [DATA_NEEDED: ALM count]
Embedded Memory 10,907,648 bits (approximately 10.9 Mbit) —
User I/O Pins 284 [DATA_NEEDED: user I/O count for F780 package]
Package 780-ball FCBGA 780-ball FBGA (F780)
Speed Grade -6 (E6G industrial fast) I6G (industrial, -40C to +100C junction)
Operating Temperature -40C to +100C (Industrial) —
Transceivers GX up to 12.5 Gbps Up to 12 (3.125 Gbps)
PCIe Hard IP PCI Express Gen2 x4 hard IP —
DSP Blocks Variable-precision, fixed/floating point —
Memory Interfaces DDR3, DDR4, LPDDR3, QDR II+ —
Mounting Type Surface Mount (FCBGA) Surface Mount (FBGA)
RoHS Status Compliant Compliant (per distributor listing)
Lead-Free Yes —
MSL Level [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL rating]
Embedded Memory (M20K blocks) — [DATA_NEEDED: M20K block count]
Embedded Memory (total bits) — 10,907,648 bits
DSP Blocks (18x19 multipliers) — 484
Process Node — 20 nm
Temperature Range — Industrial: -40C to +100C (TJ)
Hard Memory Controller — DDR3 / DDR3L / LPDDR3
Hard PCIe — PCIe Gen2 (x1/x2/x4 hard IP)
Configuration — Active Serial (AS), Passive Serial (PS), JTAG

Datasheets & Resources

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