10M04SCM153I7G vs 10M04SAM153I7G Comparison

Detailed side-by-side comparison of 10M04SCM153I7G by Intel and 10M04SAM153I7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10M04SCM153I7G 10M04SAM153I7G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $9.20 $9.20
Family MAX 10 MAX® 10 FPGA
Logic Elements (LE) 4,000 —
Embedded Memory (bits) 193,536 193,536
Maximum User I/O 112 —
Package 153-ball MBGA (Micro FineLine BGA), 8x8 mm, 0.5 mm pitch 153-ball MBGA (Micro FineLine BGA)
Process Technology 55 nm 55 nm (embedded flash, TSMC)
Core Voltage 1.2 V 1.2 V
I/O Voltage Standards LVCMOS 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V —
Embedded Memory Type M9K (9 Kbit blocks) —
User Flash (CFM/UFM) Available (configurable flash + user flash) —
DSP Blocks (18x18 Multipliers) 16 —
PLLs 2 [DATA_NEEDED: PLL count]
On-chip ADC 12-bit, 1 Msps, up to 17 analog inputs —
Speed Grade SC (commercial/industrial slow) —
Temperature Grade Industrial (I), -40C to +100C —
Configuration Method On-chip flash + JTAG On-die flash, instant-on
Lead-free / RoHS Yes (7G suffix) —
Mounting Type Surface Mount (BGA) Surface Mount
Series — MAX 10 (10M04)
Logic Elements (LEs) — 4,000
User I/O Count — 112
I/O Voltage Support — 3.0 V / 3.3 V LVCMOS
Package Pitch — [DATA_NEEDED: package ball pitch]
Operating Temperature — -40 °C to +100 °C (industrial)
Multiplier Blocks (18×18) — [DATA_NEEDED: multiplier count]
ADC Block — [DATA_NEEDED: ADC presence on this density]
User Flash — [DATA_NEEDED: user flash size]
RoHS Status — Compliant
Lead-Free — Yes

Datasheets & Resources

Browse All Products Create BOM Request Quote