10M04DAF256C7G vs 10M08DAF256C7G Comparison
Detailed side-by-side comparison of 10M04DAF256C7G by Intel and 10M08DAF256C7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10M04DAF256C7G | 10M08DAF256C7G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $9.45 | $7.95 |
| Family | MAX 10 FPGA | MAX 10 |
| Logic Elements (LE) | 4,000 | 8,000 |
| Maximum User I/Os | 178 | — |
| Embedded Memory (M9K blocks total) | 176 Kbits | — |
| User Flash Memory | 193,536 bits | 387,072 bits (approx. 48 KB) |
| Configuration Flash (on-die) | 1,178 Kbits (CFM0 + CFM1 dual-config) | — |
| Package | 256-LBGA (F256) FineLine BGA, 17 mm x 17 mm | 256-pin LBGA (F256) |
| Temperature Grade (junction) | 0C to 100C (commercial) | — |
| Core Voltage | 1.2 V | 1.2 V |
| Auxiliary Voltage | 2.5 V / 3.3 V | — |
| ADC | 1 x 12-bit, 1 Msps SAR | — |
| PLL | 1 (general-purpose) | — |
| Process Technology | 55 nm TSMC flash-based | [DATA_NEEDED: process node, typically 55 nm embedded flash] |
| LVDS Transmitter (max data rate) | 800 Mbps | — |
| RoHS Status | Compliant | Compliant (Pb-free "G" suffix) |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| MSL Level | [DATA_NEEDED: MSL level] | — |
| Lead-Free | Yes | — |
| Embedded Memory (M9K blocks) | — | 46 (378 Kbits) |
| Maximum User I/O | — | 178 |
| Operating Temperature | — | 0 °C to +85 °C (Commercial, "C" grade) |
| Package Dimensions | — | 17 mm × 17 mm, 1.0 mm ball pitch |
| On-chip ADC | — | 12-bit, 1 MSPS, 1 channel |
| PLLs | — | 2 |
| 18 × 18 Multipliers | — | 24 |
| Configuration | — | Dual-configuration internal flash (D-series) |
| Internal Oscillator | — | Yes (on-chip) |