10M50DCF256A7G vs 10M50DCF256C8G Comparison

Detailed side-by-side comparison of 10M50DCF256A7G by Intel and 10M50DCF256C8G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10M50DCF256A7G 10M50DCF256C8G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $29.80 $52.85
Family MAX 10 MAX 10
Logic Elements (LE) 50,000 50,000
User Flash Memory 1,677,312 bits 1,677,312 bits
User I/O Count 178 —
Package 256-ball FBGA (F256), 17 x 17 mm, 1.0 mm pitch 256-pin FBGA (FBGA256), 17x17 mm
Process Node 55 nm —
Core Voltage 1.2 V 1.0 V (internal)
I/O Bank Voltages 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V —
Operating Temperature -40 C to +85 C (industrial) —
Speed Grade 7 (DCF = dual-supply, commercial/industrial) 8
Embedded Memory M9K blocks, 9 Kbits each 1,677,312 bits (user flash) + 5,151 Kbits (M9K RAM)
Embedded Multipliers 144 x 18 x 18 —
PLL 4 —
On-chip ADC 12-bit, 1 MSPS, 16 channels —
Configuration Internal flash (single-chip, instant-on) —
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
RoHS Status Compliant Compliant
MSL Level 3 (168 hours) —
DSP Blocks (18x18 Multipliers) — 172
Maximum User I/O Pins — 178
Temperature Grade — Commercial (C suffix)
PLLs — 4
Hard ADC Blocks — 2 (12-bit, 1 MSPS)
Process Technology — TSMC 55 nm embedded flash CMOS
I/O Bank Voltage — 2.5 V / 3.3 V (LVCMOS compatible)
Configuration Method — On-die non-volatile flash (instant-on); dual-boot supported

Datasheets & Resources

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