10M16DCF256C7G - MAX 10 FPGA, 16K LE, 256-FBGA | Intel
MPN: 10M16DCF256C7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.02 | $18.02 |
| 10 | $16.4 | $164.00 |
| 100 | $14.55 | $1,455.00 |
| 500 | $13.1 | $6,550.00 |
| 1,000 | $11.75 | $11,750.00 |
Drop-in alternatives for 10M16DCF256C7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10M16DCF256A7G
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View Datasheet →10M16DCF256I7G
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View Datasheet →10M16DAF256C7G
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View Datasheet →10M08DCF256C7G
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10M08DCF256C8G
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View Datasheet →10M08DAF256C7G
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View Datasheet →10M16DCF256C7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements | 16,000 |
| Adaptive Logic Modules (ALMs) | 10,000 |
| Embedded Memory (M9K blocks) | 378 Kbits / 42 blocks |
| Total Embedded Memory Bits | 562,176 bits |
| Embedded 18x18 Multipliers | 45 |
| Maximum User I/Os | 178 |
| General-Purpose PLLs | 4 |
| Analog Front-End Blocks (ADC) | 2 (12-bit, 1 MSPS) |
| Configuration Flash | Dual-configuration, internal |
| Package | 256-FBGA (F256), 17 x 17 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Core Voltage | 1.2 V |
| Auxiliary / I/O Voltages | 1.2 V to 3.3 V |
| Operating Temperature (Commercial) | 0C to +85C (C7G suffix) |
| Process Technology | TSMC 55 nm embedded flash |
| RoHS Status | Compliant |
10M16DCF256C7G 256-fbga (f256), 17 x 17 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for 10M16DCF256C7G (256-fbga (f256), 17 x 17 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M16DCF256C7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M16DCF256C7G is suitable for 6 applications: Industrial Motor Control, Video Bridging and Image Aggregation, I/O Expansion for Embedded Processors, Portable Medical Device Front-End, Factory Automation and Protocol Bridging, Test and Measurement Front-End.
Industrial Motor Control
The 10M16DCF256C7G is well-suited for industrial motor-control applications because it provides 45 embedded 18x18 multipliers and 16,000 logic elements, which is enough headroom for field-oriented control (FOC), space-vector PWM generation, and resolver/encoder decoding on a single chip. Its two integrated 12-bit 1 MSPS ADCs sample phase currents and bus voltage directly, eliminating an external ADC and reducing BOM cost. The 256-FBGA package gives 178 user I/Os so designers can drive multiple gate-driver stages and isolation barriers from one device. Non-volatile configuration means the drive starts in under 10 ms, which is critical for safety circuits that must reach a known state immediately after power-up.
Recommended
Video Bridging and Image Aggregation
The 10M16DCF256C7G serves well in video bridging applications where MIPI-CSI2, parallel CMOS, or LVDS streams must be aggregated and re-mapped before reaching an SoC. With 16K LEs and 562 Kbits of block RAM, the device can implement line buffers, color-space converters, and timing generators in parallel without external memory. The 178 GPIO count is sufficient to fan-in multiple camera data lanes plus control signals. Designers can configure the device once from internal flash and never need to boot from a host processor, which simplifies camera-module firmware in mass-production lines.
Recommended
I/O Expansion for Embedded Processors
Embedded processors often lack the GPIOs, PWM channels, or specialty interfaces required by industrial designs, and the 10M16DCF256C7G fills this gap as a flexible I/O expander. The MAX 10's dual-configuration flash supports in-field firmware updates over SPI or JTAG, allowing designers to add or change peripheral mappings after deployment. With four general-purpose PLLs and multi-voltage I/O banks (1.2 V to 3.3 V), the FPGA can level-shift between a 1.8 V application processor and 3.3 V legacy peripherals on the same board. The 256-FBGA package keeps board area minimal while exposing 178 user I/Os.
Recommended
Portable Medical Device Front-End
Portable medical devices such as patient monitors, pulse oximeters, and handheld ultrasound probes benefit from the 10M16DCF256C7G's on-chip 12-bit ADC and DSP multiplier count. The two integrated ADCs sample bio-signals directly, while the 45 multipliers execute FIR and FFT filters in real time without offloading to a host CPU. Instant-on from internal flash lets the device reach a known safe state within 10 ms, which is required for medical equipment with strict IEC 60601 startup behavior. The commercial 0C to +85C range suits body-worn and clinical-cart form factors.
