10M50DCF256A7G - MAX 10 FPGA, 50K LE, 256-FBGA | Intel
MPN: 10M50DCF256A7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $44.87 | $44.87 |
| 10 | $41.2 | $412.00 |
| 100 | $37.55 | $3,755.00 |
| 500 | $33.1 | $16,550.00 |
| 1,000 | $29.8 | $29,800.00 |
Drop-in alternatives for 10M50DCF256A7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M25DCF256A7G
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$42.84 / Unit
View Datasheet →10M16DCF256A7G
✅ Drop-In✓ In Stock
$37.2 / Unit
View Datasheet →10M08DCF256A7G
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View Datasheet →10M04DCF256A7G
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$11.1 / Unit
View Datasheet →10M50DAF256I7G
✅ Drop-In✓ In Stock
$58.5 / Unit
View Datasheet →10M50DAF256C7G
✅ Drop-In📋 Reference alternative (not in catalog)
10M50DCF256A7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 50,000 |
| User Flash Memory | 1,677,312 bits |
| User I/O Count | 178 |
| Package | 256-ball FBGA (F256), 17 x 17 mm, 1.0 mm pitch |
| Process Node | 55 nm |
| Core Voltage | 1.2 V |
| I/O Bank Voltages | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Operating Temperature | -40 C to +85 C (industrial) |
| Speed Grade | 7 (DCF = dual-supply, commercial/industrial) |
| Embedded Memory | M9K blocks, 9 Kbits each |
| Embedded Multipliers | 144 x 18 x 18 |
| PLL | 4 |
| On-chip ADC | 12-bit, 1 MSPS, 16 channels |
| Configuration | Internal flash (single-chip, instant-on) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| MSL Level | 3 (168 hours) |
10M50DCF256A7G 256-ball fbga (f256), 17 x 17 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for 10M50DCF256A7G (256-ball fbga (f256), 17 x 17 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M50DCF256A7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M50DCF256A7G is suitable for 6 applications: Industrial Motor Control and IO-Link Master, Factory Automation PLC and Edge Gateway, Low-Cost Video Processing and Machine Vision, Protocol Bridging (UART/SPI/I2C to Ethernet), System Management and Power Sequencing, ASIC Prototyping and Low-Volume Production.
Industrial Motor Control and IO-Link Master
The 10M50DCF256A7G's 50K LE plus 144 hardware 18x18 multipliers and 4 PLLs make it ideal for industrial motor-control and IO-Link master designs. Its 1.6 Mbit internal flash stores configuration and IO-Link stack without external PROM, and the integrated 12-bit ADC samples current/voltage feedback at 1 MSPS. The 178 user I/O drive PWM outputs, encoders, and opto-isolated field-bus interfaces. Quoted as of 2026-09-05, the part replaces two-tier discrete MCU+CPLD designs at similar cost.
Recommended
Factory Automation PLC and Edge Gateway
In PLC and industrial edge-gateway designs, the 10M50DCF256A7G runs EtherCAT, PROFINET, or Modbus TCP soft-IP stacks in parallel with deterministic control logic, leveraging its 50K LE and M9K memory blocks. The 256-ball FBGA supports 178 GPIO for digital inputs, relay outputs, and isolated serial ports. Internal flash enables instant-on recovery after brownout, critical for industrial control loops. Quartus Prime includes the Nios II soft-core, allowing Linux/RTOS hosting on the same die.
Recommended
Low-Cost Video Processing and Machine Vision
The 10M50DCF256A7G handles 720p video processing, image preprocessing, and feature extraction in low-cost machine vision and smart-camera designs. Its 144 dedicated 18x18 multipliers accelerate convolution kernels, while 50K LE implement Sobel, Canny, and simple CNN inference. LVDS I/O pairs (up to 89) interface directly to image sensors like the Aptina MT9V034 or onsemi Python series. The internal ADC monitors illuminator LED current via current-sense amplifier. As of 2026-09-05, this density tier offers the best LE-per-dollar in the MAX 10 family.
Recommended
Protocol Bridging (UART/SPI/I2C to Ethernet)
For protocol-bridge designs converting legacy UART/SPI/I2C interfaces to Ethernet, Wi-Fi, or USB, the 10M50DCF256A7G provides ample logic to run both the legacy controller and the Tri-Speed MAC or LwIP TCP/IP stack. Its 50K LE accommodate 4-8 UART ports plus 10/100 Ethernet MAC soft-IP. Internal flash stores web server HTML, eliminating external SPI flash. The 1.0 mm pitch FBGA simplifies routing to RJ45/Magnetics and W5500 Ethernet modules. Industrial temperature rating supports cabinet-mount bridge deployments.
Recommended
System Management and Power Sequencing
The integrated 12-bit ADC, 4 PLLs, and 50K LE make the 10M50DCF256A7G a fit for system-management controllers that monitor rails, sequence supplies, and log fault events. The on-chip temperature-sensing diode enables local junction monitoring without an external sensor. Internal flash stores fault logs and configuration in non-volatile memory, surviving brownouts. LVCMOS/LVTTL I/O banks interface directly to PMBus, I2C, and SPI power controllers. Compared to an MCU+ADC approach, this consolidates two chips into one, reducing BOM cost and PCB area.
