10M04SCU169I7G vs 10M08SCU169I7G Comparison

Detailed side-by-side comparison of 10M04SCU169I7G by Intel and 10M08SCU169I7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
10M08SCU169I7G 10M08SCU169I7G - MAX 10 FPGA 8K LE 169-UBGA | Intel

10M08SCU169I7G - MAX 10 FPGA 8K LE 169-UBGA | Intel

10M08SCU169I7G ✓ Active

Specification Comparison

Parameter 10M04SCU169I7G 10M08SCU169I7G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $9.95 $9.85
Family MAX 10 MAX 10
Logic Elements (LE) 4,000 8,000
Embedded User Flash Memory 193,536 bits (approx. 24 KB) —
Embedded SRAM (M9K blocks) 270 Kbits —
Maximum User I/O 130 —
Package 169-ball UBGA (U169) 169-ball UFBGA / UBGA (U169), 11 mm x 11 mm, 0.65 mm pitch
Speed Grade SC —
Core Voltage 1.2 V —
Operating Temperature -40C to +100C (Industrial) -40 C to +100 C (industrial, suffix I7G)
Lead-Free Finish 7G (lead-free) —
Process Node 55 nm embedded-flash CMOS —
On-die ADC Up to 2 x 12-bit blocks —
Configuration Method On-die flash (non-volatile, instant-on) JTAG, internal flash, dual-boot
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
RoHS Status Compliant —
Embedded Memory (M9K blocks) — [DATA_NEEDED: M9K count and total bits]
Embedded User Flash — 387,072 bits (48 KB)
User I/O Count — 130
Maximum User I/O (package) — 130 (U169)
Core Voltage (VCCINT) — 1.2 V
Process Technology — TSMC 55 nm embedded flash
Configuration Memory — Internal flash (non-volatile, dual-boot)
PLL Count — [DATA_NEEDED: number of PLLs]
Global Clock Networks — [DATA_NEEDED: global clock count]
DSP Blocks (18x18 multipliers) — [DATA_NEEDED: multiplier count]
ADC — 12-bit, 1 MSPS, 4 channels (single supply variant)
Lead-Free / RoHS — Yes / Compliant
MSL Level — 3 (per JEDEC J-STD-020)
Supported I/O Standards — LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI

Datasheets & Resources

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