10M04DCF256A7G - MAX 10 FPGA 4K LE 256-FBGA | Intel
MPN: 10M04DCF256A7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $17.35 | $17.35 |
| 10 | $15.62 | $156.20 |
| 100 | $13.88 | $1,388.00 |
| 500 | $12.45 | $6,225.00 |
| 1,000 | $11.1 | $11,100.00 |
Drop-in alternatives for 10M04DCF256A7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M04DAF256A7G
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View Datasheet →10M04DAF256C7G
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View Datasheet →10M04DCF256C8G
✅ Drop-In📋 Reference alternative (not in catalog)
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View Datasheet →10M04DAU324I7G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →10M04DCF256A7G Maximum Ratings & Electrical Characteristics
| Series | MAX 10 |
| Logic Elements (LE) | 4,000 |
| Maximum User I/O | 178 |
| Embedded Memory (M9K) | 193,536 bits |
| Total RAM | 1.5 Mbit |
| User Flash Memory (UFM) | 16 Kbit |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| Package | 256-LBGA (FBGA) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +125C (Industrial) |
| Configuration Memory | Internal dual-configuration flash (instant-on) |
| Integrated ADC | 12-bit, 1 MSPS |
| RoHS Status | Compliant |
10M04DCF256A7G 256-lbga (fbga) Pin Configuration Guide
Complete pinout information for 10M04DCF256A7G (256-lbga (fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M04DCF256A7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M04DCF256A7G is suitable for 7 applications: Industrial Control and I/O Expansion, Motor Control and Drive Interfaces, Portable Test and Measurement, Automotive Infotainment and Body Controllers, Video Processing Bridges and Format Conversion, Consumer Electronics Custom Logic, Communication Protocol Bridging.
Industrial Control and I/O Expansion
The 10M04DCF256A7G suits industrial PLC and I/O expansion modules where deterministic logic and 178 GPIO enable multi-protocol interfacing. The MAX 10's instant-on dual-configuration flash eliminates boot delay, critical for factory automation requiring sub-100ms power-up. Integrated 12-bit ADC supports sensor signal conditioning, while 55nm process ensures low power dissipation under continuous industrial operation. Compared to discrete MCU + CPLD designs, the 10M04 consolidates glue logic, state machines, and protocol bridging (RS-485, CAN, SPI, I2C) into a single 256-FBGA device, reducing BOM and PCB area.
Recommended
Motor Control and Drive Interfaces
The 10M04DCF256A7G's 4K logic elements and 178 I/O enable field-oriented control (FOC) and PWM generation for 3-phase motor drives up to several kW. Hardware multipliers and DSP blocks accelerate Park/Clarke transforms, while 1.5 Mbit embedded RAM stores lookup tables and filter coefficients. The integrated ADC samples current and voltage feedback synchronously to PWM, reducing latency versus external ADC chains. Industrial temperature grade (-40C to +125C) and 256-FBGA thermal performance support enclosed drive enclosures with forced-air cooling.
Recommended
Portable Test and Measurement
The 10M04DCF256A7G is well-suited for handheld oscilloscopes, logic analyzers, and portable data acquisition systems. Its 12-bit integrated ADC samples at 1 MSPS for mid-bandwidth signal capture, while 4K logic elements implement triggering, protocol decoding (I2C/SPI/UART), and display drivers. Single 3.3V supply operation with internal voltage regulation simplifies power tree design. The 256-FBGA package offers 178 I/O for multi-channel front-end multiplexing, and instant-on flash configuration reduces battery drain during standby.
Recommended
Automotive Infotainment and Body Controllers
The 10M04DCF256A7G's industrial temperature range and 178 GPIO enable body control modules, lighting controllers, and infotainment I/O bridging in automotive designs. MAX 10 non-volatile flash supports OTA (over-the-air) firmware updates with design rollback capability, critical for vehicle recall mitigation. The integrated ADC monitors battery voltage, temperature, and illumination sensors directly. Note: this part is industrial-grade; AEC-Q100 qualified variants in the MAX 10 family should be selected for safety-critical automotive applications.
Recommended
Video Processing Bridges and Format Conversion
The 10M04DCF256A7G provides LVDS, CMOS, and DDR memory interfaces for video format conversion (RGB to MIPI, HDMI to LVDS) in display panels and embedded vision systems. With 1.5 Mbit embedded block RAM, the device buffers video frames while 4K logic elements implement scaling, color space conversion, and timing generation. The 256-FBGA package supports the high pin count required for parallel video buses, and internal flash stores default boot images for instant-on display initialization.
