10M02DCU324A7G vs 10M04DCF256A7G Comparison
Detailed side-by-side comparison of 10M02DCU324A7G by Intel and 10M04DCF256A7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10M02DCU324A7G | 10M04DCF256A7G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $6.30 | $11.10 |
| Family | MAX 10 | — |
| Logic Elements (LE) | 2,000 | 4,000 |
| Embedded Memory | 110,592 bits | — |
| User I/O Count | 160 | — |
| Embedded 18x18 Multipliers | 16 | — |
| PLLs | [DATA_NEEDED: PLL count] | [DATA_NEEDED: PLL count] |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| User Flash Memory | Integrated (on-chip flash configuration) | — |
| Integrated ADC | 12-bit, 1 Msps+, successive approximation | 12-bit, 1 MSPS |
| Core Voltage | 1.15 V to 1.25 V | 1.2 V |
| Supply Voltage (VCCIO) | [DATA_NEEDED: VCCIO range] | — |
| Operating Junction Temperature | -40 C to +125 C (TJ) | — |
| Package Type | 324-UBGA (Ultra FineLine BGA) | — |
| Package Dimensions | 15 x 15 mm | — |
| Mounting Type | Surface Mount | Surface Mount |
| Process Technology | 55 nm embedded flash (TSMC) | 55 nm |
| RoHS Status | Compliant | Compliant |
| Lead-Free / Halogen-Free | [DATA_NEEDED: lead-free status] | — |
| Series | — | MAX 10 |
| Maximum User I/O | — | 178 |
| Embedded Memory (M9K) | — | 193,536 bits |
| Total RAM | — | 1.5 Mbit |
| User Flash Memory (UFM) | — | 16 Kbit |
| Package | — | 256-LBGA (FBGA) |
| Operating Temperature | — | -40C to +125C (Industrial) |
| Configuration Memory | — | Internal dual-configuration flash (instant-on) |