10M08DCF256C8G vs 10M08DCF256I7G Comparison

Detailed side-by-side comparison of 10M08DCF256C8G by Intel and 10M08DCF256I7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10M08DCF256C8G 10M08DCF256I7G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $2.28 $12.20
Series MAX 10 MAX 10
Logic Elements 8,000 —
Embedded Memory (bits) 387,072 (378 Kbits user flash + block SRAM) 387,072
User I/O Count 178 178
Package 256-LBGA (F256, FineLine BGA) 256-FBGA (FineLine BGA)
Pitch 1.0 mm —
Speed Grade C8 (commercial, slowest speed bin) —
Core Voltage (VCCINT) 1.2 V —
I/O Bank Voltage (VCCIO) 1.2 V to 3.3 V (per bank) —
Configuration Internal flash (instant-on, non-volatile) —
ADC Dual 12-bit SAR, up to 17 analog inputs —
18x18 Multipliers 8 —
PLLs 2 —
Global Clock Networks 4 —
Process Technology TSMC 55 nm embedded flash CMOS 55 nm NOR-flash-backed CMOS
Operating Temperature 0C to +85C (commercial) -40C to +100C (Industrial)
Design Software Intel Quartus Prime (Lite / Standard / Pro) —
Mounting Type Surface Mount (BGA) Surface Mount
RoHS Status Compliant Compliant
MSL Level 3 (168 hours) —
Family — MAX 10 FPGA
Logic Elements (LE) — 8,000
DSP Blocks (18x18) — [DATA_NEEDED: 18x18 multiplier count]
Supply Voltage - Core — [DATA_NEEDED: core voltage range]
Supply Voltage - I/O Banks — 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent)
Configuration Memory — On-chip dual-configuration flash (non-volatile)
On-die ADC — 12-bit, up to 1 MSa/s
External Memory Interface — LPDDR2 / DDR3 / DDR3L
Lead-Free — Yes

Datasheets & Resources

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