10M08SCU169I7G - MAX 10 FPGA 8K LE 169-UBGA | Intel
MPN: 10M08SCU169I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $17.1 | $17.10 |
| 10 | $15.4 | $154.00 |
| 100 | $12.95 | $1,295.00 |
| 500 | $11.2 | $5,600.00 |
| 1,000 | $9.85 | $9,850.00 |
Drop-in alternatives for 10M08SCU169I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10M08SCU169A7G
✅ Drop-In✓ In Stock
$19.85 / Unit
View Datasheet →10M08SAU169I7G
✅ Drop-In📋 Reference alternative (not in catalog)
10M08SAU169C8G
✅ Drop-In✓ In Stock
$11.85 / Unit
View Datasheet →10M08SAU169A7G
✅ Drop-In✓ In Stock
$10.5 / Unit
View Datasheet →10M08SAU324I7G
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$23.4 / Unit
View Datasheet →10M04SCU169I7G
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$8.92 / Unit
View Datasheet →10M08SCU169I7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 8,000 |
| Embedded User Flash | 387,072 bits (48 KB) |
| User I/O Count | 130 |
| Maximum User I/O (package) | 130 (U169) |
| Core Voltage (VCCINT) | 1.2 V |
| Process Technology | TSMC 55 nm embedded flash |
| Configuration Memory | Internal flash (non-volatile, dual-boot) |
| Package | 169-ball UFBGA / UBGA (U169), 11 mm x 11 mm, 0.65 mm pitch |
| Operating Temperature | -40 C to +100 C (industrial, suffix I7G) |
| ADC | 12-bit, 1 MSPS, 4 channels (single supply variant) |
| Mounting Type | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes / Compliant |
| MSL Level | 3 (per JEDEC J-STD-020) |
| Configuration Method | JTAG, internal flash, dual-boot |
| Supported I/O Standards | LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI |
10M08SCU169I7G 169-ball ufbga / ubga (u169), 11 mm x 11 mm, 0.65 mm pitch Pin Configuration Guide
Complete pinout information for 10M08SCU169I7G (169-ball ufbga / ubga (u169), 11 mm x 11 mm, 0.65 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M08SCU169I7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M08SCU169I7G is suitable for 6 applications: Industrial I/O Expansion Module, Motor Control and Drive Front-End, Video Bridging and Display Controller, Portable Medical Device Front-End, Low-Cost ASIC Prototyping and Emulation, Glue Logic and Protocol Converter.
Industrial I/O Expansion Module
The 10M08SCU169I7G fits industrial I/O expansion modules because its 130 user I/Os across 8 banks can map directly to opto-isolated digital inputs, relay drivers, and encoder interfaces, eliminating a discrete ASIC plus glue CPLD. The 8,000 logic elements are sufficient for protocol conversion (Modbus RTU to Ethernet/IP) and the 387,072-bit user flash can store configuration data and calibration tables. Industrial -40C to +100C operation handles factory-floor temperatures. Compared with a discrete CPLD plus microcontroller architecture, the MAX 10 replaces two devices with one and reduces board area by roughly 30-40%.
Recommended
Motor Control and Drive Front-End
The 10M08SCU169I7G suits motor control and drive front-ends because the integrated 12-bit 1 MSPS 4-channel ADC simultaneously samples phase currents, DC bus voltage, and a temperature sensor without an external ADC chip. The 8,000 logic elements accommodate space-vector PWM generators, FOC datapaths, and protection logic. The 387 Kbit user flash stores motor parameters and lookup tables for sensorless startup. With industrial temperature grade and 55 nm embedded flash reliability, the device tolerates under-hood and inverter-cabinet environments where conventional SRAM-based FPGAs would be marginal.
Recommended
Video Bridging and Display Controller
The 10M08SCU169I7G bridges legacy video interfaces (CMOS camera, RGB, LVDS) to modern MIPI or HDMI outputs using the 130 user I/Os and internal M9K memory blocks for line buffers. At common video resolutions up to 720p60, 8,000 logic elements are sufficient for color-space conversion, scaling, and overlay composition. The non-volatile instant-on configuration is valuable for kiosk and signage applications where the system must display a splash screen within 50 ms of power-up, eliminating external boot PROM cost. Industrial temperature grade supports outdoor digital-signage enclosures.
Recommended
Portable Medical Device Front-End
The 10M08SCU169I7G is appropriate for portable medical device front-ends (pulse oximeter, glucose meter, ECG patch) because the integrated ADC samples bioelectric or optical signals directly while the user flash stores calibration coefficients, patient logs, and firmware updates. Non-volatile instant-on minimizes boot latency for emergency clinician workflows, and 8,000 LE supports DSP-style FIR filtering for noise rejection. The 1.2 V core and power-management features suit battery operation, while the 169-ball BGA measures only 11 mm x 11 mm, fitting compact handheld enclosures.
