10M25DAF484C8G vs 10M16DAF484C7G Comparison
Detailed side-by-side comparison of 10M25DAF484C8G by Intel and 10M16DAF484C7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10M25DAF484C8G | 10M16DAF484C7G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $50.00 | $55.50 |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 25,000 | 16000 |
| Embedded Memory (Kbits) | 1638 | — |
| User I/O Count | 360 | — |
| Process Technology | 55 nm CMOS | 55 nm |
| Core Supply Voltage (VCCINT) | 1.2 V (1.15 V min / 1.25 V max) | — |
| Package | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch | 484-FBGA (F484), 23 mm x 23 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0 °C to 85 °C (Commercial) | 0C to 85C (commercial, -7C speed grade) |
| Speed Grade | -8 | — |
| Configuration Memory | On-chip dual-configuration flash | — |
| ADC | Integrated 12-bit ADC (where enabled) | — |
| PLLs | Yes (up to 4 analog PLLs per device) | 4 |
| RoHS Status | Compliant | Compliant |
| MSL Level | MSL3 | — |
| Number of I/O Banks | 8 (per F484 pinout) | — |
| Embedded Memory | — | 504 Kbits (10,240 x 5 RAM bits) |
| Embedded User Flash | — | 562 Kbits |
| Digital Signal Processing (DSP) Blocks | — | 16 (18x18 multipliers) |
| Maximum User I/O Pins | — | 320 |
| ADC Blocks | — | 2 (12-bit SAR) |
| Analog Inputs | — | Up to 18 single-ended |
| Core Voltage (VCCINT) | — | 1.2 V |
| Configuration | — | Non-volatile (dual-boot on-chip flash) |