10M08DAF256C7G vs 10M04DAF256C7G Comparación
Comparación detallada lado a lado de 10M08DAF256C7G por Intel y 10M04DAF256C7G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M08DAF256C7G | 10M04DAF256C7G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $7,95 | $9,45 |
| Family | MAX 10 | MAX 10 FPGA |
| Logic Elements (LE) | 8,000 | 4,000 |
| Embedded Memory (M9K blocks) | 46 (378 Kbits) | — |
| User Flash Memory | 387,072 bits (approx. 48 KB) | 193,536 bits |
| Maximum User I/O | 178 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Temperatura de funcionamiento | 0 °C to +85 °C (Commercial, "C" grade) | — |
| Encapsulado | 256-pin LBGA (F256) | 256-LBGA (F256) FineLine BGA, 17 mm x 17 mm |
| Package Dimensions | 17 mm × 17 mm, 1.0 mm ball pitch | — |
| On-chip ADC | 12-bit, 1 MSPS, 1 channel | — |
| PLLs | 2 | — |
| 18 × 18 Multipliers | 24 | — |
| Configuration | Dual-configuration internal flash (D-series) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | Compliant (Pb-free "G" suffix) | Compliant |
| Process Technology | [DATA_NEEDED: process node, typically 55 nm embedded flash] | 55 nm TSMC flash-based |
| Internal Oscillator | Yes (on-chip) | — |
| Maximum User I/Os | — | 178 |
| Embedded Memory (M9K blocks total) | — | 176 Kbits |
| Configuration Flash (on-die) | — | 1,178 Kbits (CFM0 + CFM1 dual-config) |
| Temperature Grade (junction) | — | 0C to 100C (commercial) |
| Auxiliary Voltage | — | 2.5 V / 3.3 V |
| ADC | — | 1 x 12-bit, 1 Msps SAR |
| PLL | — | 1 (general-purpose) |
| LVDS Transmitter (max data rate) | — | 800 Mbps |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | Yes |