10CX150YF780E6G vs 10CX150YF780I6G Vergleich

Detaillierter Direktvergleich von 10CX150YF780E6G von Intel und 10CX150YF780I6G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter 10CX150YF780E6G 10CX150YF780I6G
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $575,00 $325,00
Series Cyclone 10 GX —
Family Cyclone 10 GX Cyclone 10 GX
Process Technology 20 nm —
Logic Elements (LE) 150,000 150,000
Adaptive Logic Modules (ALM) 56,480 [DATA_NEEDED: ALM count]
Embedded Memory 10,907,648 bits (approximately 10.9 Mbit) —
User I/O Pins 284 [DATA_NEEDED: user I/O count for F780 package]
Gehäuse 780-ball FCBGA 780-ball FBGA (F780)
Speed Grade -6 (E6G industrial fast) I6G (industrial, -40C to +100C junction)
Betriebstemperatur -40C to +100C (Industrial) —
Transceivers GX up to 12.5 Gbps Up to 12 (3.125 Gbps)
PCIe Hard IP PCI Express Gen2 x4 hard IP —
DSP Blocks Variable-precision, fixed/floating point —
Memory Interfaces DDR3, DDR4, LPDDR3, QDR II+ —
Montageart Surface Mount (FCBGA) Surface Mount (FBGA)
RoHS-Status Compliant Compliant (per distributor listing)
Lead-Free Yes —
MSL-Level [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL rating]
Embedded Memory (M20K blocks) — [DATA_NEEDED: M20K block count]
Embedded Memory (total bits) — 10,907,648 bits
DSP Blocks (18x19 multipliers) — 484
Process Node — 20 nm
Temperature Range — Industrial: -40C to +100C (TJ)
Hard Memory Controller — DDR3 / DDR3L / LPDDR3
Hard PCIe — PCIe Gen2 (x1/x2/x4 hard IP)
Configuration — Active Serial (AS), Passive Serial (PS), JTAG

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern