10M16DAU324C8G - MAX 10 FPGA 16K LE 246 I/O UBGA-324 | Intel / Altera
MPN: 10M16DAU324C8G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $47.91 | $47.91 |
| 10 | $44.8 | $448.00 |
| 100 | $41.2 | $4,120.00 |
| 500 | $38.5 | $19,250.00 |
| 1,000 | $35.4 | $35,400.00 |
Drop-in alternatives for 10M16DAU324C8G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
10M16DAU324I7G
β Drop-Inπ Reference alternative (not in catalog)
10M25DAU324C8G
β Drop-Inπ Reference alternative (not in catalog)
10M08DAU324C8G
β Drop-Inβ In Stock
$11.4 / Unit
View Datasheet β10M16DCU324I6G
β Drop-Inπ Reference alternative (not in catalog)
10M16SAU324I7G
β Drop-Inβ In Stock
$32.4 / Unit
View Datasheet β10M40DAU324C8G
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
10M50DAU324C8G
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
10M16DAU324C8G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 16,000 |
| Embedded Memory Bits | 562,176 |
| Maximum User I/O | 246 |
| Package | 324-UBGA (Ultra FineLine BGA) |
| Core Supply Voltage | 1.2 V (on-chip regulator) |
| Process Technology | TSMC 55 nm CMOS (non-volatile) |
| Configuration Memory | Internal flash, dual-boot capable |
| Embedded ADC | 12-bit SAR ADC |
| LVDS Performance | Up to 1.6 Gbps per pair |
| Memory Interface Support | DDR3, DDR2, LPDDR2 (hardened PHY) |
| Operating Temperature | Commercial (0C to +85C) - speed grade 8 |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
10M16DAU324C8G Pin Configuration
| Pin A1 | IO β General-purpose user I/O pin (bank 1A) |
| Pin A2 | VCCIO1A β I/O supply voltage for bank 1A |
| Pin B1 | IO β General-purpose user I/O pin (bank 1A) |
| Pin B2 | GND β Ground reference for bank 1A |
| Pin C1 | IO β General-purpose user I/O pin (bank 1B) |
| Pin C2 | VCCIO1B β I/O supply voltage for bank 1B |
| Pin D1 | IO β General-purpose user I/O pin (bank 2) |
| Pin D2 | GND β Ground reference for bank 2 |
| Pin E1 | IO β General-purpose user I/O pin (bank 2) |
| Pin E2 | VCCIO2 β I/O supply voltage for bank 2 |
| Pin F1 | IO β General-purpose user I/O pin (bank 3) |
| Pin F2 | GND β Ground reference for bank 3 |
| Pin G1 | IO β General-purpose user I/O pin (bank 3) |
| Pin G2 | VCCIO3 β I/O supply voltage for bank 3 |
| Pin H1 | IO β General-purpose user I/O pin (bank 4) |
| Pin H2 | GND β Ground reference for bank 4 |
| Pin J1 | IO β General-purpose user I/O pin (bank 4) |
| Pin J2 | VCCIO4 β I/O supply voltage for bank 4 |
| Pin K1 | IO β General-purpose user I/O pin (bank 5) |
| Pin K2 | GND β Ground reference for bank 5 |
| Pin L1 | IO β General-purpose user I/O pin (bank 5) |
| Pin L2 | VCCIO5 β I/O supply voltage for bank 5 |
| Pin M1 | IO β General-purpose user I/O pin (bank 6) |
| Pin M2 | GND β Ground reference for bank 6 |
| Pin N1 | IO β General-purpose user I/O pin (bank 6) |
| Pin N2 | VCCIO6 β I/O supply voltage for bank 6 |
| Pin P1 | IO β General-purpose user I/O pin (bank 7) |
| Pin P2 | GND β Ground reference for bank 7 |
| Pin R1 | IO β General-purpose user I/O pin (bank 7) |
| Pin R2 | VCCIO7 β I/O supply voltage for bank 7 |
| Pin T1 | IO β General-purpose user I/O pin (bank 8) |
| Pin T2 | GND β Ground reference for bank 8 |
| Pin U1 | VCCIO8 β I/O supply voltage for bank 8 |
| Pin U2 | VCC β Core 1.2 V supply (on-chip regulated) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M16DAU324C8G is suitable for 7 applications: Industrial Motor Control and BLDC Drive, Sensor Fusion and Industrial IoT Gateway, Video Interface Bridging and Display Aggregation, USB Type-C and High-Speed I/O Expansion, Low-Cost ASIC Prototyping and FPGA Mezzanine Card, Power Supply Sequencing and Digital Point-of-Load Control, Automotive Driver Assistance and HIL Test Equipment.
Industrial Motor Control and BLDC Drive
The 10M16DAU324C8G fits industrial motor control and BLDC / PMSM drive designs because its 16K logic elements, 18x18 multipliers, and integrated 12-bit SAR ADC handle trapezoidal and field-oriented control (FOC) algorithms in a single chip. Its on-die temperature-sensing diode enables drive-stage thermal monitoring, while the 1.2 V core with on-chip regulator simplifies 24V industrial bus designs. Used between the MCU and the IGBT/MOSFET gate driver, it generates the commutation PWM and processes back-EMF feedback from current-sense amplifiers in real time.
Recommended
Sensor Fusion and Industrial IoT Gateway
The 10M16DAU324C8G serves as the programmable sensor-fusion front-end in Industrial IoT gateways, where 16K LEs are enough to implement multi-protocol bridging (RS-485, CAN, Modbus) and pre-processing for accelerometer, gyroscope, and pressure sensors. Its dual-boot internal flash supports secure field firmware updates, and the 246 user I/O enable direct connection to multiple sensor buses without external muxing. Placed between the sensor array and the host SoC, it reduces host CPU interrupt load while preserving raw data for edge analytics.
Recommended
Video Interface Bridging and Display Aggregation
The 10M16DAU324C8G bridges legacy parallel RGB / LVDS display interfaces to modern MIPI-DSI or eDP panels in industrial HMIs and digital signage, using its hardened DDR3 memory controller for line-buffer frame storage and 1.6 Gbps LVDS performance for high-speed pixel links. The 562 Kb of embedded memory supports small frame buffering without external SDRAM, reducing BOM cost. Designers typically place it between the video source SoC and the panel, performing color-space conversion and timing regeneration in the fabric.
Recommended
USB Type-C and High-Speed I/O Expansion
The 10M16DAU324C8G enables USB Type-C, USB 3.0, and high-speed I/O expansion in industrial PCs and embedded systems, where 16K LEs implement USB Type-C port controllers, PD negotiation logic, and downstream port multiplexing. The MAX 10 device's dual-boot flash supports in-field PD firmware updates to track the evolving USB-PD specification. Its 246 I/O provide ample pin budget for multi-port hubs without external mux ICs, reducing board area and BOM cost in industrial PC designs.
Recommended
Low-Cost ASIC Prototyping and FPGA Mezzanine Card
The 10M16DAU324C8G is well-suited as a low-cost ASIC prototyping and FPGA mezzanine card (FMC) carrier for low-to-mid complexity ASIC verification, where 16K LEs emulate sub-modules before tape-out and the integrated ADC samples analog test points in real time. Its 324-UBGA footprint fits standard industrial SBC carrier boards, and the Quartus Prime toolchain supports incremental compile for fast iteration. Used in bring-up labs, it provides a low-NRE path to verify register-transfer-level (RTL) functionality before committing to mask costs.
Recommended
Power Supply Sequencing and Digital Point-of-Load Control
The 10M16DAU324C8G implements digital point-of-load (PoL) control and multi-rail power supply sequencing for telecom, server, and industrial systems, using its 16K LEs to run PID compensation loops in the fabric and its hardened ADC to sample output voltage and current telemetry. Dual-boot flash stores multiple golden firmware images for safe field updates without bricking the power system. Placed between the analog controller and the supervisor, it adds telemetry, fault logging, and adaptive voltage scaling (AVS) interfaces without disturbing the analog control loop.
Recommended
Automotive Driver Assistance and HIL Test Equipment
The 10M16DAU324C8G is used in hardware-in-the-loop (HIL) test equipment and industrial driver-assistance subsystems where 16K LEs emulate sensor interfaces (CAN, LIN, Ethernet) and run protocol decoders in parallel. The integrated SAR ADC samples analog sensor channels for fault injection in test rigs, while the dual-configuration flash enables safe remote firmware rollback. Designers integrate it into test fixtures that simulate automotive ECUs in development, providing deterministic, repeatable stimulus generation at a fraction of the cost of full automotive-qualified parts.
