10M04SCU169I7G - 4K LE MAX 10 FPGA 130 I/O 169-UBGA | Intel
MPN: 10M04SCU169I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $13.58 | $13.58 |
| 10 | $12.45 | $124.50 |
| 100 | $11.05 | $1,105.00 |
| 500 | $9.85 | $4,925.00 |
| 1,000 | $8.92 | $8,920.00 |
Drop-in alternatives for 10M04SCU169I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10M04SCU169A7G
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View Datasheet →10M04SCE144I7G
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View Datasheet →10M08SCU169I7G
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View Datasheet →10M02SCU169A7G
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View Datasheet →10M04SAU169I7G
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View Datasheet →10M04SCU169I7G Maximum Ratings & Electrical Characteristics
| Series | MAX 10 |
| Logic Elements (LE) | 4,000 |
| Embedded Memory (bits) | 193,536 |
| User I/O Count | 130 |
| Package | 169-UBGA (Ultra FineLine BGA) |
| Package Code | U169 |
| Speed Grade | SC |
| Operating Temperature | -40C to +100C (Industrial) |
| Mounting Type | Surface Mount |
| On-die Flash | Yes (dual-configuration) |
| ADC Blocks | Up to 2 x 12-bit |
| RoHS Status | Compliant (Pb-free 7G finish) |
| MSL Level | 3 |
| Configuration Method | On-die flash (no external PROM required) |
10M04SCU169I7G u169 Pin Configuration Guide
Complete pinout information for 10M04SCU169I7G (u169 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M04SCU169I7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M04SCU169I7G is suitable for 7 applications: Industrial Motor Control and Drive I/O Expansion, Factory Automation Protocol Bridging, Sensor Aggregation Gateway Edge Nodes, Low-Cost Video Bridging and Display Adapters, Automotive Body and Infotainment Controllers, Battery-Backed Portable and Edge IoT Devices, Test and Measurement Front-End Conditioning.
Industrial Motor Control and Drive I/O Expansion
The 10M04SCU169I7G fits industrial motor control and drive I/O expansion because its 130 user I/O support LVCMOS and LVDS signaling at multiple voltage rails, while on-die 12-bit ADC blocks enable direct current-sensor sampling and back-EMF monitoring. The non-volatile flash configuration gives instant-on behavior needed for safe drive startup, and the 55 nm embedded-flash process tolerates industrial ambient temperatures up to +100C. In a typical drive, the FPGA bridges between the controller MCU and gate driver logic, performs encoder decoding, and adds safety interlocks without burdening the host MCU. The 4 K LE budget supports PID loops, encoder quadrature logic, and PWM safety gating in a single device.
Recommended
Factory Automation Protocol Bridging
The 10M04SCU169I7G is ideal for factory automation protocol bridging because the 130 user I/O pins permit parallel management of RS-485, RS-232, SPI, I2C, and LVDS interfaces in a single device, while the 4 K LE fabric implements soft UART, Modbus, or PROFINET bridging cores. The on-die flash lets designers ship field-upgradable protocol stacks and the dual-configuration images support safe remote firmware updates in always-on PLCs. Compared to a discrete microcontroller, the FPGA offers deterministic latency and parallel interface handling, which is critical when bridging between sensors, motor drives, and the central controller. The industrial temperature grade supports cabinet environments without additional cooling.
Recommended
Sensor Aggregation Gateway Edge Nodes
The 10M04SCU169I7G suits sensor aggregation gateway edge nodes because the integrated 12-bit ADC blocks and 130 I/O allow direct attachment of multiple analog and digital sensors without external glue. The non-volatile flash stores calibration tables locally, removing the need for an external EEPROM, and the 4 K LE budget implements filtering, threshold detection, and pre-MCU aggregation. Edge nodes benefit from the instant-on behavior of MAX 10 because the FPGA can boot and stream telemetry before the main MCU completes initialization. The industrial -40C to +100C range supports outdoor and factory-edge deployments.
Recommended
Low-Cost Video Bridging and Display Adapters
The 10M04SCU169I7G works in low-cost video bridging and display adapters because the 130 user I/O and LVDS support enable conversion between CMOS camera interfaces, RGB panels, and LVDS displays. The 4 K LE budget fits timing controllers, limited color-space conversion, and minor scaling, while on-die flash holds color profiles and gamma tables. Compared to a dedicated video ASSP, the MAX 10 allows late-stage customization for panel variants without re-spinning the board, which is valuable in small-batch industrial HMIs. The industrial temperature grade suits outdoor signage and kiosk displays.
Recommended
Automotive Body and Infotainment Controllers
The 10M04SCU169I7G with industrial temperature grade fits automotive body and infotainment subsystems such as body control, lighting, and HMI bridging. The on-die flash supports secure boot and dual-configuration image updates required for OEM service workflows, while 130 user I/O drive LIN, CAN, and discrete LEDs. For higher temperature AEC-Q100 requirements, designers migrate to 10M04SCU169A7G on the same U169 footprint. The 4 K LE budget is sufficient for body controller logic, lighting PWM, and touch/HMI multiplexing. Quartus Prime automotive support reduces qualification effort.