Recommended
Consumer Electronics Custom Logic
The 10M04DCF256A7G integrates custom user interfaces, LED matrix driving, and peripheral glue logic in consumer products like smart appliances, gaming peripherals, and home audio. The 12-bit ADC reads capacitive touch sensors and analog control knobs, while PWM outputs drive LED dimming at up to hundreds of kHz. Instant-on flash configuration enables immediate user response at power-up, a UX advantage over MCU boot sequences. The 256-FBGA and -40C to +125C rating suit thermally constrained consumer enclosures.
Recommended
Communication Protocol Bridging
The 10M04DCF256A7G bridges legacy and modern serial interfaces (UART, SPI, I2C, CAN, USB, Ethernet) in embedded gateways. Its 178 GPIO accommodate multiple parallel protocol buses, while 4K logic elements implement protocol stack layers and timing-critical state machines. Dual-configuration flash allows field upgrades of bridge firmware without external memory, and the 55nm process ensures low standby power for always-on IoT edge devices. Industrial temperature grade supports outdoor and industrial installations.
Recommended
Recommended Products Summary
Engineering reference data for 10M04DCF256A7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M04DAF256A7G | 10M04DAF256C7G | 10M04DCF256C8G |
|---|---|---|---|---|
| Package | 256-LBGA (F256) | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same |
| Logic Elements | 4,000 | 4,000 | 4,000 | 4,000 |
| Maximum User I/O | 178 | 178 | 178 | 178 |
| Embedded Memory (M9K) | 193,536 bits | 193,536 bits | 193,536 bits | 193,536 bits |
| Speed Grade | A7 (standard) | A7 (standard) | C7 (commercial) | C8 (commercial) |
| Operating Temperature | -40C to +125C (Industrial) | -40C to +125C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Integrated ADC | 12-bit, 1 MSPS | 12-bit, 1 MSPS | 12-bit, 1 MSPS | 12-bit, 1 MSPS |
| Unit Price (qty 1) | $17.35 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Internal dual-configuration flash eliminates external boot PROM (vs 10M04DAF256A7G)
- Industrial temperature grade for harsh environments (vs 10M04DCF256C8G)
- Integrated 12-bit ADC eliminates external sampling ICs (vs Lattice MachXO2)
Design Notes
The 256-FBGA package requires the central exposed pad to be soldered to a PCB ground plane for thermal dissipation. Estimated: at typical 1.2V core and 100mA active current, power dissipation is approximately 120mW, well within passive cooling limits. For continuous high-utilization designs (above 80% LE and DSP usage), provide at least 4 thermal vias under the exposed pad to a 2oz copper inner ground layer to keep junction temperature below 100C in enclosed industrial enclosures.
Route differential pairs (LVDS, DDR) with 100 ohm differential impedance and length-matched within 150 mils for signal integrity. Place decoupling capacitors (100nF + 10uF bulk) within 100 mils of each power pin. For MAX 10 devices, separate analog AVDD and digital VCCINT supplies with ferrite beads to prevent ADC noise coupling. According to the MAX 10 hardware design guidelines, JTAG pins (TCK, TMS, TDI, TDO) require 4.7k pull-ups on TCK and TMS for reliable configuration.
Do not confuse the 10M04DCF256A7G (industrial, A7 speed) with the 10M04DCF256C8G (commercial, C8 speed) when sourcing for industrial applications - the C8 variant lacks the -40C to +125C rating. Configuration mode (AS, PS, JTAG) must be set via MSEL pins at power-up; incorrect MSEL strapping causes silent configuration failure. The dual-configuration flash requires Quartus Prime conversion to .pof format - .sof files only program SRAM and are lost at power-down.
Place the 256-FBGA on the top side of the PCB with a 4-layer stack-up (signal-ground-power-signal) for optimal signal integrity. Use microvia or via-in-pad technology for inner-row balls to route out from the dense 1.0mm pitch array. Per Intel's MAX 10 layout guidelines, keep all high-speed traces on the top layer directly above a continuous ground plane to minimize return path inductance.
Compliance Information
RoHS compliant per Altera/Intel product page. Industrial temperature grade (-40C to +125C) but NOT AEC-Q100 qualified; for automotive safety-critical applications use MAX 10 AEC-Q100 variants. Halogen-free status not explicitly stated in verified data.
