10M08DCF256C8G - MAX 10 FPGA, 8K LE, 256-LBGA | Intel / Altera
MPN: 10M08DCF256C8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.07 | $4.07 |
| 10 | $3.66 | $36.60 |
| 100 | $3.25 | $325.00 |
| 500 | $2.86 | $1,430.00 |
| 1,000 | $2.55 | $2,550.00 |
| 3,000 | $2.28 | $6,840.00 |
Drop-in alternatives for 10M08DCF256C8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M08DCF256A7G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$15.2 / Unit
View Datasheet →10M08DCF256I7G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$12.2 / Unit
View Datasheet →10M08DAF256C8G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$15.4 / Unit
View Datasheet →10M08DAF256C7G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$7.95 / Unit
View Datasheet →10M08DAF256A7G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$18.95 / Unit
View Datasheet →10M08DCF256C8G Maximum Ratings & Electrical Characteristics
| Series | MAX 10 |
| Logic Elements | 8,000 |
| Embedded Memory (bits) | 387,072 (378 Kbits user flash + block SRAM) |
| User I/O Count | 178 |
| Package | 256-LBGA (F256, FineLine BGA) |
| Pitch | 1.0 mm |
| Speed Grade | C8 (commercial, slowest speed bin) |
| Core Voltage (VCCINT) | 1.2 V |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) |
| Configuration | Internal flash (instant-on, non-volatile) |
| ADC | Dual 12-bit SAR, up to 17 analog inputs |
| 18x18 Multipliers | 8 |
| PLLs | 2 |
| Global Clock Networks | 4 |
| Process Technology | TSMC 55 nm embedded flash CMOS |
| Operating Temperature | 0C to +85C (commercial) |
| Design Software | Intel Quartus Prime (Lite / Standard / Pro) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| MSL Level | 3 (168 hours) |
10M08DCF256C8G 256-lbga (f256, fineline bga) Pin Configuration Guide
Complete pinout information for 10M08DCF256C8G (256-lbga (f256, fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M08DCF256C8G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M08DCF256C8G is suitable for 6 applications: Industrial Motor and Motion Control, Factory Automation I/O Expansion, Video Bridging and Display Controllers, Protocol Bridging (UART/SPI/I2C to Ethernet), Portable Test and Measurement, IoT Edge Sensor Nodes.
Industrial Motor and Motion Control
The 10M08DCF256C8G fits industrial motor and motion control systems because its 8,000 logic elements and 8 dedicated 18x18 multipliers deliver the throughput needed for closed-loop current control and resolver-to-digital conversion while the on-chip 12-bit ADC samples motor phase currents synchronously to the PWM. At 178 user I/Os the device accepts multiple encoder inputs, limit switches, and gate-drive enable lines without external I/O expanders, and the LVDS-capable banks reduce wiring complexity for high-speed feedback. The integrated flash eliminates external boot memory, which lowers PCB area and BOM cost in space-constrained servo-drive enclosures.
Recommended
Factory Automation I/O Expansion
In factory automation backplanes, the 10M08DCF256C8G acts as a smart I/O aggregator that converts legacy fieldbus signals (24 V digital, 0-10 V analog, RS-485) into industrial Ethernet frames. The 8K LE budget accommodates soft-core Modbus TCP and EtherNet/IP stacks alongside deterministic glue logic, while the 387 Kbits of embedded memory buffer packet bursts during network congestion. Its dual-bank I/O supports both 3.3 V logic and 5 V-tolerant peripherals via resistor dividers, removing the need for level shifters on the backplane.
Recommended
Video Bridging and Display Controllers
For video bridging between MIPI, LVDS, RGB, and HDMI sources, the 10M08DCF256C8G delivers the LVDS I/O bandwidth and 8 hardware multipliers required for color-space conversion and limited scaler functions. Designers typically instantiate a soft MIPI D-PHY receive bridge and route the recovered pixels through the FPGA to an LVDS display output. The 378 Kbits of user flash stores gamma tables and EDID data on power-up, removing the need for an external EEPROM. The 178 user I/Os comfortably absorb parallel RGB888 plus control signals.
Recommended
Protocol Bridging (UART/SPI/I2C to Ethernet)
The 10M08DCF256C8G is well matched to compact protocol bridges that translate between legacy microcontroller buses and 10/100 Ethernet. Its 8K logic elements host a soft MAC, a lightweight TCP/IP stack, and several UART/SPI/I2C slave controllers concurrently, while the dual 12-bit ADC monitors the supply rail for PoE detection. Designers can use the on-chip user flash to store MAC addresses, certificates, and configuration web pages, eliminating external EEPROM and reducing BOM. The F256 BGA footprint keeps the bridge module under 25 mm square.