Recommended
Battery-Backed Portable and Edge IoT Devices
The 10M04SCU169I7G fits battery-backed portable and edge IoT devices because non-volatile flash enables instant wake-up without boot delay, preserving battery life. The 130 user I/O and on-die ADC blocks allow direct sensor attachment, while the 4 K LE fabric implements event-driven state machines that wake the host MCU only when needed. Compared with SRAM-based FPGAs that require external boot PROMs, the MAX 10 reduces standby power and BOM size. The industrial temperature grade supports outdoor IoT deployments and remote sensor nodes.
Recommended
Test and Measurement Front-End Conditioning
The 10M04SCU169I7G suits test and measurement front-end conditioning because the on-die 12-bit ADC, LVDS I/O, and 130 user I/O support multi-channel signal switching, gain ranging, and trigger logic. The 4 K LE fabric implements timing generators and statistical accumulators, while on-die flash stores calibration constants and personality settings for different DUTs. Compared with discrete logic, the FPGA consolidates switching, ADC sequencing, and trigger logic into a single reconfigurable device, reducing calibration drift across channels. The industrial temperature grade supports lab and field-deployed test gear.
Recommended
Recommended Products Summary
Engineering reference data for 10M04SCU169I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M04SCU169A7G | 10M04SCE144I7G | 10M04SCE144A7G | 10M08SCU169I7G | 10M02SCU169A7G | 10M04SAU169I7G |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 169-UBGA (U169) | 169-UBGA (U169) - same | 169-UBGA (U169) - same | 169-UBGA (U169) - same | 169-UBGA (U169) - same | 169-UBGA (U169) - same | 169-UBGA (U169) - same |
| Logic Elements | 4,000 | 4,000 | 4,000 | 4,000 | 8,000 | 2,000 | 4,000 |
| User I/O | 130 | 130 | 130 | 130 | 130 | 130 | 130 |
| Embedded Flash (bits) | 193,536 | 193,536 | 193,536 | 193,536 | 387,072 | 96,768 | 193,536 |
| Speed Grade | SC | SC | E144 | E144 | SC | SC | A |
| Operating Temperature | -40C to +100C (I-grade) | -40C to +125C (A-grade) | -40C to +100C (I-grade) | -40C to +125C (A-grade) | -40C to +100C (I-grade) | -40C to +125C (A-grade) | -40C to +100C (I-grade) |
| On-die Flash / Dual-config | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Approx. Unit Price (qty 1, USD) | 13.58 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- On-die flash configuration eliminates external boot PROM (vs Cyclone IV (EP4CE6/EP4CE10))
- Integrated 12-bit ADC blocks (vs Cyclone V (5CEBA4))
- Dual-configuration flash images (vs MAX V CPLD (5M240ZE64))
- Higher logic capacity on the same U169 footprint (vs 10M02SCU169A7G)
Design Notes
The 169-UBGA package uses a 0.65 mm or 0.8 mm ball pitch (verify against the device-specific addendum). Use microvia HDI PCB technology with via-in-pad for fanout, and follow Intel's recommended PCB footprint and solder paste stencil from the package specification. Decoupling: place 0.1 uF and 10 uF ceramics close to each power ball group, and provide a solid ground plane under the package to reduce inductance.
Estimated: The MAX 10 family supports dual-configuration images, but the factory default may not match your application. Confirm the CFG pin strapping (MSEL, POR, nCONFIG) matches the desired configuration mode in the MAX 10 pin connection guidelines before layout finalization. Forgetting to strap nCONFIG high or leaving nSTATUS floating is a common cause of first-board boot failure.
Estimate: At typical MAX 10 static current (~25 mA core) plus user-defined toggle activity, total power dissipation usually stays well under 1 W, and no heatsink is required. Forced air cooling is unnecessary in sealed industrial enclosures at industrial temperatures. Always simulate thermal behavior in the Quartus Prime PowerPlay analyzer before committing to a sealed enclosure design.
Assign LVDS pairs to true differential balls; do not split LVDS across non-adjacent balls or pair them with single-ended I/O. Keep JTAG and configuration balls accessible for boundary-scan and on-board programming. Use the Quartus Prime pin planner to validate I/O placement against the device-specific addendum and run fitter checks before tape-out.
Route DDR3/LPDDR2 interfaces with matched length, impedance-controlled traces, and proper termination. For high-frequency LVDS links, maintain 100 ohm differential impedance and avoid layer transitions. Use IBIS simulation in the Quartus Prime Signal Tap / PowerPlay flow to validate signal integrity on critical nets before fabrication.
Compliance Information
RoHS compliant and lead-free 7G finish per Altera/Intel product page. The 'I' suffix denotes industrial temperature grade (not AEC-Q100); choose 10M04SCU169A7G for AEC-Q100.
