10M04DAF256C7G vs 10M08DAF256C7G Vergleich
Detaillierter Direktvergleich von 10M04DAF256C7G von Intel und 10M08DAF256C7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M04DAF256C7G | 10M08DAF256C7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $9,45 | $7,95 |
| Family | MAX 10 FPGA | MAX 10 |
| Logic Elements (LE) | 4,000 | 8,000 |
| Maximum User I/Os | 178 | — |
| Embedded Memory (M9K blocks total) | 176 Kbits | — |
| User Flash Memory | 193,536 bits | 387,072 bits (approx. 48 KB) |
| Configuration Flash (on-die) | 1,178 Kbits (CFM0 + CFM1 dual-config) | — |
| Gehäuse | 256-LBGA (F256) FineLine BGA, 17 mm x 17 mm | 256-pin LBGA (F256) |
| Temperature Grade (junction) | 0C to 100C (commercial) | — |
| Core Voltage | 1.2 V | 1.2 V |
| Auxiliary Voltage | 2.5 V / 3.3 V | — |
| ADC | 1 x 12-bit, 1 Msps SAR | — |
| PLL | 1 (general-purpose) | — |
| Process Technology | 55 nm TSMC flash-based | [DATA_NEEDED: process node, typically 55 nm embedded flash] |
| LVDS Transmitter (max data rate) | 800 Mbps | — |
| RoHS-Status | Compliant | Compliant (Pb-free "G" suffix) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Lead-Free | Yes | — |
| Embedded Memory (M9K blocks) | — | 46 (378 Kbits) |
| Maximum User I/O | — | 178 |
| Betriebstemperatur | — | 0 °C to +85 °C (Commercial, "C" grade) |
| Package Dimensions | — | 17 mm × 17 mm, 1.0 mm ball pitch |
| On-chip ADC | — | 12-bit, 1 MSPS, 1 channel |
| PLLs | — | 2 |
| 18 × 18 Multipliers | — | 24 |
| Configuration | — | Dual-configuration internal flash (D-series) |
| Internal Oscillator | — | Yes (on-chip) |