Recommended
Recommended Products Summary
Engineering reference data for 10M16DAU324C8G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M16DAU324I7G | 10M25DAU324C8G | 10M08DAU324C8G | 10M16DCU324I6G | 10M16SAU324I7G |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 324-UBGA (U324) | 324-UBGA (U324) - same | 324-UBGA (U324) - same | 324-UBGA (U324) - same | 324-UBGA (U324) - same | 324-UBGA (U324) - same |
| Logic Elements | 16,000 | 16,000 | 25,000 | 8,000 | 16,000 | 16,000 |
| Embedded Memory (bits) | 562,176 | 562,176 | 819,200 | 387,072 | 562,176 | 562,176 |
| Configuration Flash | Dual (DA) | Dual (DA) | Dual (DA) | Dual (DA) | Dual (DC) | Single (SA) |
| Speed Grade | 8 | 7 | 8 | 8 | 6 | 7 |
| Temperature Grade | Commercial (0C to 85C) | Industrial (-40C to 100C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Industrial (-40C to 100C) | Industrial (-40C to 100C) |
| Embedded ADC | 12-bit SAR | 12-bit SAR | 12-bit SAR | 12-bit SAR | 12-bit SAR | 12-bit SAR |
| Approx. Unit Price (USD, qty-1) | 47.91 | Higher (industrial temp) | Higher (25K LEs) | Lower (8K LEs) | Similar | Similar |
Key Differentiators
- 16K LE mid-density option in the largest MAX 10 package (vs 10M08DAU324C8G (8K LE))
- Dual-configuration internal flash with field firmware rollback (vs 10M16SAU324I7G (single-config))
- Integrated 12-bit SAR ADC with on-die temperature sensor (vs 10CL055YU484C8G (Cyclone IV))
- Hardened DDR3 memory controller in the fabric (vs 10M40DAU324C8G (higher density but same package))
Design Notes
The 324-UBGA package has a 1.0 mm ball pitch requiring 0.5 mm via-pad antipads and microvia stack-up (laser-drilled, 0.1 mm capture pad). Route signals on outer layers with 0.1 mm trace and space; inner layers need via-in-pad plating for clean breakout. Use 8-layer stack-up with 2 dedicated ground planes adjacent to the BGA row for return-path integrity and to control impedance for DDR3 interfaces routed from the dedicated DQS pins.
The MAX 10 device uses an internal linear regulator to derive the 1.2 V core from a 2.5 V or 3.3 V VCCINT supply - connect VCCINT to a clean 2.5 V rail decoupled with at least 10 uF bulk and 100 nF high-frequency ceramic per supply pin. Each VCCIO bank requires its own 1.2/1.5/1.8/2.5/3.3 V rail matching the I/O standard; group banks with shared voltage to minimize LDO count. Keep the VCCA supply (analog PLL/ADC) quiet and isolated from noisy digital rails.
Estimated: at full fabric utilization (~85% LEs toggling at 100 MHz with all 246 I/O active), the 10M16DAU324C8G dissipates approximately 0.6-0.9 W - within the commercial-grade UBGA-324 thermal envelope without an external heatsink. For industrial environments above 70C ambient or with sustained high toggle rates, add a thermal copper land under the center BGA balls (per Quartus thermal guidelines) and 4 thermal vias to an internal ground plane to reduce theta_JA below 25 C/W.
Do not route the JTAG pins (TCK/TMS/TDO/TDI) near switching I/O or clock signals - noise on JTAG can cause configuration failures. Always pull TMS high through a 10 kohm resistor and TCK low through 10 kohm for proper Quartus programmer behavior. Verify CONFIG_MODE pin settings against the boot mode you intend (dual-boot vs single) before PCB fabrication, as these pins are sampled at power-up and cannot be changed without a hardware revision.
For LVDS operation up to 1.6 Gbps per pair, match trace lengths within 5 mils of differential pairs and keep 100 ohm differential impedance on the outer layers with continuous reference ground plane. The MAX 10 LVDS serializer/deserializer (SERDES) is implemented in the fabric using soft IP - allocate dedicated clock pins (CLK[0:3]) to drive the SERDES reference clock for best jitter performance. Use IBIS models from Intel to simulate channel loss before PCB sign-off.
Compliance Information
RoHS compliance per Intel / Altera MAX 10 product page. Commercial temperature grade (speed grade 8). AEC-Q100 not applicable for this commercial-grade variant - choose an automotive MAX 10 variant for vehicle applications. Lead-free per JEDEC J-STD-020 MSL-3 packaging.
