10M16DCF256C7G vs 10M08DAF256C7G Comparison
Detailed side-by-side comparison of 10M16DCF256C7G by Intel and 10M08DAF256C7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10M16DCF256C7G | 10M08DAF256C7G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $11.75 | $7.95 |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 16,000 | — |
| Adaptive Logic Modules (ALMs) | 10,000 | — |
| Embedded Memory (M9K blocks) | 378 Kbits / 42 blocks | 46 (378 Kbits) |
| Total Embedded Memory Bits | 562,176 bits | — |
| Embedded 18x18 Multipliers | 45 | — |
| Maximum User I/Os | 178 | — |
| General-Purpose PLLs | 4 | — |
| Analog Front-End Blocks (ADC) | 2 (12-bit, 1 MSPS) | — |
| Configuration Flash | Dual-configuration, internal | — |
| Package | 256-FBGA (F256), 17 x 17 mm, 1.0 mm pitch | 256-pin LBGA (F256) |
| Mounting Type | Surface Mount | Surface Mount |
| Core Voltage | 1.2 V | 1.2 V |
| Auxiliary / I/O Voltages | 1.2 V to 3.3 V | — |
| Operating Temperature (Commercial) | 0C to +85C (C7G suffix) | — |
| Process Technology | TSMC 55 nm embedded flash | [DATA_NEEDED: process node, typically 55 nm embedded flash] |
| RoHS Status | Compliant | Compliant (Pb-free "G" suffix) |
| Logic Elements (LE) | — | 8,000 |
| User Flash Memory | — | 387,072 bits (approx. 48 KB) |
| Maximum User I/O | — | 178 |
| Operating Temperature | — | 0 °C to +85 °C (Commercial, "C" grade) |
| Package Dimensions | — | 17 mm × 17 mm, 1.0 mm ball pitch |
| On-chip ADC | — | 12-bit, 1 MSPS, 1 channel |
| PLLs | — | 2 |
| 18 × 18 Multipliers | — | 24 |
| Configuration | — | Dual-configuration internal flash (D-series) |
| Internal Oscillator | — | Yes (on-chip) |