10M08DAF256C7G vs 10M04DAF256C7G Comparison
Detailed side-by-side comparison of 10M08DAF256C7G by Intel and 10M04DAF256C7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10M08DAF256C7G | 10M04DAF256C7G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $7.95 | $9.45 |
| Family | MAX 10 | MAX 10 FPGA |
| Logic Elements (LE) | 8,000 | 4,000 |
| Embedded Memory (M9K blocks) | 46 (378 Kbits) | — |
| User Flash Memory | 387,072 bits (approx. 48 KB) | 193,536 bits |
| Maximum User I/O | 178 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Operating Temperature | 0 °C to +85 °C (Commercial, "C" grade) | — |
| Package | 256-pin LBGA (F256) | 256-LBGA (F256) FineLine BGA, 17 mm x 17 mm |
| Package Dimensions | 17 mm × 17 mm, 1.0 mm ball pitch | — |
| On-chip ADC | 12-bit, 1 MSPS, 1 channel | — |
| PLLs | 2 | — |
| 18 × 18 Multipliers | 24 | — |
| Configuration | Dual-configuration internal flash (D-series) | — |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| RoHS Status | Compliant (Pb-free "G" suffix) | Compliant |
| Process Technology | [DATA_NEEDED: process node, typically 55 nm embedded flash] | 55 nm TSMC flash-based |
| Internal Oscillator | Yes (on-chip) | — |
| Maximum User I/Os | — | 178 |
| Embedded Memory (M9K blocks total) | — | 176 Kbits |
| Configuration Flash (on-die) | — | 1,178 Kbits (CFM0 + CFM1 dual-config) |
| Temperature Grade (junction) | — | 0C to 100C (commercial) |
| Auxiliary Voltage | — | 2.5 V / 3.3 V |
| ADC | — | 1 x 12-bit, 1 Msps SAR |
| PLL | — | 1 (general-purpose) |
| LVDS Transmitter (max data rate) | — | 800 Mbps |
| MSL Level | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | Yes |