Recommended
Portable Test and Measurement
Portable test instruments use the 10M08DCF256C8G to implement waveform synthesis, signal conditioning, and user-interface glue logic in a single chip. The integrated 12-bit ADC at 1 MSPS captures analog signals directly, while the FPGA fabric generates arbitrary stimulus patterns and runs statistical analysis in hardware. Non-volatile flash configuration means the instrument boots to a known state instantly, which is critical for field calibration workflows. The commercial C8 grade keeps unit cost low for high-volume product SKUs.
Recommended
IoT Edge Sensor Nodes
In battery-friendly IoT edge nodes the 10M08DCF256C8G performs sensor fusion, anomaly detection, and low-power wake-up logic before forwarding data to a host MCU. The MAX 10's instant-on flash configuration allows the device to wake from a deep-sleep host, gather a burst of samples, run on-FPGA inference, and return results in under 10 ms - significantly reducing radio-on time. Its dual I/O banks handle both 1.8 V sensors and 3.3 V radios on the same board, and the ADC can monitor battery voltage directly without a separate fuel gauge IC.
Recommended
Recommended Products Summary
Engineering reference data for 10M08DCF256C8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M08DCF256A7G | 10M08DCF256I7G | 10M08DAF256C8G | 10M08DAF256C7G | 10M08DAF256A7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-LBGA (F256) | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same |
| Logic Elements | 8,000 | 8,000 | 8,000 | 8,000 | 8,000 | 8,000 |
| Embedded Memory (bits) | 387,072 | 387,072 | 387,072 | 387,072 | 387,072 | 387,072 |
| User I/O | 178 | 178 | 178 | 178 | 178 | 178 |
| Speed Grade | C8 (slowest commercial) | A7 (fastest) | I7 (industrial) | C8 (commercial, A-variant) | C7 (A-variant, faster) | A7 (A-variant, fastest) |
| Temperature Grade | 0C to +85C (commercial) | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C |
| ADC | Dual 12-bit SAR | Dual 12-bit SAR | Dual 12-bit SAR | Enhanced 12-bit ADC (A-variant) | Enhanced 12-bit ADC (A-variant) | Enhanced 12-bit ADC (A-variant) |
| Typical Unit Price (qty 100) | $3.25 | $3.90 - $4.20 | $4.40 - $4.80 | $5.10 - $5.60 | $5.20 - $5.70 | $5.60 - $6.10 |
Key Differentiators
- Instant-on non-volatile configuration without external boot memory (vs Lattice iCE40HX1K-VQ100)
- Higher logic density in the same BGA footprint (vs 10M04DCF256C8G)
- Integrated dual 12-bit ADC with up to 17 analog inputs (vs Xilinx Spartan-6 LX9)
Design Notes
Estimated: the F256 BGA at 1.0 mm pitch requires a 4-layer PCB stack-up with microvias (laser-drilled, 0.1 mm diameter) or via-in-pad for the inner rows. Route all signals on the top layer through microvias to inner layers; keep the BGA escape region clear of any plane cuts. Intel's MAX 10 hardware reference design provides a recommended footprint with non-solder-mask-defined (NSMD) pads of 0.45 mm diameter. Reflow profile must follow JEDEC J-STD-020 for MSL-3 packages, with peak temperature no higher than 245C.
The MAX 10 requires separate VCCINT (1.2 V core), VCCA (2.5 V analog supply for the ADC), and per-bank VCCIO rails. Decouple every VCCINT pin with a 0.1 uF X7R ceramic placed within 5 mm of the ball, plus one 10 uF bulk capacitor per rail. VCCA must be filtered with a ferrite bead and 10 uF + 0.1 uF to keep ADC noise below 1 LSB. VCCPD (1.2 V) and VCCBAT (battery backup for the security key) also require dedicated decoupling; consult the MAX 10 pin connection guidelines for the exact pin list on the F256 package.
Do not leave the JTAG TCK pin floating - it will pick up noise and cause spurious configuration attempts. Tie TCK to GND through a 1 kohm pull-down or to VCCIO through a 4.7 kohm pull-up, depending on your JTAG chain topology. Similarly, the nCONFIG and nSTATUS pins require 4.7 kohm pull-ups to VCCIO. Designers frequently forget to enable the CONFIG_IO pull-ups in the Quartus device options, which causes intermittent configuration failures on power-up. Always generate and review the .pin file before board tape-out.
Compliance Information
RoHS and REACH compliance per Intel MAX 10 product declaration. Not AEC-Q100 qualified - the part is intended for industrial and consumer applications; AEC-Q100 variants are not offered in the MAX 10 family.
