10M16DAU324C8G vs 10M16DAU324I7P Vergleich
Detaillierter Direktvergleich von 10M16DAU324C8G von Intel und 10M16DAU324I7P von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M16DAU324C8G | 10M16DAU324I7P |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $35,40 | $51,20 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 16,000 | — |
| Embedded Memory Bits | 562,176 | — |
| User Flash Memory (UFM) | [DATA_NEEDED: UFM size in Kb] | — |
| Maximum User I/O | 246 | — |
| Gehäuse | 324-UBGA (Ultra FineLine BGA) | 324-LFBGA (UBGA-324) |
| Core Supply Voltage | 1.2 V (on-chip regulator) | — |
| Process Technology | TSMC 55 nm CMOS (non-volatile) | — |
| Configuration Memory | Internal flash, dual-boot capable | — |
| Embedded ADC | 12-bit SAR ADC | — |
| Multipliers (18x18) | [DATA_NEEDED: multiplier count] | — |
| PLLs | [DATA_NEEDED: PLL count] | — |
| LVDS Performance | Up to 1.6 Gbps per pair | — |
| Memory Interface Support | DDR3, DDR2, LPDDR2 (hardened PHY) | — |
| Betriebstemperatur | Commercial (0C to +85C) - speed grade 8 | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | 3 (per JEDEC J-STD-020) | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / [DATA_NEEDED] | — |
| Logic Elements | — | 16000 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| User I/O Count | — | 246 |
| Embedded Memory | — | 549 kbit |
| Embedded Multipliers (18x18) | — | 246 |
| User Flash Memory | — | [DATA_NEEDED: user flash size] |
| Operating Supply Voltage (Core) | — | 1.2 V |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +100 C |
| Speed Grade | — | 7 |
| Temperature Grade | — | Industrial (I) |