10M25DAF484A7P vs 10M25DAF484C7G Comparison

Detailed side-by-side comparison of 10M25DAF484A7P by Intel and 10M25DAF484C7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10M25DAF484A7P 10M25DAF484C7G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $54.75 $38.50
Series MAX 10 MAX 10
Logic Elements 25,000 —
Configurable Logic Blocks (CLBs) 1,563 —
Process Technology 55 nm non-volatile —
Embedded Memory 1,728 Kbits —
Maximum User I/O 360 —
Package 484-ball Plastic BGA (S-PBGA-B484) 484-BGA (F484)
Package Code BGA —
Terminal Form Ball —
Temperature Grade Automotive (-40 C to +125 C TJ) —
Speed Grade A7 —
Configuration Internal dual-boot flash (no external PROM) —
On-chip ADC 1 x 12-bit, 1 MSPS —
PLLs 2 (general-purpose) 4 general-purpose
DSP Blocks Up to 25 (18x18 MAC) —
Supply Voltage 3.3 V or 1.8 V single supply —
Mounting Type Surface Mount Surface Mount (BGA)
RoHS Status Compliant Compliant
Logic Elements (LE) — 25,000
Embedded Memory (M9K blocks) — 1,728 Kbit
Embedded 18x18 Multipliers — 66
User I/O Pins (max) — 360
On-chip Configuration Flash — Dual-configuration (instant-on, remote update)
Hard IP: ADC — 12-bit, 1 MSPS, 16-channel (MAX 10 family)
Global Clocks — 20
On-chip Temperature Sensor — Yes
Operating Temperature — 0C to +85C (commercial)
Design Tool — Intel Quartus Prime (Lite / Standard / Pro)

Datasheets & Resources

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