10M25DAF484C8G vs 10M25DAF484A7P Comparison
Detailed side-by-side comparison of 10M25DAF484C8G by Intel and 10M25DAF484A7P by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10M25DAF484C8G | 10M25DAF484A7P |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $50.00 | $54.75 |
| Family | MAX 10 | — |
| Logic Elements | 25,000 | 25,000 |
| Embedded Memory (Kbits) | 1638 | — |
| User I/O Count | 360 | — |
| Process Technology | 55 nm CMOS | 55 nm non-volatile |
| Core Supply Voltage (VCCINT) | 1.2 V (1.15 V min / 1.25 V max) | — |
| Package | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch | 484-ball Plastic BGA (S-PBGA-B484) |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0 °C to 85 °C (Commercial) | — |
| Speed Grade | -8 | A7 |
| Configuration Memory | On-chip dual-configuration flash | — |
| ADC | Integrated 12-bit ADC (where enabled) | — |
| PLLs | Yes (up to 4 analog PLLs per device) | 2 (general-purpose) |
| RoHS Status | Compliant | Compliant |
| MSL Level | MSL3 | — |
| Number of I/O Banks | 8 (per F484 pinout) | — |
| Series | — | MAX 10 |
| Configurable Logic Blocks (CLBs) | — | 1,563 |
| Embedded Memory | — | 1,728 Kbits |
| Maximum User I/O | — | 360 |
| Package Code | — | BGA |
| Terminal Form | — | Ball |
| Temperature Grade | — | Automotive (-40 C to +125 C TJ) |
| Configuration | — | Internal dual-boot flash (no external PROM) |
| On-chip ADC | — | 1 x 12-bit, 1 MSPS |
| DSP Blocks | — | Up to 25 (18x18 MAC) |
| Supply Voltage | — | 3.3 V or 1.8 V single supply |