10M25DAF484A7P vs 10M25DAF484C7G Comparación
Comparación detallada lado a lado de 10M25DAF484A7P por Intel y 10M25DAF484C7G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M25DAF484A7P | 10M25DAF484C7G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $54,75 | $38,50 |
| Series | MAX 10 | MAX 10 |
| Logic Elements | 25,000 | — |
| Configurable Logic Blocks (CLBs) | 1,563 | — |
| Process Technology | 55 nm non-volatile | — |
| Embedded Memory | 1,728 Kbits | — |
| Maximum User I/O | 360 | — |
| Encapsulado | 484-ball Plastic BGA (S-PBGA-B484) | 484-BGA (F484) |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Temperature Grade | Automotive (-40 C to +125 C TJ) | — |
| Speed Grade | A7 | — |
| Configuration | Internal dual-boot flash (no external PROM) | — |
| On-chip ADC | 1 x 12-bit, 1 MSPS | — |
| PLLs | 2 (general-purpose) | 4 general-purpose |
| DSP Blocks | Up to 25 (18x18 MAC) | — |
| Tensión de alimentación | 3.3 V or 1.8 V single supply | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 25,000 |
| Embedded Memory (M9K blocks) | — | 1,728 Kbit |
| Embedded 18x18 Multipliers | — | 66 |
| User I/O Pins (max) | — | 360 |
| On-chip Configuration Flash | — | Dual-configuration (instant-on, remote update) |
| Hard IP: ADC | — | 12-bit, 1 MSPS, 16-channel (MAX 10 family) |
| Global Clocks | — | 20 |
| On-chip Temperature Sensor | — | Yes |
| Temperatura de funcionamiento | — | 0C to +85C (commercial) |
| Design Tool | — | Intel Quartus Prime (Lite / Standard / Pro) |