10M25DAF484C8G vs 10M16DAF484C7G Vergleich
Detaillierter Direktvergleich von 10M25DAF484C8G von Intel und 10M16DAF484C7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M25DAF484C8G | 10M16DAF484C7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $50,00 | $55,50 |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 25,000 | 16000 |
| Embedded Memory (Kbits) | 1638 | — |
| User I/O Count | 360 | — |
| Process Technology | 55 nm CMOS | 55 nm |
| Core Supply Voltage (VCCINT) | 1.2 V (1.15 V min / 1.25 V max) | — |
| Gehäuse | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch | 484-FBGA (F484), 23 mm x 23 mm, 1.0 mm pitch |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | 0 °C to 85 °C (Commercial) | 0C to 85C (commercial, -7C speed grade) |
| Speed Grade | -8 | — |
| Configuration Memory | On-chip dual-configuration flash | — |
| ADC | Integrated 12-bit ADC (where enabled) | — |
| PLLs | Yes (up to 4 analog PLLs per device) | 4 |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | MSL3 | — |
| Number of I/O Banks | 8 (per F484 pinout) | — |
| Embedded Memory | — | 504 Kbits (10,240 x 5 RAM bits) |
| Embedded User Flash | — | 562 Kbits |
| Digital Signal Processing (DSP) Blocks | — | 16 (18x18 multipliers) |
| Maximum User I/O Pins | — | 320 |
| ADC Blocks | — | 2 (12-bit SAR) |
| Analog Inputs | — | Up to 18 single-ended |
| Core Voltage (VCCINT) | — | 1.2 V |
| Configuration | — | Non-volatile (dual-boot on-chip flash) |