10M08SCU169I7G vs 10M04SCU169I7G Comparison

Detailed side-by-side comparison of 10M08SCU169I7G by Intel and 10M04SCU169I7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
10M08SCU169I7G 10M08SCU169I7G - MAX 10 FPGA 8K LE 169-UBGA | Intel

10M08SCU169I7G - MAX 10 FPGA 8K LE 169-UBGA | Intel

10M08SCU169I7G ✓ Active

Specification Comparison

Parameter 10M08SCU169I7G 10M04SCU169I7G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $9.85 $9.95
Family MAX 10 MAX 10
Logic Elements (LE) 8,000 4,000
Embedded Memory (M9K blocks) [DATA_NEEDED: M9K count and total bits] —
Embedded User Flash 387,072 bits (48 KB) —
User I/O Count 130 —
Maximum User I/O (package) 130 (U169) —
Core Voltage (VCCINT) 1.2 V —
Process Technology TSMC 55 nm embedded flash —
Configuration Memory Internal flash (non-volatile, dual-boot) —
Package 169-ball UFBGA / UBGA (U169), 11 mm x 11 mm, 0.65 mm pitch 169-ball UBGA (U169)
Operating Temperature -40 C to +100 C (industrial, suffix I7G) -40C to +100C (Industrial)
PLL Count [DATA_NEEDED: number of PLLs] —
Global Clock Networks [DATA_NEEDED: global clock count] —
DSP Blocks (18x18 multipliers) [DATA_NEEDED: multiplier count] —
ADC 12-bit, 1 MSPS, 4 channels (single supply variant) —
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
Lead-Free / RoHS Yes / Compliant —
MSL Level 3 (per JEDEC J-STD-020) —
Configuration Method JTAG, internal flash, dual-boot On-die flash (non-volatile, instant-on)
Supported I/O Standards LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI —
Embedded User Flash Memory — 193,536 bits (approx. 24 KB)
Embedded SRAM (M9K blocks) — 270 Kbits
Maximum User I/O — 130
Speed Grade — SC
Core Voltage — 1.2 V
Lead-Free Finish — 7G (lead-free)
Process Node — 55 nm embedded-flash CMOS
On-die ADC — Up to 2 x 12-bit blocks
RoHS Status — Compliant

Datasheets & Resources

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