Recommended
Low-Cost ASIC Prototyping and Emulation
Engineers use the 10M08SCU169I7G for low-cost ASIC prototyping and IP validation because the 387,072-bit embedded user flash acts as on-chip emulation ROM, and the dual-boot feature enables field-upgradable RTL test images. The 8,000 logic elements map small SoC peripherals (UART, SPI, I2C controllers, custom DMA engines) before tape-out. Quartus Prime synthesis flow supports incremental compilation and Hardware-in-the-Loop (HIL) testbenches. Compared with renting a larger FPGA prototyping platform, a U169 board reduces per-engineer cost by approximately 70-80% for sub-10K gate designs.
Recommended
Glue Logic and Protocol Converter
The 10M08SCU169I7G is widely deployed as a glue-logic and protocol converter between microcontrollers, sensors, and backplane buses. The 130 user I/Os and 8 I/O banks support mixed-voltage interfaces (3.3 V, 2.5 V, 1.8 V, 1.5 V) without external level shifters, while 8,000 LE handles UART, SPI, I2C, and custom timing-sensitive glue. Non-volatile boot eliminates external boot ROMs, and the device's instant-on behavior suits power-rail-sequenced systems where downstream devices require deterministic initialization order.
Recommended
Recommended Products Summary
Engineering reference data for 10M08SCU169I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M08SCU169A7G | 10M08SAU169I7G | 10M08SAU169C8G | 10M04SCU169I7G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 169-ball UFBGA (U169) | 169-ball UFBGA (U169) | 169-ball UFBGA (U169) | 169-ball UFBGA (U169) | 169-ball UFBGA (U169) |
| Logic Elements | 8,000 | 8,000 | 8,000 | 8,000 | 4,000 |
| User I/O | 130 | 130 | 130 | 130 | 130 |
| Embedded User Flash | 387,072 bits | 387,072 bits | 387,072 bits | 387,072 bits | Approximately 387,072 bits (MAX 10 04 family) |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C | Industrial -40C to +100C |
| Speed Grade | 7 (fastest) | 7 | 7 | 8 | 7 |
| Internal Configuration Memory | Yes (flash, dual-boot) | Yes (flash, dual-boot) | Yes (flash, dual-boot) | Yes (flash, dual-boot) | Yes (flash, dual-boot) |
| ADC (12-bit 1 MSPS) | 4 channels | 4 channels | 4 channels | 4 channels | 4 channels |
Key Differentiators
- Industrial temperature grade in U169 package (vs 10M08SCU169A7G)
- Drop-in pin compatibility within U169 footprint (vs 10M08SAU169I7G)
- Highest speed grade 7 in U169 footprint (vs 10M08SAU169C8G)
- Highest density in U169 family (vs 10M04SCU169I7G)
Design Notes
The U169 package is an 11 mm x 11 mm fine-pitch BGA with 0.65 mm ball pitch. Use 0.4 mm laser-drilled microvias in the fan-out pattern with a 4-layer 1 oz copper stack-up (signal-GND-power-signal). Escape the inner balls with dog-bone fan-out, and place the inner-row decoupling capacitors on the bottom side. Follow Intel MAX 10 hardware design guidelines for via-in-pad and solder-mask-defined pad geometry to avoid tombstoning during reflow.
MAX 10 FPGAs require separate VCCINT (1.2 V), VCCIOx (per-bank, 1.2 V to 3.3 V), VCCA (2.5 V analog for ADC), VCCD_PLL (1.2 V for PLLs), and a 3.3 V or 2.5 V VCCPD configuration bank. Decouple each rail with 100 nF X7R capacitors within 3 mm of the relevant balls, and add a 10 uF bulk capacitor per rail. Power-on sequencing requires VCCINT to ramp before or simultaneously with VCCIO; violation can latch-up the I/O buffers. The integrated ADC adds 2.5 V VCCA noise sensitivity - keep this rail isolated from switching DC-DC nodes by at least 20 dB attenuation.
For LVDS pairs above 200 Mbps, length-match the differential traces within 150 microns of each other and within the same I/O bank. Maintain 100 ohm differential impedance with 85 ohm trace-to-plane spacing. Use Intel's Pin Planner to assign LVDS pairs to true differential pins (positive and negative on adjacent balls); mismatched assignment works electrically but reduces Fmax by approximately 20-30%. For SDRAM or DDR interfaces, enable the Quartus Prime dynamic phase-shift feature on the PLL to deskew the strobe at high temperature.
Common pitfalls when bringing up MAX 10 designs include: (1) leaving JTAG TCK floating (always tie to ground through 1-10 kohm for board-level robustness), (2) selecting dual-boot without populating the second image selector jumper, which can leave the device in an unconfigured state after a failed update, (3) configuring unused GPIO as analog input and leaving them floating, which draws extra bias current, and (4) forgetting to enable the internal pull-up on nCONFIG or nSTATUS lines during board-level testing - external 10 kohm pull-ups are recommended even when the internal weak pull-up is enabled.
Compliance Information
RoHS and REACH compliance per Intel MAX 10 material declaration. Not AEC-Q100 qualified - the MAX 10 family is not automotive-grade; automotive applications should consider Cyclone IV or Cyclone V automotive variants instead. Halogen-free per JEDEC JS709B.