Recommended
ASIC Prototyping and Low-Volume Production
For ASIC prototyping or low-volume production (under 10K units/year), the 10M50DCF256A7G provides 50K LE of re-spinable logic that an ASIC cannot match in time-to-market. Engineers validate design RTL on MAX 10, then migrate to a structured ASIC for cost-down at higher volumes. Internal flash stores multiple bitstreams for A/B testing or field upgrade, supporting field-programmable design iterations. The 1.0 mm pitch FBGA routes cleanly on 4-layer boards using 0.4 mm trace/space rules, accessible to most commercial PCB fabs.
Recommended
Recommended Products Summary
Engineering reference data for 10M50DCF256A7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M25DCF256A7G | 10M16DCF256A7G | 10M08DCF256A7G | 10M04DCF256A7G | 10M50DAF256I7G | 10M50DAF256C7G |
|---|---|---|---|---|---|---|---|
| Package | 256-ball FBGA (F256), 17x17 mm, 1.0 mm pitch | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements (LE) | 50,000 | 25,000 | 16,000 | 8,000 | 4,000 | 50,000 | 50,000 |
| Embedded User Flash | 1,677,312 bits | 1,677,312 bits | 1,153,920 bits | 737,280 bits | 295,680 bits | 1,677,312 bits | 1,677,312 bits |
| User I/O | 178 | 178 (fewer bonded) | 178 (fewer bonded) | 178 (fewer bonded) | 178 (fewer bonded) | 178 | 178 |
| Supply Configuration | Dual-supply (separate 1.2 V core + I/O rail) | Dual-supply | Dual-supply | Dual-supply | Dual-supply | Single-supply (internal regulator) | Single-supply (internal regulator) |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +100 C | -40 C to +85 C |
| Approximate Unit Price (1k qty, USD) | $29.80 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Pin-to-Pin Compatible with Target | Yes (baseline) | Yes - same F256 ball map | Yes - same F256 ball map | Yes - same F256 ball map | Yes - same F256 ball map | Yes - same F256 ball map | Yes - same F256 ball map |
Key Differentiators
- Highest logic density in MAX 10 family at 50K LE (vs 10M25DCF256A7G)
- Dual-supply option for fine-grained power optimization (vs 10M50DAF256I7G)
- Internal flash configuration eliminates external PROM (vs Cyclone IV EP4CE10F256 (cross-family))
Design Notes
The 256-ball FBGA at 1.0 mm pitch requires non-solder-mask-defined (NSMD) pads with 0.45-0.50 mm diameter and via-in-pad or dog-bone fan-out to inner layers. Estimated: a 4-layer stack-up with 0.4 mm trace/space and 0.2 mm drill can route this part on most commercial PCB fabs (e.g., JLCPCB 4L 1.6 mm). Below 6-layer stack-ups, signal-integrity margins shrink for LVDS pairs, so consider 6 layers for designs with >50 LVDS pairs. Reference the MAX 10 device datasheet pin connection guidelines for VCCIO/VCCA_FPLL decoupling.
The DCF256 variant requires separate 1.2 V VCCINT and 1.2-3.3 V VCCIO rails; sequence VCCINT before VCCIO to avoid latch-up. Place 0.1 uF X7R 0402/0201 bypass caps within 1 mm of every power pin and 10 uF X5R bulk caps per power island. The internal flash configuration pulls an inrush current of up to 50 mA during instant-on; size the 1.2 V LDO for 1.5x the steady-state MAX 10 core current (~100 mA typical at 50 MHz).
Estimated: at typical 50K LE utilization (70% LUTs, 50% RAM, 25% multipliers) toggling at 100 MHz, the 10M50DCF256A7G dissipates approximately 0.5-1.0 W. The 17 x 17 mm FBGA has theta_JA around 25-30 C/W on a JEDEC 4-layer test board (4 thermal vias to inner ground plane). For sealed enclosures with no airflow, derate to 0.5 W max to keep junction below 100 C. Add thermal vias under the central ball grid for improved heat spreading.
Do not confuse DCF (dual-supply) with DAF (single-supply) when ordering - they are not drop-in from a power-tree perspective: DAF uses an internal regulator from a single 3.0/3.3 V rail, while DCF requires an external 1.2 V LDO. Also note that MAX 10 pin compatibility covers F256 ball map but not all lower-density parts bond out the same number of I/Os - check the pin connection guidelines to confirm sufficient GPIO for your design.
Route JTAG (TCK, TMS, TDI, TDO) and AS configuration pins with 50 ohm controlled impedance and length-matched within 25 mm. Keep configuration-related signals (nCONFIG, nSTATUS, CONF_DONE) away from switching I/O edges. The MSL3 moisture sensitivity requires JEDEC J-STD-033 handling: pre-bake at 125 C for 24 hours if the humidity indicator card shows >10% RH, and reflow within 168 hours of floor life.
Compliance Information
RoHS and REACH compliant per Altera/Intel product page. Not AEC-Q100 qualified - use 10M50DAF256I7G for extended industrial temperature but it remains non-automotive. MSL3 moisture sensitivity requires JEDEC J-STD-033 handling.