Recommended
Factory Automation and Protocol Bridging
Factory-automation backplanes often mix legacy fieldbuses such as RS-485, CAN, and proprietary serial links with modern Industrial Ethernet. The 10M16DCF256C7G can act as a multi-protocol bridge, running UART, SPI, I2C, and parallel busses concurrently across its 178 GPIOs. Embedded 18x18 multipliers accelerate checksum and CRC computation for deterministic cycle times. Dual-configuration flash supports redundant firmware images, which is valuable for industrial safety systems that must boot even after a partial flash update.
Recommended
Test and Measurement Front-End
Test-and-measurement instruments require deterministic sampling, parallel DSP, and flexible I/O - all of which the 10M16DCF256C7G delivers. Designers can build digital trigger engines, pattern generators, and signal-conditioning logic on a single device, while the two integrated 12-bit ADCs handle analog front-end sampling. The 178 GPIOs allow direct interfacing with high-channel-count logic analyzers or oscilloscope probes. Non-volatile instant-on boot means the instrument reaches a calibrated state immediately at power-up, reducing warm-up time for production-line testers.
Recommended
Recommended Products Summary
Engineering reference data for 10M16DCF256C7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M16DCF256A7G | 10M16DAF256C7G | 10M08DCF256C7G | 10M08DCF256C8G | 10M08DAF256C7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-FBGA (F256), 17 x 17 mm, 1.0 mm pitch | 256-FBGA (F256) - same | 256-FBGA (F256) - same | 256-FBGA (F256) - same | 256-FBGA (F256) - same | 256-FBGA (F256) - same |
| Logic Elements | 16,000 | 16,000 | 16,000 | 8,000 | 8,000 | 8,000 |
| Embedded Memory | 562 Kbits (42 M9K blocks) | 562 Kbits | 562 Kbits | 378 Kbits | 378 Kbits | 378 Kbits |
| 18x18 Multipliers | 45 | 45 | 45 | 24 | 24 | 24 |
| Maximum User I/Os | 178 | 178 | 178 | 178 | 178 | 178 |
| On-chip ADC | 2 x 12-bit, 1 MSPS | 2 x 12-bit, 1 MSPS | 2 x 12-bit, 1 MSPS | 2 x 12-bit, 1 MSPS | 2 x 12-bit, 1 MSPS | 2 x 12-bit, 1 MSPS |
| Temperature Grade | Commercial 0C to +85C (C7G) | Commercial (A7G) | Commercial (C7G) | Commercial (C7G) | Commercial (C8G) | Commercial (A7G) |
| Approximate Unit Price (USD, qty-100) | 14.55 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Largest MAX 10 with on-chip ADC at 16K LEs (vs 10M08DCF256C7G)
- Non-volatile configuration eliminates external boot PROM (vs 10CL016YF484C8G)
- Integrated 12-bit ADC reduces analog BOM (vs 10M16DAF256C7G)
Design Notes
The 10M16DCF256C7G requires three independent supply rails: a 1.2 V core (VCCINT), a 2.5 V analog supply (VCCA), and a 1.2 V to 3.3 V I/O supply (VCCIO) per bank. Place a 100 nF decoupling capacitor within 2 mm of every VCC pin and bulk 10 uF ceramic capacitors at each supply plane. Inrush current during configuration can briefly exceed 200 mA, so size the 1.2 V regulator for at least 500 mA steady-state capability.
The 256-FBGA package has 1.0 mm ball pitch and a 17 x 17 mm body; route signals on inner layers using micro-via-in-pad technology if available, or escape through staggered outer-layer vias on a 4-layer board with 1 oz copper. Maintain a continuous ground plane directly under the package to provide a low-impedance return path for the 178 GPIO signals and to dissipate the 1.5 W to 2 W typical power dissipation.
A common pitfall is leaving the MSEL[2:0] pins floating - they must be tied to VCCIO or GND to select the correct configuration mode (JTAG, internal flash, or serial). Also, do not forget the CONF_DONE and nSTATUS pull-ups; they require external 10 kohm resistors to VCCIO. Failing to connect these can cause intermittent boot failures that look like silicon defects but are actually configuration-mode errors.
Compliance Information
RoHS and REACH compliance per Intel MAX 10 product declaration. The C7G suffix indicates commercial temperature grade and is not AEC-Q100 qualified; automotive users should select the -Q1 suffix variant.
