10M16DAU324C8G vs 10M16DAU324I7P Comparison
Detailed side-by-side comparison of 10M16DAU324C8G by Intel and 10M16DAU324I7P by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10M16DAU324C8G | 10M16DAU324I7P |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $35.40 | $51.20 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 16,000 | — |
| Embedded Memory Bits | 562,176 | — |
| User Flash Memory (UFM) | [DATA_NEEDED: UFM size in Kb] | — |
| Maximum User I/O | 246 | — |
| Package | 324-UBGA (Ultra FineLine BGA) | 324-LFBGA (UBGA-324) |
| Core Supply Voltage | 1.2 V (on-chip regulator) | — |
| Process Technology | TSMC 55 nm CMOS (non-volatile) | — |
| Configuration Memory | Internal flash, dual-boot capable | — |
| Embedded ADC | 12-bit SAR ADC | — |
| Multipliers (18x18) | [DATA_NEEDED: multiplier count] | — |
| PLLs | [DATA_NEEDED: PLL count] | — |
| LVDS Performance | Up to 1.6 Gbps per pair | — |
| Memory Interface Support | DDR3, DDR2, LPDDR2 (hardened PHY) | — |
| Operating Temperature | Commercial (0C to +85C) - speed grade 8 | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| MSL Level | 3 (per JEDEC J-STD-020) | — |
| RoHS Status | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / [DATA_NEEDED] | — |
| Logic Elements | — | 16000 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| User I/O Count | — | 246 |
| Embedded Memory | — | 549 kbit |
| Embedded Multipliers (18x18) | — | 246 |
| User Flash Memory | — | [DATA_NEEDED: user flash size] |
| Operating Supply Voltage (Core) | — | 1.2 V |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +100 C |
| Speed Grade | — | 7 |
| Temperature Grade | — | Industrial (I) |